Patents by Inventor Carl Edmond Sullivan
Carl Edmond Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11416193Abstract: A physical unclonable function (“PUF”) object can be used to encode the geography or region in which device to which the PUF is attached may operate. Disclosed are two potential ways to regionalize a device using a PUF disk: placing the magnetic sensor at a different radius depending on the region or geography intended for sale; and altering the magnetic structure of the disk to magnetically encode the region into the sensor data.Type: GrantFiled: March 18, 2020Date of Patent: August 16, 2022Assignee: Lexmark International, Inc.Inventors: Scott Richard Castle, Gary Allen Denton, Robert Henry Muyskens, Samuel Leo Rhodus, Brant Dennis Nystrom, Carl Edmond Sullivan
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Publication number: 20220176727Abstract: In the invention described, a method of creating a unique tag or labeling system for electronic printed circuit board assemblies (PCBA) that is unique, virtually un-duplicatable, and may be altered when the electronics are tampered with.Type: ApplicationFiled: December 4, 2021Publication date: June 9, 2022Inventors: JAMES HOWARD ELLIS, KEITH BRYAN HARDIN, ROBERT HENRY MUYSKENS, MITCHELL RAY ROWLETTE, CARL EDMOND SULLIVAN
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Publication number: 20210334052Abstract: A physical unclonable function (“PUF”) object can be used to encode the geography or region in which device to which the PUF is attached may operate. Disclosed are two potential ways to regionalize a device using a PUF disk: placing the magnetic sensor at a different radius depending on the region or geography intended for sale; and altering the magnetic structure of the disk to magnetically encode the region into the sensor data.Type: ApplicationFiled: March 18, 2020Publication date: October 28, 2021Inventors: SCOTT RICHARD CASTLE, GARY ALLEN DENTON, ROBERT HENRY MUYSKENS, SAMUEL LEO RHODUS, BRANT DENNIS NYSTROM, CARL EDMOND SULLIVAN
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Patent number: 8968527Abstract: Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.Type: GrantFiled: February 16, 2010Date of Patent: March 3, 2015Assignee: Funai Electric Co., LtdInventors: Yimin Guan, Stuart Jacobsen, Carl Edmond Sullivan
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Patent number: 8642249Abstract: Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.Type: GrantFiled: July 23, 2010Date of Patent: February 4, 2014Assignee: Funai Electric Co., Ltd.Inventors: Frank E Anderson, Yimin Guan, Carl Edmond Sullivan, Timothy Lowell Strunk
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Patent number: 8430482Abstract: A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged to seamlessly stitch together fluid ejections from adjacent chips. Each chip aligns with other chips at peripheral regions having edge tolerances closer than elsewhere along the periphery. The tolerances result from both etching and dicing during chip singulation. Etching occurs at the areas of alignment. Dicing occurs elsewhere. Etching techniques include deep reactive ion etching or wet etching. It cuts a planar periphery through an entire thickness of the wafer. The etching may also occur simultaneously with etching a fluid via. Dicing techniques include blade, laser or ion beam. It cuts an entire remainder of the periphery connecting the portions already etched to free single chips from the wafer. Edge tolerances, planar shapes, dicing lines, etch patterns, and wafer layout provide still further embodiments.Type: GrantFiled: September 29, 2010Date of Patent: April 30, 2013Assignee: Lexmark International, Inc.Inventors: Jiandong Fang, Carl Edmond Sullivan, Richard E. Corley
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Patent number: 8366245Abstract: A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.Type: GrantFiled: December 29, 2008Date of Patent: February 5, 2013Assignee: Lexmark International, Inc.Inventors: Yimin Guan, Burton Lee Joyner, II, Zachary Justin Reitmeier, Carl Edmond Sullivan
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Publication number: 20120075383Abstract: A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged to seamlessly stitch together fluid ejections from adjacent chips. Each chip aligns with other chips at peripheral regions having edge tolerances closer than elsewhere along the periphery. The tolerances result from both etching and dicing during chip singulation. Etching occurs at the areas of alignment. Dicing occurs elsewhere. Etching techniques include deep reactive ion etching or wet etching. It cuts a planar periphery through an entire thickness of the wafer. The etching may also occur simultaneously with etching a fluid via. Dicing techniques include blade, laser or ion beam. It cuts an entire remainder of the periphery connecting the portions already etched to free single chips from the wafer. Edge tolerances, planar shapes, dicing lines, etch patterns, and wafer layout provide still further embodiments.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Inventors: JIANDONG FANG, CARL EDMOND SULLIVAN, RICHARD E. CORLEY
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Patent number: 8087756Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.Type: GrantFiled: May 6, 2011Date of Patent: January 3, 2012Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Patent number: 8070265Abstract: A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.Type: GrantFiled: December 30, 2008Date of Patent: December 6, 2011Assignee: Lexmark International, Inc.Inventors: Yimin Guan, Zachary Justin Reitmeier, Carl Edmond Sullivan
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Patent number: 8061811Abstract: Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.Type: GrantFiled: September 28, 2006Date of Patent: November 22, 2011Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, Jeanne Marie Saldanha Singh, Carl Edmond Sullivan, Sean Terrence Weaver
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Patent number: 8029100Abstract: Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.Type: GrantFiled: April 22, 2010Date of Patent: October 4, 2011Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, Jeanne Marie Saldanha Singh, Carl Edmond Sullivan, Sean Terrence Weaver
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Publication number: 20110205305Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.Type: ApplicationFiled: May 6, 2011Publication date: August 25, 2011Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Patent number: 7938513Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.Type: GrantFiled: April 11, 2008Date of Patent: May 10, 2011Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Patent number: 7922297Abstract: A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.Type: GrantFiled: December 18, 2007Date of Patent: April 12, 2011Assignee: Lexmark International, Inc.Inventors: Yimin Guan, Kristi Maggard Rowe, Timothy Lowell Strunk, Carl Edmond Sullivan
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Publication number: 20100285411Abstract: Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.Type: ApplicationFiled: July 23, 2010Publication date: November 11, 2010Inventors: Frank E. Anderson, Yimin Guan, Carl Edmond Sullivan, Timothy Lowell Strunk
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Publication number: 20100199497Abstract: Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.Type: ApplicationFiled: April 22, 2010Publication date: August 12, 2010Inventors: Frank Edward Anderson, Jeanne Marie Saldanha Singh, Carl Edmond Sullivan, Sean Terrence weaver
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Publication number: 20100165056Abstract: A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.Type: ApplicationFiled: December 30, 2008Publication date: July 1, 2010Inventors: Yimin Guan, Zachary Justin Reitmeier, Carl Edmond Sullivan
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Publication number: 20100165054Abstract: A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.Type: ApplicationFiled: December 29, 2008Publication date: July 1, 2010Inventors: Yimin Guan, Burton Lee Joyner, II, Zachary Justin Reitmeier, Carl Edmond Sullivan
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Patent number: 7673972Abstract: Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.Type: GrantFiled: March 8, 2007Date of Patent: March 9, 2010Assignee: Lexmark International, Inc.Inventors: Yimin Guan, Stuart Jacobsen, Carl Edmond Sullivan