Abstract: A fan system and a computing system with the fan system are disclosed. The fan system includes a fan module. The fan module includes a housing configured to retain a fan and a motor to rotate the fan. The housing includes an air inlet aperture on an air inlet side of the housing and an air outlet aperture on an air outlet side of the housing. The fan system further includes an outlet fan guard coupled to the fan module on the air outlet side of the housing. The outlet fan guard includes at least one flap rotatable between a closed position, covering the air outlet aperture of the housing, and an open position, uncovering the air outlet aperture of the housing. The outlet fan guard further includes at least one spring urging the at least one flap into the closed position.

Abstract: An expansion bay for a computer device for easy insertion and extension of an expansion component is disclosed. The expansion bay has two facing side walls, a bottom panel joining the facing side walls, and a closed end. A front cross member joins the side walls to define a front open end. A pair of springs are located the closed end that force the expansion component away from the closed end. A pair of rotating levers are mounted on the front cross member near each of the side walls. Each of the rotating levers has a pin that engages a groove on the expansion component that is inserted through the open front end. The levers are rotated via the pins engaging the grooves when the expansion component is moved into and out of open front end.

Abstract: A quick-disconnect (QD) connector is configured for a server having electronic modules and an internal fluid circulation system for circulating fluid to cool the electronic modules. The QD connector comprises a first manifold, a second manifold, and a mating actuator. The second manifold is removably connected to the first manifold. The fluid is flowable within the internal fluid circulation system of the server in response to the first manifold and the second manifold being in a connected state. The mating actuator includes a handle and a buckle attached to the handle. The handle is movably coupled to the first manifold so as to be movable from a first position to a second position. The buckle is configured to engage the second manifold and to move the first and second manifolds into the connected state in response to the handle being moved from the first position to the second position.

Abstract: A cooling system is disclosed for a server rack holding one or more servers. The cooling system includes a cooling module configured to condition coolant to provide cooling within the server rack. The cooling system further includes at least one evaporator configured to couple to an upstream side of the server rack, relative to airflow through the server rack, and cool the airflow flowing into the server rack with the coolant. The cooling system further includes at least one condenser configured to couple to a downstream side of the server rack, relative to the airflow through the server rack, and cool the coolant after the coolant passes through the at least one evaporator.

Abstract: Embodiments of the disclosure are directed to a transportation system for carrying servers. The transportation system includes a server rack and a shock-absorbing pallet. The shock-absorbing pallet is secured under the server rack and configured to move relative to the server rack to dampen vibration during transportation of the server rack. The shock-absorbing pallet includes a top cover, a bottom cover, one or more isolation devices, and one or supporting layers. The one or more isolation devices are disposed between the top cover and the bottom cover. Each isolation device includes a shock-absorbing component coupled to the top cover and the bottom cover. The one or more supporting layers are secured between the top cover and the bottom cover around the one or more isolation devices. The one or more supporting layers have a plurality of slots for guiding a pallet lifter therethrough.

Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

Abstract: An expansion bay for a computer system having a rotatable fastening mechanism is disclosed. The expansion bay includes a bay housing having two facing side walls, a front open end and a bottom panel. A front tab and a rear tab extend from the interior of one of the side walls. A tray supporting an expansion component has a guide block with a threaded aperture. The tray may be positioned between an open position and a closed position. The rotatable fastener mechanism moves the tray into and out of the bay housing. A rod is inserted through apertures of the first tab and the second tab, allowing free rotation of the rod. The rod includes a threaded exterior section to rotationally engage the threaded aperture of the guide block. A knob is attached to an end of the rod to allow a user to rotate the rod and move the tray.

Abstract: A latching apparatus has a first component and a second component. The first component is made of a first material and includes a distal end, a proximal end, and an indention between the distal end the proximal end. The distal end includes a mating tab, whereas the proximal end includes a flange member for fixing the first component to a lid of a housing. The second component is made of a second material and is coupled to the mating tab. The second component includes a receiving element for engaging with a securing element of the housing. The latching element includes a pressing region formed in one of the first component and the second component between the indention and the receiving element. The first material has a higher flexibility that the second material.

Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

Abstract: A connector assembly includes a first and a second component. Each of the components including a connector body, a valve, a handle, a handle lock, and a connector lock. The handles open and close respective valves. Each of the handles has locked and unlocked positions. The handle locks prevent or inhibit the respective handles from being moved between open and closed positions. The handle locks in unlocked positions enable the respective handles to be moved between open and closed positions. The first and second components are configured to be releasably assembled with each other. The connector locks in their respective closed positions assist in preventing or inhibiting the disassembling of the first and second components.

Abstract: A fan system and a computing system with the fan system are disclosed. The fan system includes a fan module. The fan module includes a housing configured to retain a fan and a motor to rotate the fan. The housing includes an air inlet aperture on an air inlet side of the housing and an air outlet aperture on an air outlet side of the housing. The fan system further includes an outlet fan guard coupled to the fan module on the air outlet side of the housing. The outlet fan guard includes at least one flap rotatable between a closed position, covering the air outlet aperture of the housing, and an open position, uncovering the air outlet aperture of the housing. The outlet fan guard further includes at least one spring urging the at least one flap into the closed position.

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: Embodiments of the disclosure are directed to a transportation system for carrying servers. The transportation system includes a server rack and a shock-absorbing pallet. The shock-absorbing pallet is secured under the server rack and configured to move relative to the server rack to dampen vibration during transportation of the server rack. The shock-absorbing pallet includes a top cover, a bottom cover, one or more isolation devices, and one or supporting layers. The one or more isolation devices are disposed between the top cover and the bottom cover. Each isolation device includes a shock-absorbing component coupled to the top cover and the bottom cover. The one or more supporting layers are secured between the top cover and the bottom cover around the one or more isolation devices. The one or more supporting layers have a plurality of slots for guiding a pallet lifter therethrough.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.