Abstract: A fan module and computing device with the fan module are disclosed. The fan module includes a handle configured to actuate between an operation state and a release state. The handle in the release state allows a user to vertically remove the fan module from its respective fan module slot and away from the bottom panel.

Abstract: A temperature-sensing and humidity-controlling fiber includes a hydrophilic material and a temperature-sensing material. The temperature-sensing material has a lower critical solution temperature (LCST) between 31.2° C. and 32.5° C. when a light transmittance thereof is in a range from 3% to 80%, in which a wavelength of the light is between 450 nm and 550 nm.

Abstract: An electronic device and an electronic apparatus with a mating structure. The electronic device comprises a first substrate with a first face and a second face opposite to each other, a plural of tiles on the first face and with a second substrate and a patterned layer, a trace layer between the tiles and the first substrates and electrically connected to the patterned layer, and a connection component disposed at a second surface of the first substrate and electrically connected to the trace layer.

Abstract: An electronic device includes a first substrate, a second substrate, plural conductive pads, plural hole structures, plural connection pads and plural conductive structures. Hole structures penetrate through the first and second substrates, and are arranged corresponding to the conductive pads. Second ends of hole structures are located at the second substrate, and the corresponding conductive pad is exposed by one of the second ends. Connection pads enclose first ends of hole structures. Conductive structures are arranged in the hole structures and electrically connected to corresponding conductive pads and connection pads. The second diameter portion of each conductive structure penetrates through first substrate and conductive pad and is electrically connected to corresponding connection pad and conductive pad, and first diameter portion thereof penetrates through second substrate and is electrically connected to corresponding conductive pad.

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Abstract: A module comprises a tray, a mechanical switch, and a linkage system. The tray is configured to receive a circuit board thereon. The mechanical switch is mounted to the tray and movable between an unsecured position and a secured position. The linkage system is mechanically coupled to the mechanical switch, and moves between an unsecured configuration and a secured configuration in response to the mechanical switch moving between the unsecured position and the secured position. When the module is coupled to a computing device and the linkage system is in the secured configuration, the linkage system engages the computing device, such that the module is locked to the computing device. When the module is coupled to the computing device and the linkage system is in the unsecured configuration, the linkage system is disengaged from the computing device, such that the module is unlocked from the computing device.

Abstract: An electronic device includes a first substrate and a second substrate stacked on each other, a plurality of pad groups, a plurality of channels, and a plurality of conductive members. The first substrate and the second substrate respectively have an inner surface facing to each other and an outer surface away from each other. Each pad group includes two conductive pads, which are respectively disposed at the outer surfaces of the first substrate and the second substrate and are located corresponding to each other. The channels pass through the first substrate and the second substrate, and each channel is disposed corresponding to one of the pad groups. Two ends of each channel are respectively sealed by the two conductive pads of the corresponding pad group. The conductive members are disposed in the channels, and each conductive member is electrically connected to the two conductive pads of the corresponding pad group.

Abstract: A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.

Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.

Abstract: An example computing system includes an I/O module that is securable to the computer chassis. The I/O module includes a gear rack. In additional implementations, the computing system includes a fastening assembly which has a fastener configured to receive an external rotational force from a user. In other implementations, the fastening assembly includes a thread mechanism having first and second portions. The first portion of the thread mechanism are rotatably fixed to the fastener. In other implementations, the fastening assembly includes a gear rotatably fixed to the second portion of the thread mechanism, the gear being configured to engage a gear rack coupled to the I/O module. Upon receiving the external rotational force, the thread mechanism also causes (a) the gear to rotate and (b), in turn, linear movement of the gear rack to (c) secure or unsecure the I/O module relative to the computer chassis.

Abstract: A quick-disconnect (QD) connector is configured for a server having electronic modules and an internal fluid circulation system for circulating fluid to cool the electronic modules. The QD connector comprises a first manifold, a second manifold, and a mating actuator. The second manifold is removably connected to the first manifold. The fluid is flowable within the internal fluid circulation system of the server in response to the first manifold and the second manifold being in a connected state. The mating actuator includes a handle and a buckle attached to the handle. The handle is movably coupled to the first manifold so as to be movable from a first position to a second position. The buckle is configured to engage the second manifold and to move the first and second manifolds into the connected state in response to the handle being moved from the first position to the second position.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.

Abstract: An example computing system includes an I/O module that is securable to the computer chassis. The I/O module includes a gear rack. In additional implementations, the computing system includes a fastening assembly which has a fastener configured to receive an external rotational force from a user. In other implementations, the fastening assembly includes a thread mechanism having first and second portions. The first portion of the thread mechanism are rotatably fixed to the fastener. In other implementations, the fastening assembly includes a gear rotatably fixed to the second portion of the thread mechanism, the gear being configured to engage a gear rack coupled to the I/O module. Upon receiving the external rotational force, the thread mechanism also causes (a) the gear to rotate and (b), in turn, linear movement of the gear rack to (c) secure or unsecure the I/O module relative to the computer chassis.

Abstract: A connector consisting of a body, a first slot, a second slot, a first terminal, and a second terminal is disclosed. The first slot is provided on the body to receive a first printed circuit board (PCB). The second slot is provided on the body to receive a second PCB. The first slot and the second slot are separate and distinct slots. When the first PCB and the second PCB are received in the first slot and the second slot, respectively, the first terminal electrically connects the first PCB and the second PCB, and the second terminal connects to only the second PCB. Providing the first slot on the connector allows adding expansion cards, control cards, and the like to enhance functionality of computing systems.

Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.