Patents by Inventor Chia-Liang Hsu

Chia-Liang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136463
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 25, 2024
    Applicant: EPISTAR CORPORATION
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 11923433
    Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Liang Pan, Yungtzu Chen, Chung-Chieh Lee, Yung-Chang Hsu, Chia-Yang Hung, Po-Chuan Wang, Guan-Xuan Chen, Huan-Just Lin
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 11894481
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body having a topmost surface; a first light-emitting device disposed on the carrier body and having a light-emitting surface; and a light-receiving device comprising a group III-V semiconductor material disposed on the carrier body and having a light-receiving surface. The light-emitting surface is separated from the topmost surface by first distant H1, the light-receiving surface is separated from the topmost surface by a second distance H2, and H1 is different from H2.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: February 6, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Yi-Chieh Lin, Shiuan-Leh Lin, Yung-Fu Chang, Shih-Chang Lee, Chia-Liang Hsu, Yi Hsiao, Wen-Luh Liao, Hong-Chi Shih, Mei-Chun Liu
  • Publication number: 20230207581
    Abstract: An optical sensing device is provided. The optical sensing device includes a substrate, a housing, a light receiver, and an optical structure. The housing is disposed on an upper surface of the substrate, and the housing and the substrate collectively define a cavity. The light receiver is disposed in the cavity, and the housing surrounds the light receiver. The optical structure is disposed on an upper surface of the light receiver, and the optical structure includes a plurality of concave portions and a plurality of convex portions. The concave portions and the convex portions are alternately arranged to form an array, and a light transmittance of the concave portions is greater than a light transmittance of the convex portions.
    Type: Application
    Filed: December 28, 2022
    Publication date: June 29, 2023
    Inventors: Jian-Yu SHEN, Chia-Liang HSU
  • Patent number: 11475597
    Abstract: A calibrating device of calibrating a real-time image through a dithering process including a receiving unit, a storing unit, a displacing module, a computing module, and an outputting unit is disclosed. The receiving unit receives a real-time image from an image sensor and records a time parameter of the image. The storing unit stores a hash table that records multiple hash values used to calibrate the image. The displacing module shifts the multiple hash values in the hash table to generate an adjusted hash table. The computing module obtains a corresponding hash value from the adjusted hash table for each pixel point of the image in accordance with the coordinates of each pixel point, and respectively adds the corresponding hash value to the pixel value of each pixel point of the image to generate a calibrated image. The outputting unit outputs the calibrated image.
    Type: Grant
    Filed: November 28, 2021
    Date of Patent: October 18, 2022
    Assignee: ML TECHNOLOGY LTD.
    Inventors: Chang-Yu Wang, Ying-Chang Tseng, Ching-Hung Liang, Chia-Liang Hsu
  • Publication number: 20220254051
    Abstract: A testing system for an image processing algorithm including a control unit, an image processing device, an image processing hardware, and a testing device is disclosed. The control unit provides an original image and parameters. The image processing device obtains the original image and the parameters, and drives the image processing hardware to perform a first image processing procedure to the original image based on the parameters to generate a hardware-processed image. The testing device obtains the original image, the parameters, and the hardware-processed image, and performs, through a simulation software, a second image processing procedure to the original image based on the parameters to generate a software-processed image. The testing device compares the hardware-processed image with the software-processed image through a testing software to generate a comparing result that shows a pixel difference of the hardware-processed image and the software-processed image.
    Type: Application
    Filed: November 27, 2021
    Publication date: August 11, 2022
    Inventors: Chi-Heng LU, Chia-Liang HSU, Ching-Hung LIANG, Chang-Yu WANG, Ming-Chen HSU
  • Publication number: 20220117557
    Abstract: A wearable optoelectronic sensing device includes a textile layer, a substrate layer, a light emitter, a plurality of light receivers, and a cover layer. The substrate layer is disposed on the textile layer. The plurality of light receivers is disposed on the surface of the substrate layer, formed as an array, and includes a first light receiver and a second light receiver. The light emitter is disposed at a geometric center of the array. A sensing wavelength of the second light receiver is greater than that of the first light receiver. A distance between the second light receiver and the light emitter is greater than a distance between the first light receiver and the light emitter. The cover layer is disposed on the substrate layer and includes a plurality of openings; the position of each corresponds to position of the light emitter and the position of each light receiver.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 21, 2022
    Inventors: Chia-Liang HSU, Jian-Yu SHEN
  • Publication number: 20220059717
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body having a topmost surface; a first light-emitting device disposed on the carrier body and having a light-emitting surface; and a light-receiving device comprising a group III-V semiconductor material disposed on the carrier body and having a light-receiving surface. The light-emitting surface is separated from the topmost surface by first distant H1, the light-receiving surface is separated from the topmost surface by a second distance H2, and H1 is different from H2.
    Type: Application
    Filed: October 26, 2021
    Publication date: February 24, 2022
    Applicant: EPISTAR CORPORATION
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
  • Publication number: 20220050204
    Abstract: An embodiment of present application discloses a light sensing module for use with a reflector. The light sensing module includes a housing, an optical transceiver, and a shading hood. The housing includes a through hole. The optical transceiver includes a light source, a light sensor, and a separating wall. The light source is disposed in the housing for emitting a first light. The first light can pass through the housing via the through hole, and be reflected as a second light by the reflector. The light sensor is disposed in the housing for receiving the second light. The separating wall is disposed between the light source and the light sensor. The shading hood is located at a position corresponding to the light sensor, and has an opening positioned in an optical path of the second light.
    Type: Application
    Filed: August 11, 2021
    Publication date: February 17, 2022
    Inventors: Jian-Yu SHEN, Chia-Yu KANG, Chia-Liang HSU, Nguyen Ba SY
  • Patent number: 11158757
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 26, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Yi-Chieh Lin, Shiuan-Leh Lin, Yung-Fu Chang, Shih-Chang Lee, Chia-Liang Hsu, Yi Hsiao, Wen-Luh Liao, Hong-Chi Shih, Mei-Chun Liu
  • Patent number: 11139279
    Abstract: A light-emitting diode includes a transparent substrate with a first surface, a second surface opposite to the first surface, and a side surface connected to the first surface and the second surface; a first light-emitting structure; a second light-emitting structure; a connecting layer, connected to the first light-emitting structure and the second light-emitting structure; a circuit arranged between the transparent substrate and the first light-emitting structure, and having a portion formed on the first surface without extending to the second surface; and a structure with diffusers, covering the first light-emitting structure and the second light-emitting structure on the first surface without crossing over the side surface.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: October 5, 2021
    Assignee: EPISTAR CORPORATION
    Inventor: Chia-Liang Hsu
  • Patent number: 10985301
    Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: April 20, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chung
  • Patent number: 10838895
    Abstract: A processing method of data redundancy is utilized for a Non-Volatile Memory express (NVMe) to transfer data via a fabric channel from a host terminal to a Remote-direct-memory-access-enable Network Interface Controller (RNIC) and a Just a Bunch of Flash (JBOF). The processing method comprises virtualizing a Field Programmable Gate Array (FPGA) of the RNIC into a Dynamic Random Access Memory (DRAM) and storing the data to the DRAM; replicating or splitting the data into a plurality of data packets and reporting a plurality of virtual memory addresses corresponding to the plurality of data packets to the RNIC by the FPGA; and reading and transmitting the plurality of data packets to a plurality of corresponding NVMe controllers according to the plurality of virtual memory addresses; wherein the FPGA reports to the RNIC that a memory size of the FPGA is larger than that of the DRAM.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: November 17, 2020
    Assignee: Wiwynn Corporation
    Inventors: Pei-Ling Yu, Chia-Liang Hsu, Bing-Kun Syu
  • Patent number: 10714656
    Abstract: The present disclosure provides a method for making a light-emitting device. The method includes steps of providing a first substrate; forming a first semiconductor layer on the first substrate; providing a second substrate; forming an intermediate layer on the second substrate, wherein a refractive index of the intermediate layer is between a refractive index of the second substrate and a refractive index of the first semiconductor layer; and bonding the first semiconductor layer and the intermediate layer.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: July 14, 2020
    Assignee: EPISTAR CORPORATION
    Inventor: Chia-Liang Hsu
  • Patent number: 10698638
    Abstract: A data transmission method for transmitting first data to a plurality of physical remote target devices by a host system is provided. The method includes: generating a transmission instruction to transmit the first data to a network interface controller of the host system; transforming the first data into a plurality of second data and respectively recording the plurality of second data in a plurality of memory addresses of a memory of the network interface controller; and instructing the plurality of physical remote target devices to acquire the plurality of second data respectively from the plurality of memory addresses of the memory. In addition, a host system using the data transmission method is also provided.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: June 30, 2020
    Assignee: Wiwynn Corporation
    Inventors: Pei-Ling Yu, Chia-Liang Hsu, Bing-Kun Syu
  • Patent number: 10693039
    Abstract: A light-emitting device comprises a light-emitting stack; a reflective structure comprising a reflective layer on the light-emitting stack and a first insulating layer covering the reflective layer; and a first conductive layer on the reflective structure; wherein the first insulating layer isolates the reflective layer from the first conductive layer.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: June 23, 2020
    Assignee: Epistar Corporation
    Inventors: Wen-Luh Liao, Shao-Ping Lu, Hung-Ta Cheng, Shih-I Chen, Chia-Liang Hsu, Shou-Chin Wei, Ching-Pei Lin, Yu-Ren Peng, Chien-Fu Huang, Wei-Yu Chen, Chun-Hsien Chang
  • Publication number: 20200168757
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 28, 2020
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU