Abstract: An imageable support matrix for printhead nozzle plates and a method for manufacturing the printhead. The ink jet printhead comprises a substrate including an ink via therein; a first layer of imageable material, the first layer of imageable material having ink conducting voids therein and defining support structures adjacent the ink via; and a second layer of imageable material disposed on the first layer of imageable material, the second layer of imageable material including ink jet nozzles therein. The method includes providing a substrate; applying a first layer of imageable material on the substrate; masking the applied first layer of imageable material; and developing the masked first layer of imageable material to provide ink conducting voids in the first layer of imageable material and hardened areas of support.

Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.

Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

Abstract: The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

Abstract: The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer.

Abstract: The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.

Abstract: The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying an etch stop layer to a first surface of the silicon chip having a thickness ranging from about 300 to about 800 microns, dry etching individual ink vias through the thickness of the silicon chip up to the etch stop layer from a surface opposite the first surface and forming holes in the etch stop layer to individually fluidly connect with the ink vias using a mechanical technique. Substantially vertical wall vias are etched through the thickness of the silicon chip using the method. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.

Abstract: A cartridge body contains one or more printheads on a first surface thereof and one or more connection apertures in flow communication with the one or more printheads, each aperture having an opening on a second surface opposite the first surface, and one or more separate ink filtration devices, each having an ink outlet port connected to the second surface of the cartridge body through an opening so that each ink outlet port is in flow communication with at least one connection aperture. The separate devices enable production of a cartridge body made of a material which is effective for removing heat from the printheads.

Abstract: The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

Abstract: The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.

Abstract: An integrated nozzle plate having a heater chip and nozzles, firing chambers and channels formed from several layers of resist material affixed to the heater chip. The nozzles, firing chambers and channels are formed in the resist material using a photolithographic method. The photolithographic method involves placing a negative resist layer directly on a silicon wafer heater chip. A protective layer is then placed on top of the negative resist layer to act as a mask. A positive resist layer is then placed on top of the protective layer. A first mask is placed on the positive resist layer. The integrated nozzle plate is then exposed to ultraviolet light and the positive resist layer is developed. The protective layer not covered by the positive resist layer is removed and a second negative resist layer is deposited thereon. A second mask is placed on the second negative resist layer. The first and second negative resist layers are exposed to ultraviolet light and the negative resist layers are developed.

Abstract: A filter is provided for filtering contaminants from a fluid passing through the filter. The filter comprises a silicon substrate having opposing first and second surfaces and a passage extending through it. A first etch resistant material layer is formed on the first substrate surface and includes at least one opening which extends through the first layer and communicates with the substrate passage. A second etch resistant material layer is formed on the second substrate surface and includes a plurality of pores which extend through the second layer and communicate with the substrate passage. The second layer defines a filter layer which filters contaminants from fluid passing through the second layer. A process for forming the filter is also provided.

Abstract: A heater chip module is provided comprising a carrier adapted to be secured directly to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes inner side walls and a support section which together define an inner cavity. An edge feed heater chip is coupled to the carrier support section. The heater chip includes side walls. The support section includes first and second passages which define first and second paths for ink to travel from the container to the inner cavity. The inner cavity and the heater chip are sized such that a first side wall of the heater chip is spaced from a first inner side wall of the carrier and a second side wall of the heater chip is spaced from a second inner side wall of the carrier. A nozzle plate is coupled to the heater chip and the carrier. The nozzle plate has a width such that the nozzle plate extends over an outer surface of the carrier.

Abstract: An ink jet heater chip is provided having an integral filter for filtering contaminants from a fluid passing through the filter. The heater chip comprises a silicon substrate having opposing first and second surfaces and a passage extending through it. A first etch resistant material layer is formed on the first substrate surface and includes at least one opening which extends through the first layer and communicates with the substrate passage. A second etch resistant material layer is formed on the second substrate surface and includes a portion having a plurality of pores which extend through the second layer and communicate with the substrate passage. The portion of the second layer defines the filter which filters contaminaints from ink passing through the filter. A process for forming the heater chip is also provided.

Abstract: A silicon ink filter for a heater chip of an ink jet printhead is formed by micromachining and laser drilling. The heater chip may contain a plurality of such filters for the plurality of nozzles of the printhead. The filter comprises a via constituting an ink entrance area formed by micromachining and a plurality of bores formed at the exit side of the via produced by laser drilling. Protective layers are preferably disposed over the heater chip substrate prior to micromachining and laser drilling.

Abstract: A system for cooling an inkjet print head with the print head having a nozzle plate and heater chip. The nozzle plate contains a series of firing chambers and nozzles. The heater chip contains several heating elements and cooling channels. Ink is heated in the firing chambers and forced through the nozzles onto paper. A pump is employed to pump the ink from an ink reservoir through the cooling channels in the heater chip in order to maintain the heater chip at a constant temperature. When the printer is actively printing, at least a portion of the ink is returned to the reservoir. When the printer is not actively printing, ink is still pumped through the cooling channels to maintain the heater chip at the proper temperature.

Abstract: A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support section provided with two or more channels which define paths for ink to travel from the container to the heater chip. The heater chip is secured at its base to the support section. Carrier material located between the channels define ribs which provide a path for energy in the form of heat to travel from the heater chip to the carrier. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

Abstract: A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.