Patents by Inventor Chi-Hao Chang

Chi-Hao Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11401992
    Abstract: An energy dampener for use in an electronic device can include a carbon nanotube-aerogel matrix, including carbon nanotubes embedded in an aerogel and a rubber composited with the carbon nanotube-aerogel matrix.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: August 2, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chung-Hua Ku, Chi-Hao Chang
  • Patent number: 11402703
    Abstract: An example device includes a light source, a liquid crystal layer, and an array of pixel electrodes disposed between the light source and the liquid crystal layer. The array of pixel electrodes is to control orientation of liquid crystal of the liquid crystal layer to modulate light incident from the light source to produce an image composed of pixels. The example device further includes an array of scattering electrodes to selectively influence orientation of liquid crystal of the liquid crystal layer to degrade contrast of selected pixels of the image.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: August 2, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Chi Hao Chang, Ann Alejandro Villegas
  • Publication number: 20220210940
    Abstract: Examples of a dual injection-molded metal substrate have been described. In an example, a dual injection-molded metal substrate includes a magnesium alloy layer injection-molded on a portion of a first surface of an injection-molded aluminum alloy substrate.
    Type: Application
    Filed: September 6, 2019
    Publication date: June 30, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chi Hao Chang, Kuo Chih Huang, Kuan-Ting Wu
  • Publication number: 20220162766
    Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.
    Type: Application
    Filed: August 14, 2019
    Publication date: May 26, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hslng-Hung Hsieh
  • Publication number: 20220152649
    Abstract: Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.
    Type: Application
    Filed: May 7, 2019
    Publication date: May 19, 2022
    Applicant: Hewlett-Packard Development, L.P.
    Inventors: Chi Hao Chang, Ya-Ting Yeh, Chih-Hsiung Liao, Kuan-Ting Wu
  • Publication number: 20220148484
    Abstract: In some examples, a display comprises a first side, where the first side comprises a first portion of pixels that emit light to the first side of the display and a second portion of pixels, where a first subset of the second portion of pixels emit light to the first side of the display, and a second side comprising a second subset of the second portion of pixels that emit light to the second side of the display, where the first portion of pixels has a pixel density and the second portion of pixels has a pixel density.
    Type: Application
    Filed: July 29, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi Hao Chang
  • Publication number: 20220145488
    Abstract: The present disclosure is drawn to a multi-color electronic housing. The multi-color electronic housing can include a metal alloy having a first portion that can be milled, plasma-treated, and can include an electrodeposited colorant thereon. The metal alloy can further have a second portion that can be milled, plasma-treated, and can include second electrodeposited colorant thereon. The first electrodeposited colorant can provide a different coloration than the second electrodeposited colorant.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing-Hung Hsieh
  • Publication number: 20220147118
    Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate with an opening therethrough, and a first protective coating covering the light metal substrate. A second protective coating is on the first protective coating, and a chamfered edge is present along the opening where the chamfer cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge. In one example, a transparent passivation layer is included along the chamfered edge.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chi Hao Chang, Kuan-Ting Wu, Hui He
  • Publication number: 20220137680
    Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a substrate having an opening therethrough, or an outer edge, or both. A thermoplastic insert molding can include a metal oxide dopant, the thermoplastic insert molding positioned on the substrate. A paint coating can be included on the thermoplastic insert molding. A chamfered edge can be present on the substrate at a location that defines the opening, the outer edge, or both, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge. A metal layer can be formed using laser direct structuring masking a portion of the metal oxide dopant exposed at the chamfered edge. A second metal layer can be formed over the metal layer.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 5, 2022
    Applicant: Hewlett- Packard Development Company, L.P.
    Inventors: Chien-Ting Lin, Kuan-Ting Wu, Chi Hao Chang
  • Publication number: 20220119971
    Abstract: In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.
    Type: Application
    Filed: May 9, 2019
    Publication date: April 21, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Chienchih Chiu
  • Publication number: 20220112610
    Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate having at least a top surface and a bottom surface; a transparent passivation layer on the top surface of the metal cover substrate; a water-borne graphene coating layer on the transparent passivation layer; and an electrophoretic deposition coating layer on the water-borne graphene coating layer.
    Type: Application
    Filed: April 5, 2019
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing Hung Hsieh
  • Publication number: 20220112607
    Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.
    Type: Application
    Filed: June 11, 2019
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing-Hung Hsieh
  • Patent number: 11296173
    Abstract: In example implementations, a display is provided. The display includes a first portion and a second portion. The first portion includes a first plurality of light emitting diodes (LEDs) that emit light in a first direction. The second portion includes a combination of the first plurality of LEDs that emit light in the first direction and a second plurality of LEDs that emit light in a second direction that is opposite the first direction to form a dual-sided display.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Ann Alejandro Villegas, Chi Hao Chang
  • Publication number: 20220066512
    Abstract: Examples include an apparatus comprising a laptop housing, an elastomer layer fixed on a surface of the laptop housing, and a fabric layer fixed on the elastomer layer.
    Type: Application
    Filed: February 19, 2018
    Publication date: March 3, 2022
    Inventors: HUI HE, HUI LENG LIM, CHI HAO CHANG, KUAN-TING WU
  • Publication number: 20220066581
    Abstract: A panel for a touch screen of an electronic device is described. The panel comprises a substrate having a central area for operating the touch screen and a border area at an edge of the central area. The border area comprises a decorative image on the substrate and an outer surface coating overlying the decorative image. The decorative image comprises a non-conductive metallic coating. The outer surface coating comprises a non-conductive, printed layer. A method for manufacturing the panel and an electronic device comprising a touch screen having the panel are also described.
    Type: Application
    Filed: January 9, 2019
    Publication date: March 3, 2022
    Inventors: CHUNG HUA KU, KUO-CHIH HUANG, CHI HAO CHANG, KUAN-TING WU
  • Publication number: 20220016869
    Abstract: The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.
    Type: Application
    Filed: March 27, 2019
    Publication date: January 20, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Ting Lin, Kuan-Ting Wu, Chi Hao Chang
  • Publication number: 20220007533
    Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate; a micro-arc oxidation layer or a non-transparent passivation treatment layer on a surface of the metal cover substrate; an outmold decoration layer on the micro-arc oxidation layer or the non-transparent passivation treatment layer, a chamfered edge including a chamfer at an edge of the metal cover substrate, wherein the chamfer cuts through the micro-arc oxidation layer or the non-transparent passivation treatment layer and the outmold decoration layer to expose the metal cover substrate at the chamfered edge; a transparent passivation layer on the chamfered edge where the metal cover substrate is exposed; and a protective coating on the transparent passivation layer.
    Type: Application
    Filed: March 28, 2019
    Publication date: January 6, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Chalam Kashyap
  • Publication number: 20210394233
    Abstract: The present disclosure is drawn to printed foam panels for electronic devices. In one example, a printed foam panel for an electronic device can include a substrate, a primer layer on the substrate, a foam pattern on the primer layer, and a clear coating layer on the foam pattern. The foam pattern can cover a first portion of the substrate and leave a second portion uncovered. The foam pattern can include a printed pattern of a foaming composition including a photoacid generator compound and a metal carbonate activated to form the foam pattern.
    Type: Application
    Filed: February 1, 2019
    Publication date: December 23, 2021
    Inventors: CHI HAO CHANG, KUAN-TING WU, CHENG-FENG LIAO
  • Publication number: 20210363646
    Abstract: The application discloses examples of a device housing of an electronic device comprising a magnesium-alloy substrate. The device housing further comprising a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.
    Type: Application
    Filed: July 24, 2018
    Publication date: November 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chi Hao Chang, Ya-Ting Yeh, Kuan-Ting Wu, Chih-Hsiung Liao
  • Patent number: 11164510
    Abstract: The present subject matter relates to display screens. In an example, a display screen includes a first set of pixels, where micro-LEDs of the first set of pixels are to emit light in a first direction from the display screen, and a second set of pixels, where micro-LEDs of the second set of pixels are to emit light in a second direction from the display screen. The second direction is different from the first direction.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: November 2, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Kuang Chu, Kuan-Ting Wu, Chi-Hao Chang