Patents by Inventor Chao Lin

Chao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164223
    Abstract: A method includes forming a dielectric layer over a substrate, the dielectric layer having a top surface; etching an opening in the dielectric layer; forming a bottom electrode within the opening, the bottom electrode including a barrier layer; forming a phase-change material (PCM) layer within the opening and on the bottom electrode, wherein a top surface of the PCM layer is level with or below the top surface of the dielectric layer; and forming a top electrode on the PCM layer.
    Type: Application
    Filed: January 26, 2024
    Publication date: May 16, 2024
    Inventors: Tung Ying Lee, Yu Chao Lin, Shao-Ming Yu
  • Publication number: 20240162321
    Abstract: A semiconductor structure includes a substrate, a dielectric wall, and two device units. The dielectric wall has two side surfaces opposite to each other. The two device units are respectively formed at the two side surfaces of the dielectric wall. Each of the device units includes channel features, a gate feature and a dielectric filler unit. The channel features are disposed on a corresponding one of the side surfaces of the dielectric wall, and spaced apart from each other. The gate feature is formed around the channel features and disposed on the corresponding one of the side surfaces of the dielectric wall. The dielectric filler unit includes a plurality of first dielectric fillers, each of which is disposed between the dielectric wall and a corresponding one of the channel features. The first dielectric fillers have a dielectric constant greater than that of the dielectric wall.
    Type: Application
    Filed: February 22, 2023
    Publication date: May 16, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Huang-Chao CHANG, Ta-Chun LIN, Chun-Sheng LIANG, Jhon-Jhy LIAW
  • Patent number: 11984400
    Abstract: An SRAM device and method of forming include pass gate (PG), pull-down (PD), and pull-up (PU) transistors. A first gate line of the PG and a second gate line of the PD and the PU extend in a first direction. A common source/drain of the PG, PD, and PU transistors interposes the first and second gate lines and another source/drain of the PG transistor. A first contact extends from the common source/drain and a second contact extends from the another source/drain. A third contact is disposed above the second contact with a first width in the first direction and a first length in a second direction, first length being greater than the first width.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Yuan Chang, Jui-Lin Chen, Kian-Long Lim, Feng-Ming Chang
  • Patent number: 11984748
    Abstract: The invention discloses a full current control battery module and an energy storage system of full current control battery, belonging to the field of electric energy storage, wherein the full current control battery module comprises an energy transmission control unit, a relay energy unit and a current control unit. The invention can realize the separate current control of each battery module and isolate the influence of the current generated by the external DC system on the battery module.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: May 14, 2024
    Assignees: XIAMEN HECHU ENERGY TECHNOLOGY CO., LTD., CSG POWER GENERATION (GUANGDONG) ENERGY STORAGE TECHNOLOGY CO., LTD.
    Inventors: Weixing Lin, Wenping Zuo, Zhiqiang Wang, Bangjin Liu, Chao Dong
  • Publication number: 20240153870
    Abstract: A method includes etching a mandrel layer to form mandrel strips, and selectively depositing metal lines on sidewalls of the mandrel strips. During the selective deposition, top surfaces of the mandrel strips are masked by dielectric masks. The method further includes removing the mandrel layer and the dielectric masks, filling spaces between the metal lines with a dielectric material, forming via openings in the dielectric material, with top surfaces of the metal lines exposed to the via openings, and filling the via openings with a conductive material to form vias.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Inventors: Chao-Hsien Peng, Hsiang-Huan Lee, Shau-Lin Shue
  • Publication number: 20240150534
    Abstract: A polyethylene terephthalate composite material containing glass fiber and a method for manufacturing the same are provided. The polyethylene terephthalate composite material includes 40 to 65.5 parts by weight of polyethylene terephthalate, 5 to 40 parts by weight of the glass fiber, and 0.15 to 2.5 parts by weight of a crystallizing agent. The crystallizing agent includes an inorganic crystallizing agent and an organic crystallizing agent, and an added amount of the inorganic crystallizing agent is less than an added amount of the organic crystallizing agent.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 9, 2024
    Inventors: TE-CHAO LIAO, HAN-CHING HSU, CHUN-LAI CHEN, Jui-Jung Lin
  • Publication number: 20240154215
    Abstract: An aluminum plastic film for a lithium battery and a method for manufacturing the same are provided. The method includes steps as follows: preparing a polyolefin adhesive; coating the polyolefin adhesive onto one surface of an aluminum foil layer; disposing an inner polyolefin layer onto the polyolefin adhesive; and drying the polyolefin adhesive, so that a polyolefin adhesive layer is formed between the aluminum foil layer and the inner polyolefin layer. Components of the polyolefin adhesive include a modified polyolefin polymer and a hardener. The modified polyolefin polymer has a modified group, a structure of the modified group contains maleic anhydride, and a molecular weight of the modified polyolefin polymer ranges from 100,000 g/mol to 200,000 g/mol.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 9, 2024
    Inventors: TE-CHAO LIAO, SHIOU-YEH SHENG, TENG-KO MA, CHING-YAO YUAN, Chao-Hsien Lin, CHIA-YU LIN, YUN-BIN HSI, HAN-YI LEE, SHUN-CHIEH YANG
  • Publication number: 20240154168
    Abstract: An electrochemical device includes a positive electrode plate and an electrolytic solution. The electrolytic solution includes a phosphorus additive represented by Formula I: A mass percent of the phosphorus additive represented by Formula I in the electrolytic solution is A %. The electrolytic solution further includes a first additive. The first additive includes at least one of fluoroethylene carbonate or vinylene carbonate. The positive electrode plate includes a positive active material; the positive active material includes an M element; the M element includes at least one of Al, Mg, Ti, or B; a mass percent of the M element in the positive active material is X %; and 0.0001?X/A?40. The electrochemical device is highly stable to thermal shocks.
    Type: Application
    Filed: October 12, 2023
    Publication date: May 9, 2024
    Applicant: Ningde Amperex Technology Limited
    Inventors: Lilan ZHANG, Mengyan LIN, Shan ZHANG, Chao TANG
  • Patent number: 11977422
    Abstract: Provided are a display panel, a display device, and an electronic device. The display panel comprises a panel main body. The panel main body comprises a first portion, a second portion and a bendable third portion, and the third portion is located between the first portion and the second portion. A reinforcement layer is provided on a first face of the first portion to make a stiffness of the first portion higher than a stiffness of the third portion.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 7, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jiaxiang Wang, Binfeng Feng, Yangyang Cai, Yanli Wang, Xinqi Lin, Chao Zhang, Wei Gong
  • Patent number: 11979479
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Grant
    Filed: January 16, 2023
    Date of Patent: May 7, 2024
    Assignees: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Patent number: 11979180
    Abstract: A method for detecting and attenuating the impact of interference in a signal of a radio receiver with multiple tuners. The method includes providing a first input signal RF1 to a first tuner T1; simultaneously providing a second input signal RF2 to a second tuner T2; simultaneously producing a first intermediate high injection signal IFH1, by the first tuner T1, using the first input signal RF1 filtered on a first frequency fE, and a first intermediate low injection signal IFB2, by the second tuner T2, using the second input signal RF2 filtered on the first frequency fE; comparing the first intermediate high injection signal IFH1 and the first intermediate low injection signal IFB2; selecting one out of the first intermediate high injection signal IFH1 and the first intermediate low injection signal IFB2 to be decoded by the radio receiver.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: May 7, 2024
    Assignee: Continental Automotive Technologies GmbH
    Inventors: Chao Lin, Laurent Théry
  • Publication number: 20240145163
    Abstract: A transformer includes a bobbin and a plurality of coils wound on the bobbin. The plurality of coils includes a first primary coil; a second primary coil, located above the first primary coil and electrically connected to the first primary coil; a secondary coil, located between the first primary coil and the second primary; a first auxiliary coil, located above the second primary coil; and a second auxiliary coil, located on the first auxiliary coil and electrically connected to the first auxiliary coil.
    Type: Application
    Filed: October 20, 2023
    Publication date: May 2, 2024
    Inventors: Chiao FU, Yi-Chao LIN, Yao-Zhong LIU, Jia-Tay KUO
  • Publication number: 20240144467
    Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Huei Chen, Pei-Chao Su, Xiaomeng Chen, Chan-Ming Chang, Shih-Yung Chen, Hung-Yi Chung, Kuang-Shing Chen, Li-Jou Lee, Yung-Cheng Lin, Wei-Chen Wu, Shih-Chang Wang, Chien-An Lin
  • Publication number: 20240144029
    Abstract: A method for training a machine learning model is described, comprising receiving, for each perturbation of a plurality of perturbations of model parameters of a starting version of the machine learning model, a change of loss of the machine learning model caused by the perturbation for a set of training data determined by feeding the set of training data to one or more perturbed versions of the machine learning model, estimating a gradient of the loss of the machine learning model with respect to the model parameters from the determined changes of loss and updating the starting version of the machine learning model to an updated version of the machine learning model by changing the model parameters in a direction for which the estimated gradient indicates a reduction of loss.
    Type: Application
    Filed: September 8, 2023
    Publication date: May 2, 2024
    Inventors: Haozhe FENG, Tianyu PANG, Chao DU, Shuicheng YAN, Min LIN
  • Publication number: 20240137431
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Application
    Filed: January 16, 2023
    Publication date: April 25, 2024
    Applicants: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Publication number: 20240135078
    Abstract: Systems, methods, and computer programs products are described for optimizing circuit synthesis for implementation on an integrated circuit. A register transfer level code description of logic behavior of a circuit. The register transfer level code description is converted into structurally defined circuit designs for multiple types of components and feature size technologies. A floor plan of each structurally defined circuit design is generated. A physically simulated circuit is created for each floor plan. A range of operating conditions is swept over to analyze power, performance, and area of each physically simulated circuit.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Inventors: Chao-Chun Lo, Boh-Yi Huang, Chih-yuan Stephen Yu, Yi-Lin Chuang, Chih-Sheng Hou
  • Patent number: 11967601
    Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: April 23, 2024
    Assignee: Prilit Optronics, Inc.
    Inventors: Biing-Seng Wu, Chao-Wen Wu, Chun-Bin Wen, Chien-Lin Lai, Hsing-Ying Lee
  • Patent number: 11968817
    Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
  • Publication number: 20240124307
    Abstract: The present disclosure provides a method for preparing lithium iron phosphate from ferric hydroxyphosphate, including: purifying ferrous sulfate to form a ferrous sulfate solution, adding hydrogen peroxide, phosphoric acid, an ammonium dihydrogen phosphate solution and ammonia water into the ferrous sulfate solution and then reacting to form a mixed slurry, holding the mixed slurry at a temperature for a period of time, and then washing with water and subjecting to press filtration to form ferric hydroxyphosphate precursors with different iron-phosphorus ratios; then flash drying, sintering at a high temperature, and pulverizing to obtain ferric hydroxyphosphate precursors with different iron-phosphorus ratios and different specific surface areas.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Jie Sun, Ji Yang, Yihua Wei, Zhonglin He, Jianhao He, Zhongzhu Xu, Jing Mei, Guangchun Cheng, Shuo Lin, Cheng Xu, Pingjun Lin, Menghua Yu, Bin Wang, Xiaoting Wang, Chao Liu, Yuan Yao
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU