Abstract: Embodiments relate to microelectromechanical systems (MEMS) and more particularly to membrane structures comprising pixels for use in, e.g., display devices. In embodiments, a membrane structure comprises a monocrystalline silicon membrane above a cavity formed over a silicon substrate. The membrane structure can comprise a light interference structure that, depending upon a variable distance between the membrane and the substrate, transmits or reflects different wavelengths of light. Related devices, systems and methods are also disclosed.

Abstract: Embodiments relate to microelectromechanical systems (MEMS) and more particularly to membrane structures comprising pixels for use in, e.g., display devices. In embodiments, a membrane structure comprises a monocrystalline silicon membrane above a cavity formed over a silicon substrate. The membrane structure can comprise a light interference structure that, depending upon a variable distance between the membrane and the substrate, transmits or reflects different wavelengths of light. Related devices, systems and methods are also disclosed.

Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual cylindrical points or feet-like elements with straight or concave sidewalls, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

Abstract: A method for producing at least one cavity within a semiconductor substrate includes dry etching the semiconductor substrate from a surface of the semiconductor substrate at at least one intended cavity location in order to obtain at least one provisional cavity. The method includes depositing a protective material with regard to a subsequent wet-etching process at the surface of the semiconductor substrate and at cavity surfaces of the at least one provisional cavity. Furthermore, the method includes removing the protective material at least at a section of a bottom of the at least one provisional cavity in order to expose the semiconductor substrate. This is followed by electrochemically etching the semiconductor substrate at the exposed section of the bottom of the at least one provisional cavity. A method for producing a micromechanical sensor system in which this type of cavity formation is used and a corresponding MEMS are also disclosed.

Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

Abstract: Embodiments relate to MEMS devices and methods for manufacturing MEMS devices. In one embodiment, the manufacturing includes forming a monocrystalline sacrificial layer on a non-silicon-on-insulator (non-SOI) substrate, patterning the monocrystalline sacrificial layer such that the monocrystalline sacrificial layer remains in a first portion and is removed in a second portion lateral to the first portion; depositing a first silicon layer, the first silicon layer deposited on the remaining monocrystalline sacrificial layer and further lateral to the first portion; removing at least a portion of the monocrystalline sacrificial layer via at least one release aperture in the first silicon layer to form a cavity and sealing the cavity.

Abstract: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

Abstract: The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.

Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

Abstract: A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.

Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

Abstract: An expansion anchor with a bolt and at least one expansion element is disclosed. An oblique surface is arranged in the region of the first end of the bolt and forces the expansion element radially outward on the bolt if the bolt is displaced in a pull-out direction relative to the expansion element. The bolt has, in the region of its rear end facing away from the first end, a load-absorber which is suitable for introducing tensile forces which are directed in the pull-out direction into the bolt. At least one groove which is closed with respect to the first end is made in the oblique surface, which groove reduces the contact surface between the expansion element and the oblique surface.

Abstract: An anchor rod is disclosed. The anchor rod includes an attachment region and an anchoring region which is insertable into a borehole and which has a profiled section. The profiled section interacts with a curable organic and/or inorganic mortar compound filled into the borehole. The profiled section includes a plurality of expansion sections disposed axially in a row which are conically shaped. For each of the plurality of expansion sections, a diameter of the expansion section increases in a direction toward a free front end of the anchor rod, a ratio of a distance of the expansion section to a mean borehole diameter is 0.40 to 0.60, a ratio of an outer diameter to a core diameter of the expansion section is 1.35 to 1.55, and a cone angle of the expansion section is 22.5° to 27.5°.

Abstract: An expansion anchor including a stud, at least one expansion element, and at least one slanted surface that is arranged on the stud and that pushes the expansion element radially outwards when the stud is moved in a pull-out direction relative to the expansion element is provided. It is provided that the coefficient of friction between the expansion element and the slanted surface is dependent on the direction.

Abstract: An expansion anchor including a stud and at least one expansion element arranged on the stud, whereby the stud has a slanted surface that pushes the expansion element radially outwards when the stud is moved in a pull-out direction, relative to the expansion element is provided. It is provided that the expansion anchor has at least one swelling element consisting of a swellable compound that can swell in order to secure the expansion element onto the wall of a drilled hole in the pull-out direction.

Abstract: An expansion anchor for anchoring in a drilled hole in a substrate, including a bolt with a front end and a rear end opposite the front end, an expansion sleeve arranged on the bolt, an expansion cone pressing the expansion sleeve radially outward when the expansion cone is displaced in an extraction direction relative to the expansion sleeve, a counter bearing for axially pressing an attachment part to the substrate, and arranged in the region of the rear end of the bolt, and a spring element arranged on the bolt for axially tensioning the counter bearing against the attachment part. The axial spring force F of the spring element lies in the range from Fmin<Fmax where Fmin=dmax×0.2 kN/mm?0.8 kN Fmax=dmax×0.6 kN/mm if the spring element is axially slackened 0.4 mm to 0.8 mm from its maximum spring deflection.

Abstract: An expansion anchor is provided having a stud and at least one expansion sleeve that surrounds the stud, whereby, on the stud, there is an expansion cone that radially widens the expansion sleeve when the expansion cone is pulled into the expansion sleeve. It is provided that the expansion sleeve has a hardness of more than 350 HV in the area of its front end facing the expansion cone, whereby the hardness of the expansion sleeve decreases towards its rear end. A production method for such an expansion anchor is also provided.

Abstract: The invention relates to an artificial vascular graft comprising a primary scaffold structure encompassing an inner space of the artificial vascular graft, said primary scaffold structure having an inner surface facing towards said inner space and an outer surface facing away from said inner space, a coating on said inner surface, wherein a plurality of grooves is comprised in said coating of said inner surface. The primary scaffold structure comprises further a coating on said outer surface. The primary scaffold structure and the coating on said inner surface and on said outer surface are d designed in such a way that cells, in particular progenitor cells, can migrate from the periphery of said artificial vascular graft through said outer surface of said coating, said primary scaffold structure and said inner surface to said inner space, if the artificial vascular graft is used as intended. The invention relates further to a method for providing said graft.

Abstract: A method for the self-assembled production of a topographically surface structured cellulose element. First, a mold is provided having on one side a first surface which is in a complementary manner topographically structured and which is permeable to oxygen. Next, a liquid growth medium containing cellulose producing bacteria is provided. Then, the mold is placed to form a interface such that the side of the mold with the first surface is in direct contact with the liquid growth medium, and an opposite side is facing air or a specifically provided oxygen containing gas surrounding. This allows bacteria to be produced and deposit cellulose on the first surface and developing on the interface a surface structured surface complementary thereto, until a cellulose layer with a thickness of the element of at least 0.3 mm is formed. Finally; the element is removed from the mold.