Abstract: An information handling system communicates information across a physical link with high and low signal values sent at a unit interval. Feed forward equalization improves signal transfer with pre-emphasis of low-to-high signals and de-emphasis of high-to-low signals lasting for a fraction of the unit interval, such as one-half or one-quarter of the unit interval. Fractional unit interval pre-emphasis and de-emphasis reduce inter symbol interference to improve frequency domain eye structure at the physical link receiver.

Abstract: A circuit board pad connector system includes a connector that is configured to mount to a connector pad that is included on a circuit board. The connector includes a connector lead frame. A lead portion is provided on the connector lead frame such that the lead portion is oriented substantially perpendicularly relative to the connector pad when the connector is mounted to the connector pad. A first mounting portion is provided on the connector lead frame, is configured to mount the connector to the connector pad, and extends in a first direction that is substantially perpendicular relative to the lead portion. A second mounting portion is provided on the connector lead frame, is configured to mount the connector to the connector pad, and extends in a second direction that is different than the first direction and that is substantially perpendicular relative to the lead portion.

Abstract: A memory subsystem includes one or more communication channels that enable communication with more than one memory module of an information handling system (IHS). A memory controller of the memory subsystem is in communication with the one or more communication channels. In response to determining that one or more lines fail signal integrity testing at a target communication speed, the memory controller invokes an error checking and correcting (ECC) mode that reassigns lines of the communication channel for carrying data and ECC code. Lines that passed signal integrity testing are assigned to carrying data and ECC code. Lines that failed signal integrity testing are not used.

Abstract: A differential pair group equalization system includes a board providing a differential trace pair group with a plurality of differential trace pairs, each of a transmitter device and a receiver device are coupled to the board and the differential trace pairs in the differential trace pair group. At least one of the transmitter device and the receiver device operates to identify a first differential trace pair in the differential trace pair group, and adjust second differential trace pair equalization parameters for a second differential trace pair in the differential trace pair group. If it is determined that first differential trace pair signal transmission capabilities for the first differential trace pair have improved in response to the adjustment of the second differential trace pair equalization parameters for the second differential trace pair the second differential trace pair equalization parameters are set for the second differential trace pair.

Abstract: A printed circuit board (PCB) includes a plurality of layers and electronic components connected to its top surface. The PCB also includes a plurality of trace layers, each located at a respective depth within the layers of the PCB. A plurality of vias provide signal pathways for the trace layer. Upon their manufacture, the vias include a stub portion not necessary for the signal pathways and causing degradation of the integrity of these signal pathways. Embodiments mill the bottom of the PCB to form a variable-depth cavity. The different milling depths of the variable-depth cavity are selected to remove the stub portions of the plurality of vias and the dielectric material between the stubs. By configuring the PCB power planes as the topmost trace layers, decoupling capacitors may be located at the greatest depth of the variable-depth cavity, thus reducing the loop inductance in the power circuit of the PCB.

Abstract: In accordance with embodiments of the present disclosure, a connector may include a housing and an electrically-conductive pin housed in the housing and configured to electrically couple to a corresponding electrically-conductive conduit of an information handling resource comprising the connector. The pin may include a beam extending from the housing and a stub terminating the pin, the stub having a per-unit-length surface area greater than that of the beam.

Abstract: An information handling system includes a memory that stores code, and a processor that executes code stored in memory to derive a distribution of impedances for parameters of a trace within a printed circuit board (PCB). The processor further to determine impedance corners of the distribution of impedances, to select the impedance corners as first, second, and third trace models, and to derive first, second, and third distribution of losses based on the first, second, and third trace models. The processor further to store loss corners of the first, second, and third distribution of losses as modeling points, and to determine whether all of modeling points pass within tolerance levels of loss and impedance of the trace.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may determine that a first memory unit (MU) and a second MU of a first channel of a memory module are associated with an issue; may configure a control device to utilize a third MU in place of the first MU; and may configure the control device to utilize a fourth MU, of a second channel of the memory module, in place of the second MU. In one or more embodiments, multiple MUs of the first channel, other than the first and second MUs, may store a first portion of data; the fourth MU may store a second portion of the data; the multiple MUs, other than the first and second MUs, may provide the first portion of the data to a processor; and the fourth MU may provide the second portion of the data to the processor.

Abstract: A stubbed differential trace pair system includes a circuit board having a first differential trace pair with a first trace and a second trace, and a second differential trace pair with a third trace and a fourth trace, where the first trace located opposite the second trace and the third trace from the fourth trace. Second trace stubs extend in a spaced apart orientation relative to each other and from a side of the second trace that is opposite the second trace from the first trace. Third trace stubs extend in a spaced apart orientation relative to each other and from a side of the third trace that is opposite the third trace from the fourth trace. The second trace stubs and the third trace stubs are configured to reduce crosstalk generated by the transmission of signals through the first differential trace pair and the second differential trace pair.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may determine that a first memory unit (MU) and a second MU of a first channel of a memory module are associated with an issue; may configure a control device to utilize a third MU in place of the first MU; and may configure the control device to utilize a fourth MU, of a second channel of the memory module, in place of the second MU. In one or more embodiments, multiple MUs of the first channel, other than the first and second MUs, may store a first portion of data; the fourth MU may store a second portion of the data; the multiple MUs, other than the first and second MUs, may provide the first portion of the data to a processor; and the fourth MU may provide the second portion of the data to the processor.

Abstract: A circuit board pad mounting orientation system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. At least one connector pad receives the signal transmission line adjacent a first end of that connector pad. At least one connector pad includes a second end that provides a reduction in a width of that connector pad to indicate a mounting orientation for coupling to the connector pad that receives the signal transmission line. In a specific example, a first connector pad receives the signal transmission line, includes the first end, and includes the second end that is opposite the first connector pad from the first end and that provides the reduction in the width of the first connector pad to indicate the mounting orientation for coupling to the first connector pad.

Abstract: A differential trace pair system includes a board having a first, a second, a third, and a fourth board structure member. A differential trace pair in the board includes a first differential trace extending between the first and the third board structure members, and a second differential trace extending between the second and the fourth board structure members. The differential trace pair includes a serpentine region that includes a first portion and a second portion where the first and the second differential traces have a first width, are substantially parallel, and spaced apart by a first differential trace pair spacing, and a third portion in which the second differential trace includes a second width that is greater than the first width, the first and second differential traces are substantially parallel and spaced apart by a second differential trace pair spacing that is greater than the first differential trace pair spacing.

Abstract: A dual-channel Dual In-Line Memory Module (DIMM) is configured to provide memory transactions on a first memory channel and a second memory channel. The dual-channel DIMM includes a first bank of Dynamic Random Access Memory (DRAM) devices configured to provide a first memory transaction on the first memory channel, a second bank of DRAM devices configured to provide a second memory transaction on the second memory channel, and a plurality of back door communication paths, each back door communication path being between a data bit of the first bank of DRAM devices and a corresponding data bit of the second bank of DRAM devices.

Abstract: A high-speed serial data system includes a transmitter and a receiver. The receiver includes a compensation module, a memory, and a control module. The compensation module includes a setting that selects a compensation value from among a plurality of compensation values for a characteristic of the receiver. The memory stores a whitelist value from among the compensation values. The control module determines that a performance level of the receiver is below a performance level threshold. In response to determining that the performance level is below the performance level threshold, the control module uses the whitelist value to reevaluate the performance level of the receiver, and applies the whitelist value to the compensation module when the reevaluated performance level is above the performance level threshold.

Abstract: An oscilloscope system includes a chassis with an input signal port and a display system located on the chassis that are both coupled to a measurement engine. The measurement engine captures, via an input signal probe that is coupled to the input signal port and a device under test, a first output test pattern that is generated by the device under test in response to a first input test pattern that is received from a transmitter device. The measurement engine derives, using the first input test pattern, a transfer function for the device under test. The measurement engine captures a second input test pattern that is received from the transmitter device and that is different than the first input test pattern and mathematically convolutes, using the second input test pattern, the transfer function for the device under test to generate a reference measurement.

Abstract: A circuit board pad resonance control system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. A first connector pad receives the signal transmission line adjacent a first end of that connector pad. The first connector pad includes a mounting surface that mounts directly to a coupling element that is configured to couple a subsystem to the board, and reduces a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. In a specific example, the mounting surface may include a plurality of protrusions, a plated surface, and/or a mask that reduces the conductivity of the connector pad which reduces signal integrity issues due to resonance.

Abstract: A differential trace pair system includes a first conductive layer that is located immediately adjacent a first insulating layer. The system includes a second conductive layer that is located immediately adjacent the first insulating layer and opposite the first insulating layer from the first conductive layer, and includes an aperture that extends through the second conductive layer. A second insulating layer is located immediately adjacent the second conductive layer and opposite the second conductive layer from the first insulating layer. The system includes a first differential trace pair that is included in the second insulating layer and that includes a first differential trace that is positioned adjacent the aperture and references the second conductive layer, and a second differential trace that is longer than the first differential trace and that includes a first portion that is positioned adjacent the second conductive layer aperture and references the first conductive layer.

Abstract: A dual axial cable is provided with adjacent and substantially parallel first and second wires. Each wire is formed from electrical conductor surrounded by a respective first and second electrical insulator having lengthwise drain alignment groove on outward side and having respective first and second inward sides of interlocking structure. First and second inward sides of interlocking structure of first and second electrical insulators mutually engage to prevent relative transverse displacement of first and second wires. The interlocking structure maintains the planar alignment of lengthwise drain alignment grooves and electrical conductors of first and second wires. First and second drain conductors are received respectively in lengthwise drain alignment grooves of first and second electrical insulators and run adjacent and substantially parallel to first and second electrical conductors. Drain conductors are maintained in parallel alignment to electrical conductors to provide shielding benefits.

Abstract: A method includes attaching an adjacent pair of differential contact strips to a nonconductive surface of respective landing pads of a surface mount technology (SMT) pad structure of a circuit board substrate, the pair of differential contact strips having converging narrowing at a respective distal end and each having a proximal signal trace for conducting a high-speed communication signal to another functional component attached to a circuit board substrate. The method includes attaching a return current strip that is longitudinally aligned adjacent to the pair of differential contact strips on a first lateral side and connected to a ground plane of the circuit board substrate, the converging narrowing of the adjacent differential contact strip increasing separation from a distal end of the return current strip, the separation improving signal integrity by reducing fringe effects, increasing impedance, and quenching resonance.

Abstract: An information handling system includes a first Dual In-Line Memory Module (DIMM) on a first memory channel of the information handling system, and a second DIMM on a second memory channel of the information handling system. A processor trains the first memory channel to a first speed based upon a first performance level of the first DIMM, trains the second memory channel to a second speed based upon a second performance level of the second DIMM, and allocates a portion of the first DIMM to the application based upon the first speed.