Abstract: An exemplary housing of electronic device includes a metallic main body and a metallic three-dimensional woven member formed on at least a part of a surface of the metallic main body. An electronic device using the housing is also provided. The housing of the electronic device has a textured touching feeling.

Abstract: A housing for an electronic device includes a metal substrate and a ceramic coating directly formed on at least portions of the substrate, the coated portions of the substrate having a rough surface. A method for fabricating the housing comprises roughening predetermined portions of the substrate; thermally spraying a ceramic coating on the roughened portions of the substrate, fixing the substrate on a tool having cold water circularly running there within during the thermal spraying; and grinding and polishing the ceramic coating.

Abstract: A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections. The first sections and the second sections are arranged on the base in an interleaving manner.

Abstract: A method for making a device housing comprises: providing a metal substrate; etching grooves on a portion of the surface of the metal substrate; forming a metallic coating on the surface of the metal substrate and in the grooves; and removing the metallic coating formed on the surface of the metal substrate not comprising the grooves. A device housing made by the method is also described there.

Abstract: A mold, comprising: a substrate, the substrate having an inside surface and an outside surface; and a ceramic coating formed on at least substantially the entire inside surface, the ceramic coating comprising chromic oxide, silicon dioxide, and alumina. A method for making the present mold is provided.

Abstract: A housing having a woven appearance includes a substrate and a plurality of groove groups formed on the surface of the substrate. The groove groups define the woven appearance and are formed by etching. The housing may be made by using a film having a lightproof areas and a light-transmissible areas, the lightproof areas defining a woven appearance. The film is placed over a metal substrate having light-sensitive materials formed thereon and radiated with light. The light passing through the light-transmissible areas of the film solidifies the light-sensitive materials. After, removing the film from the substrate and cleaning un-solidified light-sensitive materials from the substrate to expose areas corresponding to the lightproof area, and an etching process is carried out to form the woven appearance on the exposed areas.

Abstract: A field emission device (FED) includes a top substrate having an anode electrode and a phosphor layer, a lower substrate, at least one cathode electrode having an opening-pattern with at least one opening, an insulating layer located on the cathode electrode, a gate layer located on the insulating layer, and an electron emitter located in the opening of the cathode electrode. The electron emitter is adjacent to the cathode electrode and is electrically connected therewith. The cathode electrode having the opening-pattern is located on a bottom panel. Through the structure illustrated above, uniformity of emitting electron density can be improved and brightness and contrast of color for the FED can be enhanced.

Abstract: A housing with a three dimensional pattern coating includes a substrate, a powder coated layer formed on the substrate, the powder coated layer having plural grooves therein; and a pattern coating formed in the grooves. A method for making the housing comprises: providing a substrate; painting a powder coated layer onto the substrate; etching the powder coated layer to form plural grooves; filling the grooves with a colloidal solution.

Abstract: An exemplary housing of electronic device includes a metallic main body and a metallic three-dimensional weaving member formed on at least a part of a surface of the metallic main body. An electronic device using the housing is also provided. The housing of the electronic device has a textured touching feeling.

Abstract: A method to fabricate a pattern on a housing, includes following steps: placing a film having a first lightproof area and a first light-transmissible area on a housing having light-sensitive inks formed in surface; radiating light on the film and light passing through the light-transmissible area and solidifying the light-sensitive inks; removing the film from the housing and cleaning the un-solidified light-sensitive inks; wiredrawing first wires in the housing and forming first wires in exposed area correspondingly; covering part of the first wires and wiredrawing second wires, the second wires crosses with part of the first wires.

Abstract: A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections. The first sections and the second sections are arranged on the base in an interleaving manner.

Abstract: A metal housing (10) includes a first metal layer (11) and a second metal layer (12). The material of the first metal layer is selected from the group consisting of stainless steel, titanium and titanium alloy. The material of the second metal layer is selected from the group consisting of aluminum, aluminum alloy and magnesium alloy. The second metal layer is integrally formed with the first metal layer.

Abstract: The present invention provides an electron amplification plate placed between a first substrate and a second substrate of a field emission display device. The electron amplification plate comprises at least two insulating layers for electrical insulation; and at least one conductive electrode layer having plural apertures, wherein the conductive electrode layer is sandwiched between the insulating layers. The surface of the inner wall of the apertures is coated with an electron-amplifying material for multiplying the quantity of electrons as the surface is impacted. The inner wall of each aperture comprises an upper concave wall and a lower concave wall, and the lower concave wall is used for collecting electrons, and the upper concave wall is used for focusing electrons. Thereby, the electron beam emitted from the emitters can be effectively amplified, and color purity of the field emission display device is high.

Abstract: A field emission display (FED) device, which includes a top substrate, a bottom substrate, and an intermediate plate set located between the top substrate and the bottom substrate. The top substrate has a phosphor layer and an anode. The bottom substrate has a cathode, and an electron emitter. The intermediate plate set has a metal plate with multiple holes, an insulating layer with multiple holes, and a gate layer. In the FED device, the insulating layer is located between the gate layer and the metal plate for electrical insulation, and the gate layer has a gap from the bottom substrate. Thus, the processing steps prepared for the bottom substrate can be reduced to thereby prevent the electron emitters from damage. The number of electrons bombarding on the phosphor layer is effectively increased to thereby increase the brightness and color contrast on pixels.

Abstract: A field emission device (FED) includes a top substrate having an anode electrode and a phosphor layer, a lower substrate, at least one cathode electrode having an opening-pattern with at least one opening, an insulating layer located on the cathode electrode, a gate layer located on the insulating layer, and an electron emitter located in the opening of the cathode electrode. The electron emitter is adjacent to the cathode electrode and is electrically connected therewith. The cathode electrode having the opening-pattern is located on a bottom panel. Through the structure illustrated above, uniformity of emitting electron density can be improved and brightness and contrast of color for the FED can be enhanced.

Abstract: The present invention provides a spacer placed between a top substrate and a bottom substrate for a field emission display device. The spacer comprises at least two insulating layers for electrical insulation; and at least one metal layer sandwiched between the insulating layers, wherein the metal layer has plural apertures for electrons passing therethrough and disturbing pathway of electrons as the electrons impact the apertures.