Patents by Inventor Chen-An Cheng

Chen-An Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136298
    Abstract: A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
  • Publication number: 20240136247
    Abstract: In at least one aspect, a method can include shaping a block of flexible spacer material. The method can include shaping a portion of the block of flexible spacer material to receive a solid metal block. The method can include coupling the solid metal block to the portion of the block of flexible spacer material.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 25, 2024
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Liangbiao CHEN, Yong LIU, Tzu-Hsuan CHENG, Stephen ST. GERMAIN, Roger ARBUTHNOT
  • Publication number: 20240137709
    Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 25, 2024
    Inventors: YU-CHEN CHEN, CHUN-KAI CHAN, HSU-HSIANG CHENG, MING-CHING CHENG
  • Publication number: 20240137769
    Abstract: An automatic switching method for an intrusion detection function and a wireless detection system capable of automatically switching an intrusion detection function are provided. The automatic switching method is suitable for a wireless detection system with the intrusion detection function, and the wireless detection system includes a wireless router and a detector set in an intrusion detection range. The method includes: detecting wireless signals of target mobile devices in a whitelist to generate detection results; determining whether the target mobile devices are within the intrusion detection range according to the detection results; in response to determining that one of the target mobile devices is within the intrusion detection range, configuring the wireless router to disable the intrusion detection function; and in response to determining that none of the target mobile devices is within the intrusion detection range, configuring the wireless router to enable the intrusion detection function.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 25, 2024
    Inventors: CHUI-CHU CHENG, HOREN CHEN, YI-AN CHEN
  • Patent number: 11966546
    Abstract: A display device includes a base layer, a touch sensing layer, a light guide module and a display panel. The touch sensing layer is disposed on the base layer. The light guide module is disposed on the touch sensing layer. The touch sensing layer is located between the light guide module and the display panel, and the touch sensing layer and one of the light guide module and the display panel have no adhesive material therebetween.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: April 23, 2024
    Assignee: E Ink Holdings Inc.
    Inventors: Chen-Cheng Lin, Chia-I Liu, Kun-Hsien Lee, Hung-Wei Tseng
  • Patent number: 11967563
    Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
  • Patent number: 11965833
    Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 23, 2024
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jing-Zhi Hou, Lin-Hui Cheng, Yan-Chao Ma, Jin-Cai Zhou, Zi-Long Ma, Neng-Neng Zhang, Yi Chen, Chen-Xi Tang, Meng Lu, Peng Zhou, Ling-Hui Zhang, Lu-Hui Fan, Shi-Gang Xu, Cheng-Yi Chao, Liang-Yi Lu
  • Publication number: 20240128216
    Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Ching-Chun Wang, Hsiao-Hui Tseng, Chen-Jong Wang, Dun-Nian Yaung
  • Publication number: 20240129069
    Abstract: Embodiments include methods for a user equipment (UE) configured to operate in a radio access network (RAN). Such methods include receiving, from a radio node in the RAN, a new feedback indicator (NFI) that indicates whether acknowledgement signaling previously scheduled for transmission by the UE was received by the radio node. The acknowledgement signaling is associated with one or more first downlink (DL) hybrid ARQ (HARQ) processes. Such methods include, when the NFI indicates the acknowledgement signaling was not received by the RAN node, selecting a first HARQ codebook to be used for encoding the acknowledgement signaling together with further acknowledgement signaling associated with one or more second DL HARQ processes. Such methods include, using the selected first HARQ codebook, encoding the acknowledgement signaling and the further acknowledgement signaling to obtain first encoded information and transmitting the first encoded information to the radio node via an uplink (UL) channel.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 18, 2024
    Inventors: Reem Karaki, Daniel Chen Larsson, Jung-Fu Cheng, Stephen Grant, Havish Koorapaty, Gen Li
  • Patent number: 11961226
    Abstract: In a medical image recognition method, applied to a computer device, a to-be-recognized medical image set is obtained, where the to-be-recognized medical image set includes at least one to-be-recognized medical image. A to-be-recognized area corresponding to each to-be-recognized medical image in the to-be-recognized medical image set is extracted. The to-be-recognized area is a part of the to-be-recognized medical image. A recognition result of each to-be-recognized area through a medical image recognition model is determined. The medical image recognition model is obtained through training according to a medical image sample set. The medical image sample set includes at least one medical image sample, and each medical image sample carries corresponding annotation information. The annotation information is used for representing a type of the medical image sample, and the recognition result is used for representing the a of the to-be-recognized medical image.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: April 16, 2024
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Kaiwen Xiao, Zhongqian Sun, Chen Cheng, Wei Yang
  • Publication number: 20240120625
    Abstract: A cylindrical battery cell, a battery and a method for preparing a cylindrical battery cell are provided. The cylindrical battery cell includes a cylindrical can; a jellyroll structure which is arranged inside the cylindrical can; a cathode disk which is arranged on a first side of the cylindrical can in an axial direction; an anode ring which is arranged on the first side of the cylindrical can in the axial direction; and an insulation element which is arranged between the cathode disk and the anode ring. Therefore, the current path in the cylindrical battery cell is shortened, and additional heat-loss and electrical resistance are decreased, furthermore, the wall thickness of the cylindrical can does not need to be increased, which will improve filling ratio and efficiency of the cylindrical battery cell.
    Type: Application
    Filed: February 10, 2021
    Publication date: April 11, 2024
    Inventors: Tobias SCHMIEG, Chen LI, Qian CHENG, Bingjie SHEN
  • Publication number: 20240121718
    Abstract: Some of the present implementations provide a method for a user equipment (UE) for receiving a power saving signal. The method receives, from a base station, a power saving signal comprising a minimum applicable K0 (K0min) that indicates a minimum scheduling offset restriction between a physical downlink control channel (PDCCH) and a physical downlink shared channel (PDSCH). The method determines an application delay based on a predefined value. The method then applies the minimum scheduling offset restriction after the application delay.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 11, 2024
    Inventors: Yu-Hsin Cheng, Chie-Ming Chou, Wan-Chen Lin, Tsung-Hua Tsai
  • Patent number: 11952420
    Abstract: Provided herein are antibodies, or antigen-binding portions thereof, that specifically bind and inhibit TREM-1 signaling, wherein the antibodies do not bind to one or more Fc?Rs and do not induce the myeloid cells to produce inflammatory cytokines. Also provided are uses of such antibodies, or antigen-binding portions thereof, in therapeutic applications, such as treatment of autoimmune diseases.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: April 9, 2024
    Assignee: BRISTOL-MYERS SQUIBB COMPANY
    Inventors: Achal Pashine, Michael L Gosselin, Aaron P. Yamniuk, Derek A. Holmes, Guodong Chen, Priyanka Apurva Madia, Richard Yu-Cheng Huang, Stephen Michael Carl
  • Patent number: 11954152
    Abstract: The present specification discloses video matching. In a computer-implemented method, a plurality of feature vectors of a target video is obtained. A candidate video similar to the target video is retrieved from a video database based on the plurality of feature vectors of the target video. A time domain similarity matrix feature map is constructed between the target video and the candidate video based on the target video and the candidate video. Using the time domain similarity matrix feature map as an input into a deep learning detection model, a video segment matching the target video in the candidate video and a corresponding similarity is output.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: April 9, 2024
    Assignee: Alipay (Hangzhou) Information Technology Co., Ltd.
    Inventors: Chen Jiang, Wei Zhang, Qing Wang, Yuan Cheng, Furong Xu, Kaiming Huang, Xiaobo Zhang, Feng Qian, Xudong Yang, Tan Pan
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11956730
    Abstract: A system and method for determining a Physical Uplink Control Channel (PUCCH) power control parameter h(nCQI,nHARQ) for two Carrier Aggregated (CA) PUCCH formats—PUCCH format 3 and channel selection. The value of h(nCQI,nHARQ) may be based on only a linear function of nHARQ for both of the CA PUCCH formats. Based on the CA PUCCH format configured for the User Equipment (UE), the e-Node B (eNB) may instruct the UE to select or apply a specific linear function of nHARQ as a value for the power control parameter h(nCQI,nHARQ), so as to enable the UE to more accurately establish transmit power of its PUCCH signal. Values for another PUCCH power control parameter—?F_PUCCH(F)—are also provided for use with PUCCH format 3. A new offset parameter may be signaled for each PUCCH format that has transmit diversity configured.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: April 9, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Robert Baldemair, Jung-Fu Cheng, Dirk Gerstenberger, Daniel Chen Larsson
  • Publication number: 20240114614
    Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: HO-CHIEH YU, CHEN-CHENG-LUNG LIAO, CHUN-YU LIN, JASON AN CHENG HUANG, CHIH-CHUAN LIANG, KUN-TZU CHEN, NAI-HIS HU, LIANG-YO CHEN
  • Publication number: 20240113080
    Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Inventors: Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu
  • Publication number: 20240114529
    Abstract: Apparatus and methods are provided for sidelink (SL) transmission in SL unlicensed frequency bands (SL-U). In one novel aspect, one and/or multiple starting symbols within a slot is supported for SL-U to start a transmission. In one embodiment, the physical sidelink control channel (PSCCH) is configured to be transmitted on each starting symbol within a slot. In another embodiment, only physical sidelink shared channel (PSSCH) is transmitted on the starting symbols other than the first starting symbol within a slot. In one novel aspect, PSCCH is transmitted within one sub-channel. In one embodiment, the PSCCH is transmitted on a fixed subchannel of each RB set of the occupied BWP. In another embodiment, the PSCCH is transmitted on a fixed subchannel of one preconfigured RB set. In another novel aspect, the UE sets the CAPC value to be one for the physical sidelink feedback channel (PSFCH).
    Type: Application
    Filed: September 27, 2023
    Publication date: April 4, 2024
    Inventors: JUN-QIANG CHENG, Tao Chen
  • Patent number: 11948796
    Abstract: One or more embodiments described herein relate to selective methods for fabricating devices and structures. In these embodiments, the devices are exposed inside the process volume of a process chamber. Precursor gases are flowed in the process volume at certain flow ratios and at certain process conditions. The process conditions described herein result in selective epitaxial layer growth on the {100} planes of the crystal planes of the devices, which corresponds to the top of each of the fins. Additionally, the process conditions result in selective etching of the {110} plane of the crystal planes, which corresponds to the sidewalls of each of the fins. As such, the methods described herein provide a way to grow or etch epitaxial films at different crystal planes. Furthermore, the methods described herein allow for simultaneous epitaxial film growth and etch to occur on the different crystal planes.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: April 2, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yi-Chiau Huang, Chen-Ying Wu, Abhishek Dube, Chia Cheng Chin, Saurabh Chopra