Patents by Inventor Carl Edmond Sullivan
Carl Edmond Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090256891Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Publication number: 20090153622Abstract: A silicon chip has a plurality of inkjetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.Type: ApplicationFiled: December 18, 2007Publication date: June 18, 2009Inventors: Yimin Guan, Kristi Maggard Rowe, Timothy Lowell Strunk, Carl Edmond Sullivan
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Publication number: 20080165227Abstract: Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.Type: ApplicationFiled: March 8, 2007Publication date: July 10, 2008Applicant: Lexmark International, Inc.Inventors: Yimin Guan, Stuart Jacobsen, Carl Edmond Sullivan
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Publication number: 20080115359Abstract: A thin film heater for a micro-fluid ejection head and methods for making the thin film heater and for making micro-fluid ejection heads containing the thin film heater. In one embodiment, a thin film heater comprises a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys. A sheet resistance of the thin film heater ranges from about 100 to about 600 ohms per square. The thin film heater has a thickness ranging from about 100 to about 800 Angstroms and exhibits improved aluminum/silicon diffusion barrier properties.Type: ApplicationFiled: November 21, 2006Publication date: May 22, 2008Inventors: Yimin Guan, Carl Edmond Sullivan
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Publication number: 20080079776Abstract: Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.Type: ApplicationFiled: September 28, 2006Publication date: April 3, 2008Inventors: Frank Edward Anderson, Jeanne Marie Saldanha Singh, Carl Edmond Sullivan, Sean Terrence Weaver
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Publication number: 20070296767Abstract: Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.Type: ApplicationFiled: June 27, 2006Publication date: December 27, 2007Inventors: Frank E. Anderson, Yimin Guan, Carl Edmond Sullivan, Timothy Lowell Strunk
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Patent number: 7273266Abstract: A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.Type: GrantFiled: April 14, 2004Date of Patent: September 25, 2007Assignee: Lexmark International, Inc.Inventors: John William Krawczyk, Andrew Lee McNees, James Michael Mrvos, Carl Edmond Sullivan
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Patent number: 7267431Abstract: A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.Type: GrantFiled: June 30, 2004Date of Patent: September 11, 2007Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, Jeffery James Buchanan, Curtis Ray Droege, David Emerson Greer, Kin Ming Kwan, Gregory Alan Long, Ganesh Vinayak Phatak, Paul Timothy Spivey, Carl Edmond Sullivan, Kent Lee Ubellacker, Melissa Marie Waldeck
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Patent number: 6902867Abstract: The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.Type: GrantFiled: October 2, 2002Date of Patent: June 7, 2005Assignee: Lexmark International, Inc.Inventors: Eric Spencer Hall, Shauna Marie Leis, Andrew Lee McNees, James Michael Mrvos, James Harold Powers, Carl Edmond Sullivan
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Patent number: 6890065Abstract: An ink jet printhead assembly includes a heater chip having a backside with at least one cavity. A substrate is associated with the backside of the heater chip. Adhesive is at least partially disposed within the at least one cavity. The adhesive adheres the backside of the heater chip to the substrate.Type: GrantFiled: July 25, 2000Date of Patent: May 10, 2005Assignee: Lexmark International, Inc.Inventors: Paul Timothy Spivey, Carl Edmond Sullivan, Kent Lee Ubellacker
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Patent number: 6820959Abstract: The invention described in the specification relates to an improved ink jet printer cartridge structure which includes a substrate carrier or nose piece upon which semiconductor devices for ink jet printheads are mounted. The substrate carrier has a top surface containing one or more substrate locator wells each well having well walls, a well base and at least one ink feed slot in each well base and side walls attached to the top surface along the perimeter thereof. One or more of the side walls contain fins for heat removal from the substrate carrier and at least two alignment devices attached adjacent at least one of the side walls for precisely aligning the substrate carrier in a printer carriage.Type: GrantFiled: June 3, 1998Date of Patent: November 23, 2004Assignee: Lexmark International, In.cInventors: Donald Norman Spitz, Carl Edmond Sullivan, David Amos Ward, Benjamin Alan Askren, Michael David Lattuca, Ashok Murthy, Ronald Monroe Nowell, Jr., Darrin Wayne Oliver
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Patent number: 6796019Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.Type: GrantFiled: June 10, 2002Date of Patent: September 28, 2004Assignee: Lexmark International, Inc.Inventors: Steven Robert Komplin, Ashok Murthy, Carl Edmond Sullivan
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Publication number: 20040135841Abstract: An imageable support matrix for printhead nozzle plates and a method for manufacturing the printhead. The ink jet printhead comprises a substrate including an ink via therein; a first layer of imageable material, the first layer of imageable material having ink conducting voids therein and defining support structures adjacent the ink via; and a second layer of imageable material disposed on the first layer of imageable material, the second layer of imageable material including ink jet nozzles therein. The method includes providing a substrate; applying a first layer of imageable material on the substrate; masking the applied first layer of imageable material; and developing the masked first layer of imageable material to provide ink conducting voids in the first layer of imageable material and hardened areas of support.Type: ApplicationFiled: December 19, 2003Publication date: July 15, 2004Applicant: Lexmark International, Inc.Inventors: Carl Edmond Sullivan, Herbert Gordon Toews
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Publication number: 20040067446Abstract: The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.Type: ApplicationFiled: October 2, 2002Publication date: April 8, 2004Inventors: Eric Spencer Hall, Shauna Marie Leis, Andrew Lee McNees, James Michael Mrvos, James Harold Powers, Carl Edmond Sullivan
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Patent number: 6684504Abstract: An imageable support matrix for printhead nozzle plates and a method for manufacturing the printhead. The ink jet printhead comprises a substrate including an ink via therein; a first layer of imageable material, the first layer of imageable material having ink conducting voids therein and defining support structures adjacent the ink via; and a second layer of imageable material disposed on the first layer of imageable material, the second layer of imageable material including ink jet nozzles therein. The method includes providing a substrate; applying a first layer of imageable material on the substrate; masking the applied first layer of imageable material; and developing the masked first layer of imageable material to provide ink conducting voids in the first layer of imageable material and hardened areas of support.Type: GrantFiled: April 9, 2001Date of Patent: February 3, 2004Assignee: Lexmark International, Inc.Inventors: Carl Edmond Sullivan, Herbert Gordon Toews, III
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Patent number: 6668445Abstract: A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.Type: GrantFiled: January 11, 2000Date of Patent: December 30, 2003Assignee: Lexmark International, Inc.Inventors: James Michael Mrvos, Michael Raulinaitis, Carl Edmond Sullivan
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Patent number: 6629756Abstract: The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer.Type: GrantFiled: February 20, 2001Date of Patent: October 7, 2003Assignee: Lexmark International, Inc.Inventors: Qing-Ming Wang, Carl Edmond Sullivan, James Harold Powers
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Patent number: 6613687Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.Type: GrantFiled: March 28, 2001Date of Patent: September 2, 2003Assignee: Lexmark International, Inc.Inventors: Brian Christopher Hart, James Michael Mrvos, Carl Edmond Sullivan, Gary Raymond Williams, Qing Ming Wang
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Patent number: 6550893Abstract: The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.Type: GrantFiled: January 14, 2002Date of Patent: April 22, 2003Assignee: Lexmark International, Inc.Inventors: James Michael Mrvos, Carl Edmond Sullivan
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Publication number: 20020152607Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base s coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.Type: ApplicationFiled: June 10, 2002Publication date: October 24, 2002Inventors: Steven Robert Komplin, Ashok Murthy, Carl Edmond Sullivan