Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A method of making a housing includes: providing a substrate and cutting the substrate to form an opening. The substrate being spaced by the opening to form at least one main base. A plurality of metal sheets and a plurality of reinforcing members are provided. Placing the metal sheets, the reinforcing members and the main base into a mold. The metal sheets is positioned in the opening, adjusts width of each gap between adjacent metal sheets, and between the main base and one metal sheet adjacent to the main base. Locating the reinforcing members in the metal sheets and the main base. Liquid resin is filled into the gaps and covers the reinforcing members to bond the metal sheets, the main base and the reinforcing members together, forming the housing.

Abstract: A housing includes a metal base and a non-conductive member. The metal base has an internal surface and a plurality of gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap. The metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body. Each gap is completely filled with one dielectric member. The metal sheets and the at least one main body are all bonded with the dielectric member and are electrically isolated with each other.

Abstract: A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.

Abstract: A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.

Abstract: A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.

Abstract: A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of reinforcing members, the metal sheets are positioned in the opening, the reinforcing members inlaid in the metal sheets and the substrate. The present invention also provides an electronic device having the housing, and a method of making the housing.

Abstract: A method of making a housing includes: providing a metal base, the metal base having an internal surface. Placing the metal base into a mold, liquid non-conductive material covering at least a portion of the internal surface of the metal base to form a non-conductive member at the at least a portion of the metal base. Cutting the metal base corresponding to the at least a portion of the metal base to form at least one gap, the non-conductive member being formed on a bottom of the gap. Placing one dielectric member in one corresponding gap.

Abstract: A method of making a housing includes: providing a substrate and cutting the substrate to form an opening. The substrate being spaced by the opening to form at least one main base. A plurality of metal sheets and a plurality of reinforcing members are provided. Placing the metal sheets, the reinforcing members and the main base into a mold. The metal sheets is positioned in the opening, adjusts width of each gap between adjacent metal sheets, and between the main base and one metal sheet adjacent to the main base. Locating the reinforcing members in the metal sheets and the main base. Liquid resin is filled into the gaps and covers the reinforcing members to bond the metal sheets, the main base and the reinforcing members together, forming the housing.

Abstract: A housing includes a metal base and a non-conductive member. The metal base has an internal surface and a plurality of gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap. The metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body. Each gap is completely filled with one dielectric member. The metal sheets and the at least one main body are all bonded with the dielectric member and are electrically isolated with each other.

Abstract: A housing includes a metallic base defining a slit, a plurality of metallic members arranged in the slit at intervals, and a non-conductive member formed between each two neighboring metallic members and between the metallic base and the metallic members adjacent to the metallic base. The plurality of the metallic pieces and the metallic base are connected by the non-conductive member. An electronic device including the housing and a method of manufacturing the housing are also provided.

Abstract: A housing includes a substrate defining a surface, and at least one seal ring formed on the substrate, the seal ring is made of elastic material, a surface of the seal ring connected with the substrate has a plurality of ribs, the surface of the substrate connecting with the seal ring has a plurality of holes, the ribs are engaged in the holes. A method of making a housing includes: a substrate defining a surface is provided; a plurality of holes is formed on the substrate; and at least one seal ring is formed on the substrate, the seal ring has a plurality of ribs, the ribs are engaged in the holes.

Abstract: An abrasive article includes a non-rigid carrier and a plurality of abrasive particles disposed in the carrier, the carrier is made of resin or rubber, a mass ratio of abrasive particles to carrier is about 1:1 to about 5:1. A method for making the abrasive articles includes providing a plurality of abrasive particles and a resin, mixing the rubber and the abrasive particles, heating the mixture to a fluid state, and pressing the mixture into a desired shape. After the mixed is cooled, the mixture is cut into small pellets, forming the abrasive articles.

Abstract: A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of non-conductive members, the metal sheets are bonded with each other through non-conductive members, forming a metal sheets member, the metal sheets member is located in the opening, the metal sheets member is bonded with substrate through the non-conductive members.

Abstract: A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of reinforcing members, the metal sheets are positioned in the opening, the reinforcing members inlaid in the metal sheets and the substrate. The present invention also provides an electronic device having the housing, and a method of making the housing.

Abstract: A housing includes a metal base and a non-conductive member. The metal base has an internal surface and at least one gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap.

Abstract: A cut piece includes a first surface, and a second surface opposite to the first surface. The first surface has at least two grooves, forming at least one support plate located between each two adjacent grooves. The second surface has a plurality of gaps. Each groove is connected with at least one gap.

Abstract: A method of forging aluminum/aluminum alloys includes: providing an aluminum/aluminum alloy billet; providing a forging die, the forging die including an upper die and a lower die, the upper die and the lower die being all mounted with heating element and temperature controller; locating the aluminum/aluminum alloy billet in the forging die; heating the upper die and the lower die and making the temperature difference between the upper die and the lower die be about 100° C.-350° C.; forging the aluminum/aluminum alloy billet to get an aluminum/aluminum alloy forged piece, the temperature difference between the upper die and the lower die being kept at about 100° C.-350° C. during the forging process; and opening the upper die and the lower die to remove out the aluminum/aluminum alloy forged piece.

Abstract: A mold, comprising: a substrate, the substrate having an inside surface and an outside surface; and a ceramic coating formed on at least substantially the entire inside surface, the ceramic coating comprising chromic oxide, silicon dioxide, and alumina. A method for making the present mold is provided.

Abstract: A housing of electronic device includes a main plate and a metal peripheral wall, the peripheral wall is fabricated by cold drawn and secured to the periphery of the main plate.