Abstract: The feature of the present invention is a heatspreader that is attached over a die instead of being set under the die to improve the efficient of spreading heat. A package includes a semiconductor die mounted to a die receiving area of a substrate. The die and a portion of the substrate are connected by using a conventional die attach material. A plurality of bonding wires are attached on the die. Further, conductive traces are on the top surface of the substrate. The die is electrically coupled to conductive traces by the bonding wires, a TAB method or a flip chip method. A plurality of conductive vias are also need for electrically coupling conductive traces on the top surface of the substrate to those on the bottom. Typically, at an end of portion of each conductive trace on the bottom of the substrate is an conductive pad for connecting to a solder ball. The die and portions of the substrate are encapsulated in a package body. A heatspreader is exactly set over the semiconductor die for spreading heat.