Abstract: The present disclosure discloses a positive electrode active material for a lithium secondary battery comprising a secondary particle having an average particle size (D50) of 1 to 15 ?m, formed by agglomeration of at least two primary macro particles having an average particle size (D50) of 0.1 to 3 ?m; and a coating layer of a lithium-metal oxide on a surface of the secondary particle, wherein the primary macro particles are represented by LiaNi1-x-yCoxM1yM2wO2 (1.0?a?1.5, 0?x?0.2, 0?y?0.2, 0?w?0.1, 0?x+y?0.2, M1 includes at least one metal of Mn or Al, and M2 includes at least one metal selected from the group consisting of Ba, Ca, Zr, Ti, Mg, Ta, Nb and Mo), and wherein the lithium-metal oxide is a low-temperature phase LixCoO2(0<x?1) having at least one of a spinel structure (Fd-3m) or a disordered rock-salt structure (Fm-3m).

Abstract: A method of manufacturing a semiconductor chip from a wafer having a test architecture includes forming a plurality of dies on a wafer, each of the plurality of dies including a semiconductor device, forming at least two common pads commonly coupled to the dies, the at least two common pads being formed in a scribe lane, the scribe lane distinguishing the dies with respect to each other, and simultaneously testing the semiconductor devices at a wafer level, using the at least two common pads.

Abstract: A method of manufacturing a semiconductor chip from a wafer having a test architecture includes forming a plurality of dies on a wafer, each of the plurality of dies including a semiconductor device, forming at least two common pads commonly coupled to the dies, the at least two common pads being formed in a scribe lane, the scribe lane distinguishing the dies with respect to each other, and simultaneously testing the semiconductor devices at a wafer level, using the at least two common pads.

Abstract: The method of detecting the bit line bridge in a semiconductor memory device includes enabling a sensing state for an even bit line connected to an even sense amplifier and an odd bit line connected to an odd sense amplifier, where the odd bit line is adjacent to the even bit line, first changing the odd bit line to a pre-charge state to pre-charge the odd bit line while maintaining the sensing state of the even bit line, second changing the odd bit line to a floating state, and applying a pause time period.

Abstract: A bridge defect detecting method performed in a semiconductor memory device that includes a plurality of memory cells arranged at intersections between a plurality of word lines and a plurality of bit lines and a plurality of sense amplifiers connected to the bit lines, includes the operations of: enabling a first sense amplifier and a second sense amplifier; keeping the first sense amplifier in an enabled state and disabling the second sense amplifier; enabling the second sense amplifier, and detecting a bridge defect between the first memory cell and the second memory cell by reading data from a first memory cell of a first bit line connected to the first sense amplifier and a second memory cell of a second bit line connected to the second sense amplifier.

Abstract: A method of regulating timing of control signals in an integrated circuit memory device includes generating a pulse signal having a pulse width representing a time period between a rising edge of a first control signal and a rising edge of a second control signal that is activated after the first control signal. Based on the pulse width of the pulse signal, it is determined whether a timing margin between activation of the first control signal and activation of the second control signal is within a predetermined range, and the timing margin is adjusted responsive to the determination.

Abstract: A semiconductor memory device comprises a local sense amplifier connected between a bit line sense amplifier and a current sensing type input/output (IO) sense amplifier. The bit line sense amplifier is connected between a bit line pair, the bit line pair is connected to a local data IO pair, and the local data IO pair is connected to a global data IO pair via a pair of switching circuits. During a read operation of the semiconductor memory device, the local data IO pair remains connected to the global data IO pair.

Abstract: A fuse circuit can include a cut-off unit circuit configured to electrically isolate a fuse from an input to a status information circuit after latching of status information associated with status of the fuse. Other fuse related circuits and methods are disclosed.

Abstract: An output buffer includes an output terminal, a pull up module, a pull down module and an output latching module. The pull up module pulls up the output terminal to a first source voltage when the pull up module is active. The pull down module pulls down the output terminal to a second source voltage when the pull down module is active. The output latching module latches a data signal in response to a state of an output clock signal in a first operation mode. The output latching module latches the data signal in response to a leading edge of the output clock signal in a second operation mode. The output latching module drives the pull up module and the pull down module in response to the data signal latched by the output latching module, so that the output latching module outputs the data signal to the output terminal in a second operation mode.

Abstract: A semiconductor memory device with improved operational performance by reducing the level variation of first and second power voltages applied to a sense amplifier by efficiently locating a decoupling capacitor. The decoupling capacitor is arranged on an empty region of a plurality of the first and second sense amplifiers and connected between the first and second power voltage lines. A plurality of global data I/O line pairs is arranged perpendicular to the direction of a plurality of local data I/O line pairs.

Abstract: In a boosted voltage generating circuit of a semiconductor memory device, an active kicker drive signal generating circuit generates an active kicker drive signal having a first pulse duration in response to a row active command, and generates the active kicker drive signal having a second pulse duration in response to a refresh command. An active kicker circuit is responsive to the active kicker drive signal to generate the boosted voltage. The second pulse duration may be greater than the first pulse duration, which makes it possible to improve the pumping efficiency of the boosted voltage in a refresh operation.

Abstract: A memory device includes a memory cell array block including memory cells, a word line driver block adjacent the memory cell array block disposed in a direction in which word lines of the memory cells are arranged, a sense amplifier block adjacent the memory cell array block disposed in a direction in which bit lines of the memory cells are arranged, a conjunction block disposed at an intersection of the word line driver block and the sense amplifier block, an equalizer for equalizing a pair of local data lines, the equalizer disposed in the conjunction block, and a local data line sense amplifier configured to sense and amplify signals on a pair of local data lines, and having transistors of a first type disposed in the conjunction block and transistors of a second type disposed in the sense amplifier block.

Abstract: A bridge defect detecting method performed in a semiconductor memory device that comprises a plurality of memory cells arranged at intersections between a plurality of word lines and a plurality of bit lines and a plurality of sense amplifiers connected to the bit lines, includes the operations of: enabling a first sense amplifier and a second sense amplifier; keeping the first sense amplifier in an enabled state and disabling the second sense amplifier; enabling the second sense amplifier, and detecting a bridge defect between the first memory cell and the second memory cell by reading data from a first memory cell of a first bit line connected to the first sense amplifier and a second memory cell of a second bit line connected to the second sense amplifier.

Abstract: A redundancy repair circuit and method therefor for use with a semiconductor memory device are provided. The redundancy repair circuit comprises: a memory circuit having a plurality of address lines and a plurality of redundancy address lines in a memory cell; a repair redundancy control circuit for repairing a defective address line using a redundancy address line of the plurality of redundancy address lines, and for encoding and outputting fuse repair information corresponding to redundancy address information, wherein addresses corresponding to defective memory cells are pre-programmed; and a redundancy line driver for receiving the fuse repair information from the repair redundancy control circuit, for decoding the fuse repair information and for activating a redundancy line corresponding to the decoded fuse repair information, wherein the repair redundancy control circuit is separate from the redundancy line driver.

Abstract: A semiconductor memory device comprises a local sense amplifier connected between a bit line sense amplifier and a current sensing type input/output (IO) sense amplifier. The bit line sense amplifier is connected between a bit line pair, the bit line pair is connected to a local data IO pair, and the local data IO pair is connected to a global data IO pair via a pair of switching circuits. During a read operation of the semiconductor memory device, the local data IO pair remains connected to the global data IO pair.

Abstract: A method of regulating timing of control signals in an integrated circuit memory device includes generating a pulse signal having a pulse width representing a time period between a rising edge of a first control signal and a rising edge of a second control signal that is activated after the first control signal. Based on the pulse width of the pulse signal, it is determined whether a timing margin between activation of the first control signal and activation of the second control signal is within a predetermined range, and the timing margin is adjusted responsive to the determination.

Abstract: A substrate voltage generating circuit for use in a semiconductor memory device is provided. The semiconductor memory device includes a charge pump for generating a substrate bias voltage in response to a clock signal; a first inverter type detector for detecting whether the substrate bias voltage reaches a target voltage; a second differential amplifier type detector for detecting whether the substrate bias voltage reaches the target voltage; and a driver for generating the clock signal in response to an output of one of the first and second detectors.

Abstract: Semiconductor memory devices include a memory cell array region having a plurality of memory cells, a local data I/O line pair that is electrically connected to the plurality of memory cells, a local sense amplifier that is electrically connected to the local data I/O line pair, a read global data I/O line pair that is electrically connected to the local sense amplifier and that is configured to transmit data during a read operation and a write global data I/O line pair that is electrically connected to the local sense amplifier that is configured to transmit data during a write operation.

Abstract: A memory device includes a memory cell array block including memory cells, a word line driver block adjacent the memory cell array block disposed in a direction in which word lines of the memory cells are arranged, a sense amplifier block adjacent the memory cell array block disposed in a direction in which bit lines of the memory cells are arranged, a conjunction block disposed at an intersection of the word line driver block and the sense amplifier block, an equalizer for equalizing a pair of local data lines, the equalizer disposed in the conjunction block, and a local data line sense amplifier configured to sense and amplify signals on a pair of local data lines, and having transistors of a first type disposed in the conjunction block and transistors of a second type disposed in the sense amplifier block.

Abstract: Method and apparatus for use, e.g., with Synchronous Dynamic Random Access Memory (SDRAM) circuits are disclosed. In one described embodiment, three metal layers are deposited and patterned in turn overlying a memory array portion of an SDRAM. Relatively wide power conductors are routed on a third metal layer, allowing power conductors to be reduced in size, or in some cases eliminated, on first and second metal layers. The relatively wide power conductors thus can provide a more stable power supply to the memory array, and also free some space on first and/or second metal for routing of additional and/or more widely spaced signal conductors. Other embodiments are described and claimed.