Abstract: A lithographic apparatus and method for projecting a patterned beam onto a substrate. An illumination system supplies a projection beam of radiation. A pattern is imparted to the projection beam, for example by an array of individually controllable elements. The substrate is supported on a substrate table and the patterned beam is projected onto a target portion of the substrate by a projection system. The projection system defines a pupil between the patterning system and the substrate table and a series of lens components are located between the pupil and the substrate table. The lens components comprise a beam expander, for expanding the beam from the pupil, and an array of lenses extending transversely relative to the beam such that each lens of the array focuses a respective portion of the projection beam onto a respective part of the target portion of the substrate.

Abstract: An exposure system for manufacturing flat panel displays (FPDs) includes a reticle stage and a substrate stage. A magnification ringfield reflective optical system images the reticle onto the substrate. The system may be a 2× magnification system, or another magnification that is compatible with currently available mask sizes. By writing reticles with circuit pattern dimensions that are one-half the desired size for an FPD, a 2× optical system can be used to expose FPDs. The designs for the 1.5× and larger magnification optical systems all typically have at least three powered mirrors. A corrector, positioned either near the reticle or near the substrate, can be added to the three mirror design to improve the systems optical performance. The corrector may be a reflective, or a refractive design. The corrector can have an aspheric surface, and optionally a powered surface. The corrector may be a flat glass plate, or a lens having concave-convex, concave-concave or convex-convex surfaces.

Abstract: A lithographic apparatus and method in which a patterning system is used to impart to a projection beam a pattern in its cross-section. The beam is directed by a projection system from an illumination system onto a target portion of the surface of a substrate supported on a substrate support. The target portion has predetermined spatial characteristics relative to the substrate table that are appropriate for a desired exposure pattern on the surface of the substrate. The temperature of the substrate is measured, and the dimensional response of the substrate to the measured temperature is calculated. The spatial characteristics of the target portion relative to the substrate table are adjusted to compensate for the calculated dimensional response.

Abstract: A system and method are used to form features on a substrate. The system and method include using a first array including individually controllable elements that selectively pattern a beam of radiation, a second array including sets of lenses and apertures stops that form an image from a respective one of the individually controllable elements in a first plane, a third array including lenses that form an image from a respective one of the second array in a second plane, and a substrate table that holds a substrate in the second plane, such that the substrate receives the image from the respective one of the second array. A same spacing is formed between elements in the first, second, and third arrays.

Abstract: A system and method are used to form features on a substrate. The system and method include using a first array including individually controllable elements that selectively pattern a beam of radiation, a second array including sets of lenses and apertures stops that form an image from a respective one of the individually controllable elements in a first plane, a third array including lenses that form an image from a respective one of the second array in a second plane, and a substrate table that holds a substrate in the second plane, such that the substrate receives the image from the respective one of the second array. A same spacing is formed between elements in the first, second, and third arrays.

Abstract: An arrangement for adjusting the position on a substrate of a patterned beam generated by a light engine relative to the substrate. The arrangement moves an array of focusing elements, each of which focuses a portion of the patterned beam onto a point on the substrate, relative to an array of individually controllable elements to impart the pattern to the patterned beam.

Abstract: To calibrate a front-to-backside alignment system a transparent calibration substrate with reference markers on opposite sides is used. A plane plate is inserted to displace the focal position of the alignment system from the top to bottom surface of the calibration substrate.

Abstract: Provided is a method and system for facilitating use of a plurality of individually controllable elements to modulate the intensity of radiation received at each focusing element of an array of focusing elements to control the intensity of the radiation in the areas on the substrate onto which the focusing elements direct the radiation.

Abstract: Provided is a radiation distribution system for distributing the radiation from an illumination system to two or more patterning means, each for patterning beams of radiation, which are subsequently projected onto a substrate.

Abstract: To align between layers having a large Z separation, an alignment system which illuminates reference markers with normally incident radiation is used. The alignment system has an illumination system that is telecentric on the substrate side.

Abstract: In one method of compensating for the distortion of front-to-backside alignment optics, a displacement vector between the estimated position of a substrate mark and the actual position of a substrate mark is calculated. An optical correction array is also calculated by moving a reference substrate by a fixed amount and comparing how far an image of a point on the back side of a reference substrate moves to how far a corresponding point on the front side of the substrate moves. The displacement vector and optical correction array may then be used to accurately calculate the position of further substrates.

Abstract: A lithographic projection apparatus comprises a microlens array for generating a plurality of source images in a two-dimensional array, a programmable patterning means having a plurality of addressable elements acting as shutters for the source images and a projection subsystem for projecting a n image of the array of source images onto a substrate.

Abstract: A lithographic apparatus in which alignment marks on the substrate are inspected during the exposure of the substrate to optimize the exposure conditions.

Abstract: An exposure system for manufacturing flat panel displays (FPDs) includes a reticle stage adapted to support a reticle. A substrate stage is adapted to support a substrate. A reflective optical system is adapted adapted to image the reticle onto the substrate. The reflective optical system includes a primary mirror including a first mirror and a second mirror, and a secondary mirror. The reflective optical system has sufficient degrees of freedom for both alignment and correction of third order aberrations when projecting an image of the reticle onto the substrate by reflections off the first mirror, the secondary mirror, and the second mirror.

Abstract: A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer. Simultaneous alignment between marks on the back and front of the wafer and a mask can be performed using a pre-existing alignment system.

Abstract: A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer.

Abstract: A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer.

Abstract: An optical element is placed in the alignment beam during alignment. The optical element serves to focus the alignment beam onto the substrate alignment mark when it is at a different focal length from the front surface of the substrate.

Abstract: To align between layers having a large Z separation, an alignment system which illuminates reference markers with normally incident radiation is used. The alignment system has an illumination system that is telecentric on the substrate side.

Abstract: To calibrate a front-to-backside alignment system a transparent calibration substrate with reference markers on opposite sides is used. A plane plate is inserted to displace the focal position of the alignment system from the top to bottom surface of the calibration substrate.