Abstract: The use of menthol or an isomer thereof for preparation of a topical composition to improve neurodegenerative diseases and stroke wherein the neurodegenerative diseases are attributed to cerebral neurons impaired or degenerated, shortage of dopamine in a brain. The topical composition is manufactured as patches, liquids, pastes, oily substances, powders, gels, sprays, composite products or other products to be covered on limbs and applied on skin. A product to be covered on limbs can be a glove, a foot muff, a sock or an extended part or a layered object from a garment for continuous contact between skin and menthol. The present invention also provides the use of menthol or an isomer thereof for preparation of a topical composition to improve diseases or symptoms attributed to cerebral neurons impaired or degenerated, shortage of dopamine or stroke.

Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

Abstract: An optical transceiver for connection between an optical socket and an electrical socket is disclosed. The optical transceiver includes an electrical connector and an optical connector. The optical transceiver has an electronics housing holding the electrical and optical connectors in relative position to each other allowing the simultaneous connection to an electrical socket and an optical socket. The electrical and optical connectors may be moved between an extended position and a retracted position relative to the electronics housing when being engaged or disengaged with respective electrical and optical sockets.

Abstract: A nucleate boiling apparatus is disclosed that includes a base configured to fit onto a heat-producing object to provide immersion cooling to the object in a liquid-cooled computing environment. The apparatus further includes first and second pluralities of pipes extending from opposite sides of the base. Each of the first and second pluralities of pipes including a respective transition region and a respective flat region. The first and second pluralities of pipes in the transition regions extend away and up from the base, and the first and second pluralities of pipes in the flat regions extend away from the base in a fanned-out arrangement. The flat region of the second plurality of pipes is at a greater distance from the base than the flat region of the first plurality of pipes.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A connector assembly for connecting an upper circuit board to a lower circuit board is disclosed. The upper circuit board includes a series of fastener holes for a fastening device allowing attachment to the lower circuit board. The connector assembly has a support bracket with access holes aligned with the holes of the upper circuit board. The support bracket is configurable to be positioned over the upper circuit board. The connector assembly has a moveable cover bracket having a series of access holes. The cover bracket is suspended between the support bracket and the cover bracket. The cover bracket is moveable between an open position aligning the access holes with the access holes of the support bracket, and a closed position. In the closed position, the cover bracket blocks access between the access holes of the support bracket and the holes of the upper circuit board.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: A tiered immersion cooling system includes a chassis, a cabinet frame slidably mounted to the chassis, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidable between a first internal position and a first external position. Sliding motion of the cabinet frame is in a horizontal direction along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank slides relative to the cabinet frame, in a vertical direction along a height of the chassis. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is mounted to slide independently from the cabinet frame, in the horizontal direction. The lower immersion tank slides between a second internal and a second external position.

Abstract: A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component.

Abstract: A server rack for supporting a plurality of servers of varying heights includes opposing side walls each including one or more vertical tracks. A first column of holes is disposed in one of the vertical tracks and a second column of holes disposed in a corresponding opposing vertical track of the opposing side wall. A third and fourth column of holes are disposed adjacent to and corresponding to the first column of holes and the second column of holes. A first pair of opposing rails are each disposed on the opposing side walls. Each of the opposing rails are mechanically secured to the one or more vertical tracks at the first and second columns of holes. The first pair of opposing rails are configured to support a first server having a first height. For the first and second columns of holes, the spacing between holes is predefined to accommodate opposing rails to support servers of the first height.

Abstract: A connector assembly for connecting an upper circuit board to a lower circuit board is disclosed. The upper circuit board includes a series of fastener holes for a fastening device allowing attachment to the lower circuit board. The connector assembly has a support bracket with access holes aligned with the holes of the upper circuit board. The support bracket is configurable to be positioned over the upper circuit board. The connector assembly has a moveable cover bracket having a series of access holes. The cover bracket is suspended between the support bracket and the cover bracket. The cover bracket is moveable between an open position aligning the access holes with the access holes of the support bracket, and a closed position. In the closed position, the cover bracket blocks access between the access holes of the support bracket and the holes of the upper circuit board.

Abstract: An optical transceiver for connection between an optical socket and an electrical socket is disclosed. The optical transceiver includes an electrical connector and an optical connector. The optical transceiver has an electronics housing holding the electrical and optical connectors in relative position to each other allowing the simultaneous connection to an electrical socket and an optical socket. The electrical and optical connectors may be moved between an extended position and a retracted position relative to the electronics housing when being engaged or disengaged with respective electrical and optical sockets.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: A lock mechanism within a slot of a computer chassis is disclosed. The lock mechanism includes a gear wheel, a gear rack body, a push rod latch, a push rod body, and a chassis latch. The gear wheel, the gear rack body, the push rod latch, the push rod body, and the chassis latch cooperate to restrict a flap in the slot from opening when the flap is in the closed position, and the chassis latch is engaged with a cutout on the push rod body.

Abstract: A network device comprising a chassis, a plurality of fiber optic adapters, a plurality of arrangements of interior fiber optic cables, and a plurality of stacked cable management trays. The chassis includes a front panel with a plurality of front fiber optic adapter openings. The chassis defines an interior space. The plurality of front fiber optic adapters is disposed in the front fiber optic adapter openings. The plurality of arrangements of interior fiber optic cables is disposed within the interior space. A first end of each interior fiber optic cable is directly connected to a corresponding one of the plurality of front fiber optic adapters. The plurality of stacked cable management trays each support one of the plurality of arrangements of interior fiber optic cables. The plurality of stacked cable management trays is configured to route a second end of each interior fiber optic cable to a corresponding side fiber optic adapter.

Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.

Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

Abstract: A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.