Patents by Inventor Chia-Liang Hsu
Chia-Liang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10651069Abstract: An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening; and an elevating unit connecting the platform and the positioning unit; and a heater.Type: GrantFiled: August 1, 2017Date of Patent: May 12, 2020Assignee: EPISTAR CORPORATIONInventors: Chih-Wei Wei, Chia-Liang Hsu
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Patent number: 10566509Abstract: A light-emitting structure includes a semiconductor light-emitting element, a first connection point and a reflective element. The semiconductor light-emitting element includes a bottom surface, a top surface opposite to the bottom surface, and a side surface arranged between the bottom surface and the top surface. The first connection point is arranged on the bottom surface. The reflective element includes a first portion arranged right beneath the bottom surface, and a second portion not overlapping the bottom surface and uplifted from a lower elevation lower than the bottom surface to a higher elevation substantially equal to that of the top surface along a curved path.Type: GrantFiled: August 28, 2017Date of Patent: February 18, 2020Assignee: EPISTAR CORPORATIONInventor: Chia-Liang Hsu
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Patent number: 10553761Abstract: A light-emitting device includes a metal connecting structure; a metal reflective layer on the metal connecting structure; a barrier layer between the metal connecting structure and the metal reflective layer; a light-emitting stack on the metal reflective layer; a dielectric layer between the light-emitting stack and the metal reflective layer, and a first extension electrode and a second extension electrode on the light-emitting stack and away from the metal reflective layer. The dielectric layer includes a first part and a second part separated from the first part from a cross section of the light-emitting device. The first extension electrode and the second extension electrode respectively align with the first part and the second part. From a cross section of the light-emitting stack, the first extension electrode has a first width and the first part has a second width larger than the first width.Type: GrantFiled: January 28, 2019Date of Patent: February 4, 2020Assignee: Epistar CorporationInventors: Fu Chun Tsai, Wen Luh Liao, Shih I Chen, Chia Liang Hsu, Chih Chiang Lu
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Publication number: 20190303046Abstract: A data transmission method for transmitting first data to a plurality of physical remote target devices by a host system is provided. The method includes: generating a transmission instruction to transmit the first data to a network interface controller of the host system; transforming the first data into a plurality of second data and respectively recording the plurality of second data in a plurality of memory addresses of a memory of the network interface controller; and instructing the plurality of physical remote target devices to acquire the plurality of second data respectively from the plurality of memory addresses of the memory. In addition, a host system using the data transmission method is also provided.Type: ApplicationFiled: May 29, 2018Publication date: October 3, 2019Applicant: Wiwynn CorporationInventors: Pei-Ling Yu, Chia-Liang Hsu, Bing-Kun Syu
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Publication number: 20190244940Abstract: A light-emitting diode includes a transparent substrate with a first surface, a second surface opposite to the first surface, and a side surface connected to the first surface and the second surface; a first light-emitting structure; a second light-emitting structure; a connecting layer, connected to the first light-emitting structure and the second light-emitting structure; a circuit arranged between the transparent substrate and the first light-emitting structure, and having a portion formed on the first surface without extending to the second surface; and a structure with diffusers, covering the first light-emitting structure and the second light-emitting structure on the first surface without crossing over the side surface.Type: ApplicationFiled: April 19, 2019Publication date: August 8, 2019Inventor: Chia-Liang HSU
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Patent number: 10326065Abstract: The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.Type: GrantFiled: July 18, 2017Date of Patent: June 18, 2019Assignee: Epistar CorporationInventors: Min-Hsun Hsieh, Guan-Ru He, Chao-Hsing Chen, Jui-Hung Yeh, Chia-Liang Hsu
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Publication number: 20190172977Abstract: A light-emitting device includes a metal connecting structure; a metal reflective layer on the metal connecting structure; a barrier layer between the metal connecting structure and the metal reflective layer; a light-emitting stack on the metal reflective layer; a dielectric layer between the light-emitting stack and the metal reflective layer, and a first extension electrode and a second extension electrode on the light-emitting stack and away from the metal reflective layer. The dielectric layer includes a first part and a second part separated from the first part from a cross section of the light-emitting device. The first extension electrode and the second extension electrode respectively align with the first part and the second part. From a cross section of the light-emitting stack, the first extension electrode has a first width and the first part has a second width larger than the first width.Type: ApplicationFiled: January 28, 2019Publication date: June 6, 2019Inventors: Fu Chun TSAI, Wen Luh LIAO, Shih I CHEN, Chia Liang HSU, Chih Chiang LU
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Publication number: 20190155772Abstract: A processing method of data redundancy is utilized for a Non-Volatile Memory express (NVMe) to transfer data via a fabric channel from a host terminal to a Remote-direct-memory-access-enable Network Interface Controller (RNIC) and a Just a Bunch of Flash (JBOF). The processing method comprises virtualizing a Field Programmable Gate Array (FPGA) of the RNIC into a Dynamic Random Access Memory (DRAM) and storing the data to the DRAM; replicating or splitting the data into a plurality of data packets and reporting a plurality of virtual memory addresses corresponding to the plurality of data packets to the RNIC by the FPGA; and reading and transmitting the plurality of data packets to a plurality of corresponding NVMe controllers according to the plurality of virtual memory addresses; wherein the FPGA reports to the RNIC that a memory size of the FPGA is larger than that of the DRAM.Type: ApplicationFiled: April 11, 2018Publication date: May 23, 2019Inventors: Pei-Ling Yu, Chia-Liang Hsu, Bing-Kun Syu
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Patent number: 10230019Abstract: The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprises: a metal connecting structure; a barrier layer on the metal connecting structure, the barrier layer comprising a first metal multilayer on the metal connecting structure and a second metal multilayer on the first metal multilayer; a metal reflective layer on the barrier layer; and a light-emitting stack electrically coupled to the metal reflective layer, wherein the first metal multilayer comprises a first metal layer comprising a first metal material and a second metal layer comprising a second metal material, and the second metal multilayer comprises a third metal layer comprising a third metal material and a fourth metal layer comprising a fourth metal material.Type: GrantFiled: February 2, 2018Date of Patent: March 12, 2019Assignee: EPISTAR CORPORATIONInventors: Fu Chun Tsai, Wen Luh Liao, Shih I Chen, Chia Liang Hsu, Chih Chiang Lu
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Publication number: 20180287031Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.Type: ApplicationFiled: June 6, 2018Publication date: October 4, 2018Inventors: Shih-I CHEN, Chia-Liang HSU, Tzu-Chieh HSU, Han-Min WU, Ye-Ming HSU, Chien-Fu HUANG, Chao-Hsing CHEN, Chiu-Lin YAO, Hsin-Mao LIU, Chien-Kai CHUNG
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Publication number: 20180253158Abstract: A height adjustable joystick device including a base, a manual operation body and a height adjustment structure is provided. The manual operation body is located on the base and includes a joystick. The joystick is located on an operating surface of the manual operation body. The height adjustment structure is arranged between the base and the manual operation body, and includes a positioning member, a moving member and a releasing member, wherein the operating surface and the base have a height difference, and the moving member and the positioning member can be engaged with each other. The releasing member is used for releasing the positioning member and the moving member is moved to a second position from a first position to adjust the height difference between the operating surface and the base when the positioning member is moved to a release position from a positioning position.Type: ApplicationFiled: February 26, 2018Publication date: September 6, 2018Applicant: BENQ CORPORATIONInventors: Jing-Ren CHEN, Chia-Liang HSU, Wei-Chieh CHEN, Ching-Lin YEH, Yu-Shuo FAN
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Publication number: 20180240939Abstract: The present disclosure provides a method for making a light-emitting device. The method includes steps of providing a first substrate; forming a first semiconductor layer on the first substrate; providing a second substrate; forming an intermediate layer on the second substrate, wherein a refractive index of the intermediate layer is between a refractive index of the second substrate and a refractive index of the first semiconductor layer; and bonding the first semiconductor layer and the intermediate layer.Type: ApplicationFiled: April 23, 2018Publication date: August 23, 2018Inventor: Chia-Liang HSU
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Patent number: 10050178Abstract: The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprises: a metal connecting structure; a barrier layer on the metal connecting structure, the barrier layer comprising a first metal multilayer on the metal connecting structure and a second metal multilayer on the first metal multilayer; a metal reflective layer on the barrier layer; and a light-emitting stack electrically coupled to the metal reflective layer, wherein the first metal multilayer comprises a first metal layer comprising a first metal material and a second metal layer comprising a second metal material, and the second metal multilayer comprises a third metal layer comprising a third metal material and a fourth metal layer comprising a fourth metal material.Type: GrantFiled: April 28, 2017Date of Patent: August 14, 2018Assignee: EPISTAR CORPORATIONInventors: Fu Chun Tsai, Wen Luh Liao, Shih I Chen, Chia Liang Hsu, Chih Chiang Lu
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Patent number: 10038128Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.Type: GrantFiled: September 12, 2017Date of Patent: July 31, 2018Assignee: EPISTAR CORPORATIONInventors: Chien-Fu Huang, Yao-Ning Chan, Tzu Chieh Hsu, Yi-ming Chen, Hsin-Chih Chiu, Chih-Chiang Lu, Chia-liang Hsu, Chun-Hsien Chang
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Publication number: 20180182923Abstract: The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprises: a metal connecting structure; a barrier layer on the metal connecting structure, the barrier layer comprising a first metal multilayer on the metal connecting structure and a second metal multilayer on the first metal multilayer; a metal reflective layer on the barrier layer; and a light-emitting stack electrically coupled to the metal reflective layer, wherein the first metal multilayer comprises a first metal layer comprising a first metal material and a second metal layer comprising a second metal material, and the second metal multilayer comprises a third metal layer comprising a third metal material and a fourth metal layer comprising a fourth metal material.Type: ApplicationFiled: February 2, 2018Publication date: June 28, 2018Inventors: Fu Chun TSAI, Wen Luh LIAO, Shih I CHEN, Chia Liang HSU, Chih Chiang LU
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Patent number: 9997687Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.Type: GrantFiled: January 9, 2017Date of Patent: June 12, 2018Assignee: EPISTAR CORPORATIONInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chung
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Patent number: 9954140Abstract: The present disclosure provides a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer on the substrate; a first window layer comprising a first semiconductor optical layer on the intermediate layer and a second semiconductor optical layer on the first semiconductor optical layer; and a light-emitting stack on the second semiconductor optical layer; wherein a difference between the lattice constant of the intermediate layer and the lattice constant of the first semiconductor optical layer is greater than 2.3 ?.Type: GrantFiled: May 16, 2017Date of Patent: April 24, 2018Assignee: Epistar CorporationInventors: Chien-Fu Huang, Shiuan-Leh Lin, Chih-Chiang Lu, Chia-Liang Hsu
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Patent number: 9887322Abstract: A light-emitting device of an embodiment of the present disclosure comprises a substrate; a semiconductor stack comprising a first type semiconductor layer, a second type semiconductor layer and an active layer formed between the first type semiconductor layer and the second type semiconductor layer, wherein the first type semiconductor layer comprises a non-planar roughened surface; a bonding layer formed between the substrate and the semiconductor stack; and multiple recesses each comprising a bottom surface lower than the non-planar roughened surface; and multiple buried electrodes physically buried in the first type semiconductor layer, wherein the multiple buried electrodes are formed in the multiple recesses respectively, and one of the multiple buried electrodes comprises an upper surface; wherein an upper surface of the buried electrode and the non-planar roughened surface of the first type semiconductor layer are substantially on the same plane.Type: GrantFiled: November 3, 2016Date of Patent: February 6, 2018Assignee: EPISTAR CORPORATIONInventors: Ching-Huai Ni, Chia-Liang Hsu, Yi-Ming Chen
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Publication number: 20180006206Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.Type: ApplicationFiled: September 12, 2017Publication date: January 4, 2018Inventors: Chien-Fu HUANG, Yao-Ning CHAN, Tzu Chieh HSU, Yi-ming CHEN, Hsin-Chih CHIU, Chih-Chiang LU, Chia-liang HSU, Chun-Hsien CHANG
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Publication number: 20170358721Abstract: A light-emitting structure includes a semiconductor light-emitting element, a first connection point and a reflective element. The semiconductor light-emitting element includes a bottom surface, a top surface opposite to the bottom surface, and a side surface arranged between the bottom surface and the top surface. The first connection point is arranged on the bottom surface. The reflective element includes a first portion arranged right beneath the bottom surface, and a second portion not overlapping the bottom surface and uplifted from a lower elevation lower than the bottom surface to a higher elevation substantially equal to that of the top surface along a curved path.Type: ApplicationFiled: August 28, 2017Publication date: December 14, 2017Inventor: Chia-Liang HSU