Abstract: A lithographic apparatus in which alignment marks on the substrate are inspected during the exposure of the substrate to optimize the exposure conditions.

Abstract: In an embodiment, a ring seal forming apparatus is disclosed, the apparatus including a substrate holder arranged to hold a substrate coated at least in part with resist, and a heating device configured to heat an area of the resist, relative movement between the substrate holder and heating device being possible, the movement being arranged such that, in use of the apparatus, the area of resist heated by the heating device is ring-shaped.

Abstract: In an embodiment, a ring seal forming apparatus is disclosed, the apparatus including a substrate holder arranged to hold a substrate coated at least in part with resist, and a deep ultraviolet radiation outlet configured to irradiate an area of the resist, relative movement between the substrate holder and the deep ultraviolet radiation outlet being possible, the movement being arranged such that, in use of the apparatus, the area of resist irradiated by the deep ultraviolet radiation outlet is ring-shaped.

Abstract: A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.

Abstract: A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.

Abstract: A lithographic method and apparatus used to pattern an object. An illumination system supplies a beam of radiation. An array of individually controllable elements patterns the beam. The patterned beam is projected by a projection system on to a substrate supported on a substrate table. Individual elements of the array are periodically addressed to load an image frame on to the array appropriate to the pattern to be imparted to the beam at any given instant in time taking into account the image to be projected onto the substrate. In any given frame loading operation, only those individual controllable elements that must change state are addressed to reduce the amount of data required to be transferred during the frame loading operation.

Abstract: A lithographic method includes patterning a beam of radiation with a patterning device. The patterning device includes at least two image patterning portions and at least two metrology mark patterning portions. The method also includes projecting at least two image portions of the patterned beam of radiation sequentially onto target portions of a substrate such that the projected image portions are substantially adjacent to each other on the substrate and collectively form a composite image on the substrate. The method also includes projecting a metrology mark onto the substrate outside of the area of the composite image at the same time as projecting each of at least two of the image portions, and measuring the alignment of the metrology marks to determine the relative positions of the at least two image portions.

Abstract: An arrangement for adjusting the position on a substrate of a patterned beam generated by a light engine relative to the substrate. The arrangement moves an array of focusing elements, each of which focuses a portion of the patterned beam onto a point on the substrate, relative to an array of individually controllable elements to impart the pattern to the patterned beam.

Abstract: A method for locating, forming, or both locating and forming, bumps of material on a substrate having a plurality of devices, the method includes receiving data which indicates the number and location of the devices on the substrate, then using a flip-chip bumping apparatus to locate, form, or both locate and form, bumps of material on the devices, the positions of the devices being determined using the data.

Abstract: A lithographic apparatus comprises an illumination system for supplying a beam of radiation, a patterning arrangement incorporating an array of individually controllable elements for imparting a pattern to the beam cross-section, a substrate table for supporting a substrate, and a projection system incorporating a microlens array for projecting the beam onto a target portion of the substrate. An error compensator is provided for supplying error correction values for compensating for the effect of positional errors in the microlens array, and a grey scale modulator is provided for supplying drive signals to controllable elements of the patterning arrangement in dependence on the error correction values in order to compensate for the effect of positional errors in the microlens array by varying the intensity of some parts of the pattern relative to other parts of the pattern.

Abstract: Provided is a radiation distribution system for distributing the radiation from an illumination system to two or more patterning means, each for patterning beams of radiation, which are subsequently projected onto a substrate.

Abstract: An exposure system for manufacturing flat panel displays (FPDs) includes a reticle stage adapted to support a reticle. A substrate stage is adapted to support a substrate. A reflective optical system is adapted to image the reticle onto the substrate. The reflective optical system includes a primary mirror including a first mirror and a second mirror, and a secondary mirror. The reflective optical system has sufficient degrees of freedom for both alignment and correction of third order aberrations when projecting an image of the reticle onto the substrate by reflections off the first mirror, the secondary mirror, and the second mirror.

Abstract: In one method of compensating for the distortion of front-to-backside alignment optics, a displacement vector between the estimated position of a substrate mark and the actual position of a substrate mark is calculated. An optical correction array is also calculated by moving a reference substrate by a fixed amount and comparing how far an image of a point on the back side of a reference substrate moves to how far a corresponding point on the front side of the substrate moves. The displacement vector and optical correction array may then be used to accurately calculate the position of further substrates.

Abstract: A lithographic apparatus includes an illumination system that supplies a beam of radiation, an array of individually controllable elements that pattern the beam, a substrate table for supporting a substrate, and a projection system that projects the patterned beam onto a target portion of the substrate. The projection system comprises an array of lenses arranged to receive the patterned beam, divide the patterned beam into a plurality of substantially polygonal portions, and focus each substantially polygonal portion to form a respective radiation spot on the target portion of the substrate. In one example, the illumination system comprises an illuminator arranged to receive a beam of radiation from a radiation source, the illuminator comprising an array of lenses arranged to divide the beam of radiation from the source into a plurality of substantially polygonal portions and to focus each substantially polygonal portion onto a respective one of the array of individually controllable elements.

Abstract: A lithographic apparatus and method in which an illumination system supplies a projection beam, a patterning system imparts to the beam a pattern in its cross section, and a projection system projects the patterned beam onto a target portion of a substrate. The projection system comprises an array of lenses spaced from the substrate such that each lens in the array focuses part of the patterned beam onto the substrate. A displacement system causes displacement between the lens array and the substrate. A particle detector detects particles on the substrate which are approaching the lens array. A free working distance control system increases the spacing between the lens array and the substrate in response to detection of a particle. The lens array is moved away from the substrate as the detected particle passes the lens array. Thus damage to the lens array can be avoided.

Abstract: A lithographic apparatus comprises an illumination system for supplying a beam of radiation, a patterning arrangement incorporating an array of individually controllable elements for imparting a pattern to the beam cross-section, a substrate table for supporting a substrate, and a projection system incorporating a microlens array for projecting the beam onto a target portion of the substrate. An error compensator is provided for supplying error correction values for compensating for the effect of positional errors in the microlens array, and a grey scale modulator is provided for supplying drive signals to controllable elements of the patterning arrangement in dependence on the error correction values in order to compensate for the effect of positional errors in the microlens array by varying the intensity of some parts of the pattern relative to other parts of the pattern.

Abstract: An optical element is placed in the alignment beam during alignment. The optical element serves to focus the alignment beam onto the substrate alignment mark when it is at a different focal length from the front surface of the substrate.

Abstract: Provided is a radiation distribution system for distributing the radiation from an illumination system to two or more patterning means, each for patterning beams of radiation, which are subsequently projected onto a substrate.

Abstract: Provided is a method and system for facilitating use of a plurality of individually controllable elements to modulate the intensity of radiation received at each focusing element of an array of focusing elements to control the intensity of the radiation in the areas on the substrate onto which the focusing elements direct the radiation.

Abstract: A system and method use a pattern generator to pattern illumination that is projected using an adjustable projection system to form one or more devices on a substrate. The adjustable projection system includes at least one active mirror, which is adjusted to compensate for errors found on a surface of the pattern generator, the substrate, and or an optical element in the lithography system. In one example, the adjustable projection system includes two concave and one convex mirrors, while in another system the adjustable projection system also includes one or two fold mirrors. At least one of the mirrors in these two examples is an active mirror, which is used for the compensating. In this arrangement, local focus and/or magnification errors can be substantially reduced or eliminated.