Patents by Inventor Chang Youn Kim
Chang Youn Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11982013Abstract: A raw material feed hopper according to the present embodiment may include a hollow tube having a raw material accommodating space formed therein, a supporter supporting the hollow tube, a cone accommodated in the raw material accommodating space so as to be able to lift up and down, a rod connected to the cone, a connector connected to an upper portion of the rod, a lifting rod connected to the connector, and an elevator installed on the supporter for lifting up and down the lifting rod.Type: GrantFiled: May 28, 2021Date of Patent: May 14, 2024Assignee: SK SILTRON CO., LTD.Inventors: Sang Heon Lee, Chang Youn Lee, Cheol Hwan Kim
-
Patent number: 11978829Abstract: A display device including a circuit board, and pixels each including a light emitting structure including epitaxial stacks and having a light emitting area defined by the epitaxial stacks, an encapsulating member covering a side surface and an upper surface of the light emitting structure, bump electrodes disposed on the light emitting structure, at least a portion of each bump electrode overlapping with the light emitting area, and fan-out lines disposed on the encapsulating member and electrically connected to the light emitting structure through the bump electrodes, in which at least a first portion of a surface of the fan-out lines is exposed to the outside to receive electrical signal for independent driving of the light emitting structure, and the first portion of the fan-out lines does not overlap the light emitting area in a plan view.Type: GrantFiled: November 3, 2022Date of Patent: May 7, 2024Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Min Jang, Chang Youn Kim
-
Patent number: 11937484Abstract: A display device and method of manufacturing same includes: a display panel having a pixel area and a peripheral area adjacent to the pixel area, a light control layer disposed on the display panel and at least partially overlapping the pixel area, a light blocking portion at least partially overlapping the peripheral area, and a protective layer disposed between the light control layer and the light blocking portion.Type: GrantFiled: May 19, 2022Date of Patent: March 19, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Keunwoo Park, Min-Jae Kim, Min-Hee Kim, Taehoon Kim, DoKyung Youn, Chang-Hun Lee
-
Patent number: 11935990Abstract: A light emitting diode including a side reflection layer. The light emitting diode includes: a semiconductor stack and a light exit surface having a roughened surface through which light generated from an active layer is emitted; side surfaces defining the light exit surface; and a side reflection layer covering at least part of the side surfaces. The light exit surface is disposed over a first conductivity type semiconductor layer opposite to the ohmic reflection layer, all layers from the active layer to the light exit surface are formed of gallium nitride-based semiconductors, and a distance from the active layer to the light exit surface is 50 ?m or more.Type: GrantFiled: November 29, 2021Date of Patent: March 19, 2024Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chae Hon Kim, Chang Youn Kim, Jae Hee Lim
-
Publication number: 20240079388Abstract: A light module including a base substrate having a front surface, first and second electrodes disposed on the front surface, first and second emitters disposed on the front surface, a first molding covering the first emitter, and a second molding layer covering the second emitter, in which the first and second electrodes include a first region and a second region exposed from the base substrate, and an embedded region between the first region and the second region and not exposed to the outside, and a distance between the second region of the first electrode is connected to the first emitter and the second region of the second electrode connected to the second emitter is shorter than a distance between the first region of the first electrode connected to the first emitter and the first region of the second electrode connected the second emitter.Type: ApplicationFiled: October 30, 2023Publication date: March 7, 2024Inventors: Jong Min JANG, Chang Youn KIM
-
Publication number: 20230411571Abstract: A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.Type: ApplicationFiled: September 5, 2023Publication date: December 21, 2023Inventors: Jong Min JANG, Chang Youn KIM
-
Patent number: 11804476Abstract: A light emitting device module including a printed circuit board, upper and lower electrodes disposed on opposing surfaces of the printed circuit board, light emitting devices configured to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting devices, in which each light emitting device includes a light emitting structure, a substrate disposed on the light emitting structure, and bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers side surfaces of the substrates, a number of the lower electrodes is less than a number of the bump electrodes of the plurality of light emitting devices, and each of the light emitting devices is configured to be driven independently.Type: GrantFiled: September 16, 2022Date of Patent: October 31, 2023Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chang Youn Kim
-
Patent number: 11784292Abstract: A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.Type: GrantFiled: August 4, 2022Date of Patent: October 10, 2023Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chang Youn Kim
-
Publication number: 20230057649Abstract: A display device including a circuit board, and pixels each including a light emitting structure including epitaxial stacks and having a light emitting area defined by the epitaxial stacks, an encapsulating member covering a side surface and an upper surface of the light emitting structure, bump electrodes disposed on the light emitting structure, at least a portion of each bump electrode overlapping with the light emitting area, and fan-out lines disposed on the encapsulating member and electrically connected to the light emitting structure through the bump electrodes, in which at least a first portion of a surface of the fan-out lines is exposed to the outside to receive electrical signal for independent driving of the light emitting structure, and the first portion of the fan-out lines does not overlap the light emitting area in a plan view.Type: ApplicationFiled: November 3, 2022Publication date: February 23, 2023Inventors: Jong Min Jang, Chang Youn Kim
-
Publication number: 20230018410Abstract: A light emitting device module including a printed circuit board, upper and lower electrodes disposed on opposing surfaces of the printed circuit board, light emitting devices configured to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting devices, in which each light emitting device includes a light emitting structure, a substrate disposed on the light emitting structure, and bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers side surfaces of the substrates, a number of the lower electrodes is less than a number of the bump electrodes of the plurality of light emitting devices, and each of the light emitting devices is configured to be driven independently.Type: ApplicationFiled: September 16, 2022Publication date: January 19, 2023Inventors: Jong Min JANG, Chang Youn Kim
-
Publication number: 20220376148Abstract: A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.Type: ApplicationFiled: August 4, 2022Publication date: November 24, 2022Inventors: Jong Min JANG, Chang Youn KIM
-
Patent number: 11508876Abstract: A light emitting device package including a substrate, a light emitting structure including a plurality of epitaxial stacks sequentially stacked on the substrate configured to emit light having different wavelength bands from each other, the light emitting structure having a light emitting area defined by the epitaxial stacks, a plurality of bump electrodes disposed on the light emitting structure, at least a portion of each bump electrode overlapping with the light emitting area, a molding layer covering a side surface and an upper surface of the light emitting structure, a plurality of fan-out lines disposed on the molding layer and connected to the light emitting structure through the bump electrodes, and an insulating layer disposed on the fan-out lines and exposing a portion of the fan-out lines, in which the exposed portion of the fan-out lines does not overlap with the light emitting area.Type: GrantFiled: December 27, 2019Date of Patent: November 22, 2022Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Min Jang, Chang Youn Kim
-
Patent number: 11450648Abstract: A light emitting device package including a printed circuit board having a front surface and a rear surface, at least one light emitting device disposed on the front surface and emitting light in a direction toward the front surface, and a molding layer disposed on the printed circuit board and surrounding the light emitting device, in which the light emitting device includes a light emitting structure disposed on the printed circuit board, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, and the molding layer may cover an upper surface of the substrate and partially reflect, scatter, or absorb external light.Type: GrantFiled: March 12, 2020Date of Patent: September 20, 2022Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chang Youn Kim
-
Patent number: 11437551Abstract: A light emitting device package including a printed circuit board having a front surface and a rear surface, at least one light emitting device disposed on the front surface and emitting light in a direction toward the front surface, and a molding layer disposed on the printed circuit board and surrounding the light emitting device, in which the light emitting device includes a light emitting structure disposed on the printed circuit board, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, and the molding layer covers an upper surface of the substrate and includes a fine concavo-convex part formed on a surface of the molding layer exposed to the outside.Type: GrantFiled: March 16, 2020Date of Patent: September 6, 2022Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chang Youn Kim
-
Publication number: 20220085251Abstract: A light emitting diode including a side reflection layer. The light emitting diode includes: a semiconductor stack and a light exit surface having a roughened surface through which light generated from an active layer is emitted; side surfaces defining the light exit surface; and a side reflection layer covering at least part of the side surfaces. The light exit surface is disposed over a first conductivity type semiconductor layer opposite to the ohmic reflection layer, all layers from the active layer to the light exit surface are formed of gallium nitride-based semiconductors, and a distance from the active layer to the light exit surface is 50 ?m or more.Type: ApplicationFiled: November 29, 2021Publication date: March 17, 2022Inventors: Jong Min Jang, Chae Hon Kim, Chang Youn Kim, Jae Hee Lim
-
Patent number: 11189755Abstract: A light emitting diode including a side reflection layer. The light emitting diode includes: a semiconductor stack and a light exit surface having a roughened surface through which light generated from an active layer is emitted; side surfaces defining the light exit surface; and a side reflection layer covering at least part of the side surfaces. The light exit surface is disposed over a first conductivity type semiconductor layer opposite to the ohmic reflection layer, all layers from the active layer to the light exit surface are formed of gallium nitride-based semiconductors, and a distance from the active layer to the light exit surface is 50 ?m or more.Type: GrantFiled: February 12, 2020Date of Patent: November 30, 2021Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chae Hon Kim, Chang Youn Kim, Jae Hee Lim
-
Publication number: 20200303607Abstract: A light emitting device package including a printed circuit board having a front surface and a rear surface, at least one light emitting device disposed on the front surface and emitting light in a direction toward the front surface, and a molding layer disposed on the printed circuit board and surrounding the light emitting device, in which the light emitting device includes a light emitting structure disposed on the printed circuit board, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, and the molding layer may cover an upper surface of the substrate and partially reflect, scatter, or absorb external light.Type: ApplicationFiled: March 12, 2020Publication date: September 24, 2020Inventors: Jong Min Jang, Chang Youn Kim
-
Publication number: 20200303605Abstract: A light emitting device package including a printed circuit board having a front surface and a rear surface, at least one light emitting device disposed on the front surface and emitting light in a direction toward the front surface, and a molding layer disposed on the printed circuit board and surrounding the light emitting device, in which the light emitting device includes a light emitting structure disposed on the printed circuit board, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, and the molding layer covers an upper surface of the substrate and includes a fine concavo-convex part formed on a surface of the molding layer exposed to the outside.Type: ApplicationFiled: March 16, 2020Publication date: September 24, 2020Inventors: Jong Min JANG, Chang Youn KIM
-
Patent number: 10749078Abstract: A light emitting diode including a side reflection layer. The light emitting diode includes: a semiconductor stack and a light exit surface having a roughened surface through which light generated from an active layer is emitted; side surfaces defining the light exit surface; and a side reflection layer covering at least part of the side surfaces. The light exit surface is disposed over a first conductivity type semiconductor layer opposite to the ohmic reflection layer, all layers from the active layer to the light exit surface are formed of gallium nitride-based semiconductors, and a distance from the active layer to the light exit surface is 50 ?m or more.Type: GrantFiled: November 14, 2017Date of Patent: August 18, 2020Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chae Hon Kim, Chang Youn Kim, Jae Hee Lim
-
Publication number: 20200212262Abstract: A light emitting device package including a substrate, a light emitting structure including a plurality of epitaxial stacks sequentially stacked on the substrate configured to emit light having different wavelength bands from each other, the light emitting structure having a light emitting area defined by the epitaxial stacks, a plurality of bump electrodes disposed on the light emitting structure, at least a portion of each bump electrode overlapping with the light emitting area, a molding layer covering a side surface and an upper surface of the light emitting structure, a plurality of fan-out lines disposed on the molding layer and connected to the light emitting structure through the bump electrodes, and an insulating layer disposed on the fan-out lines and exposing a portion of the fan-out lines, in which the exposed portion of the fan-out lines does not overlap with the light emitting area.Type: ApplicationFiled: December 27, 2019Publication date: July 2, 2020Inventors: Jong Min Jang, Chang Youn Kim