Abstract: A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.

Abstract: A glass material with low viscosity and a low bubble content attributable to a low weight percentage of silicon dioxide includes boron trioxide (B2O3), magnesium oxide (MgO), aluminum oxide (Al2O3), and calcium oxide (CaO) in addition to silicon dioxide (SiO2); wherein Silicon dioxide (SiO2) constitutes 45%-51% by weight of the glass material, boron trioxide (B2O3) 25%-35%, magnesium oxide (MgO) 0.01%-2%, aluminum oxide (Al2O3) 10%-14.5%, and calcium oxide (CaO) 4%-10%. As the silicon dioxide (SiO2) content is lower than in the prior art, the glass material has lower viscosity, and hence a lower bubble content, than in the prior art, and this allows products made of the glass material to have a higher yield than products made of the conventional glass.

Abstract: A system and method for monitoring and recovering a heterogeneous integrated circuit, such as an FPGA, operating with firmware. A firmware image for the integrated circuit is stored in a storage device. The operational status of the integrated circuit is periodically determined via a controller such as a BMC. A failure of the integrated circuit is determined. The stored firmware image is sent to the integrated circuit. The firmware image is installed on the integrated circuit. The controller determines whether the installation of the firmware image results in restoration of the integrated circuit.

Abstract: A system and method for monitoring and recovering a heterogeneous integrated circuit, such as an FPGA, operating with firmware. A firmware image for the integrated circuit is stored in a storage device. The operational status of the integrated circuit is periodically determined via a controller such as a BMC. A failure of the integrated circuit is determined. The stored firmware image is sent to the integrated circuit. The firmware image is installed on the integrated circuit. The controller determines whether the installation of the firmware image results in restoration of the integrated circuit.

Abstract: A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber comprises an upper and lower casing having an upper and lower chamber surface, respectively. The upper and lower chamber surfaces define a plurality of obstructers farming a plurality of braided channels therearound. When heat from a greater temperature heat source and a lower temperature heat source is applied to respective contact surfaces of the lower casing, via the plurality of obstructers and braided channels, respectively, the working fluid and liquid vapor slugs/bubbles travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

Abstract: In a microrunner structure, there are provided with components for a cleaning procedure required to conduct electrochemical sensing when a biosensor is activated for sensing; and a urine signal detection device that is a SoC (System on a Chip), which has a wireless transceiving circuit for receiving a urine measurement method and channel information transmitted from an intelligent device, and in turn, outputting a stimulus signal to trigger a biosensor or a non-biosensor in a multi-channel structure to conduct urine sense processing for a sensing area, as well as transmitting detection processing for a concentration of urine substances from the electrochemical sensing to the intelligent device through the wireless transceiving circuit to assess a risk index between a heart disease or diabetes and a kidney disease.

Abstract: A glass material with low viscosity and a low bubble content attributable to a low weight percentage of silicon dioxide includes boron trioxide (B2O3), magnesium oxide (MgO). aluminum oxide (Al2O3), and calcium oxide (CaO) in addition to silicon dioxide (SiO2); wherein Silicon dioxide (SiO2) constitutes 45%˜51% by weight of the glass material, boron trioxide (B2O3) 25%˜35%, magnesium oxide (MgO) 0.01%˜2%, aluminum oxide (Al2O3) 10%˜14.5%, and calcium oxide (CaO) 4%˜10%. As the silicon dioxide (SiO2) content is lower than in the prior art, the glass material has lower viscosity, and hence a lower bubble content, than in the prior art, and this allows products made of the glass material to have a higher yield than products made of the conventional glass.

Abstract: A glass material with a low dielectric constant attributable to a high weight percentage of boron trioxide includes at least one component for forming the main constructure of the glass material, a fluxing component, a reinforcing component, and a modifier; wherein the at least one component for forming the main constructure of the glass material includes silicon dioxide (SiO2); the fluxing component includes boron trioxide (B2O3); the reinforcing component includes aluminum oxide (Al2O3); and the modifier includes calcium oxide (CaO). The glass material is characterized in that it has a boron trioxide (B2O3) content by weight of 30%˜40%, which is higher than those in the prior art; a calcium oxide (CaO) content by weight of 1%˜6%, which is lower than those in the prior art; and consequently a lower dielectric constant and a lower dissipation factor of the glass material than those in the prior art can be obtained.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: A PVT-independent fixed delay circuit includes a circuit structure that has a current generator and a multi-level inverter-based time delay unit. The inverter-based time delay unit has at least two NMOS transistors M5, M6, and at least two PMOS transistors M7, M8. The current generator has a circuit structure including at least two NMOS transistors M1, M2, at least two PMOS transistors M3, M4 and a resistor RS.

Abstract: An object detection method includes: obtaining a first offset value and a second offset value, setting a first detection threshold value by adding the first offset value to a first reference threshold value, setting a second detection threshold value by adding the second offset value to a second reference threshold value, obtaining a detection input, and performing target detection upon the detection input according to at least the first detection threshold value and the second detection threshold value. The first offset value is different from the second offset value. The first reference threshold value is determined for detecting if at least one object with a first value of an object characteristic exists. The second reference threshold value is determined for detecting if at least one object with a second value of the object characteristic exists. The second value is different from the first value.

Abstract: A PVT-independent fixed delay circuit includes a circuit structure that has a current generator and a multi-level inverter-based time delay unit. The inverter-based time delay unit has at least two NMOS transistors M5, M6, and at least two PMOS transistors M7, M8. The current generator has a circuit structure including at least two NMOS transistors M1, M2, at least two PMOS transistors M3, M4 and a resistor RS.

Abstract: This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

Abstract: A linear guideway includes a rail, a slider disposed on the rail, and a load passage formed between the rail and the slider. The slider has two non-load passages penetrating through two opposite end surfaces of the slider. Each of two ends of each non-load passage is provided with a force sensor. Two end caps are disposed on two opposite end surfaces of the slider respectively and each have two circulation grooves. Each circulation groove is connected to an end of the load passage and an end of the non-load passage to form a circulation channel for balls to move therein. As a result, the linear guideway of the present invention employs force sensors to sense the force-receiving state of two ends of the non-load passages when they are impacted by the balls, so that it can be determined that if the balls have an abnormal pressing state.

Abstract: A linear guideway is characterized in that it is capable of determining whether there is abnormal displacement of the return member based on the open or close of the circuit, and can output the abnormal signal immediately when the circuit is open. Compared with the conventional structure, since the present invention can be disposed only at one end of the slide block, both the number of components and assembly time can be reduced, and the diagnosis with precision and immediacy can be performed without high-deep algorithm, which can play a role of instant reminding before the linear guideway completely loses function. Therefore, the service life of the linear guideway can be known early to avoid the loss caused by the shutdown.

Abstract: The present disclosure provides a process for preparing cyclophosphamide, intermediate, and the monohydrate thereof.

Abstract: A linear guideway includes a rail, a slider disposed on the rail, and a load passage formed between the rail and the slider. The slider has two non-load passages. Besides, a first end cap and a second end cap are disposed on two opposite end surfaces of the slider respectively. The first end cap has two first circulation grooves. The second end cap has a circulation member and a seal sheet. The circulation member has two second circulation grooves. The load passage, non-load passage, first circulation groove and second circulation groove collectively form a circulation channel for balls to move therein. A force sensor is disposed between the circulation member and the seal sheet. As a result, through the rigidity difference between the first and second end caps accompanied with the force sensor, it can be determined that if there is an abnormal circulation state.

Abstract: A method of manufacturing a heat dissipating device includes steps of providing a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a collar portion, with the through hole formed on the fin body, with the collar portion extending from a periphery of the through hole and having a first U-shaped protruding ear, with the first U-shaped protruding ear having a first opening, with the heat pipe having a heat dissipating end and a heat absorbing end, and with the heat dissipating end opposite to the heat absorbing end; inserting the heat dissipating end into the through hole and the collar portion; and punching the collar portion to shrink the first opening of the first U-shaped protruding ear, such that the collar portion fixes the heat dissipating end in a tight-fitting manner.