Abstract: A reduction method for a boundary artifact on the tomosynthesis includes steps of performing a projection process, performing a back projection process upon the geometric factor matrix so as to obtain a back-projection geometric factor matrix, and adjusting a boundary area of the back-projection geometric factor matrix.

Abstract: A reduction method for a boundary artifact on the tomosynthesis includes steps of performing a projection process, performing a back projection process upon the geometric factor matrix so as to obtain a back-projection geometric factor matrix, and adjusting a boundary area of the back-projection geometric factor matrix.

Abstract: A vehicle head unit system includes a head unit, an operating panel and a transferring unit. The head unit has a receiving hole. The operating panel has an operating surface and a back surface opposite to the operating surface. The transferring unit has a first end and a second end. The first end is connected to the back surface of the operating panel. The second end is received in the receiving hole of the head unit, and the second end can be detached from the receiving hole of the head unit. Therefore, the operating panel and the head unit can be attached to each other and can be detached from each other.

Abstract: A method of manufacturing a heat dissipating device includes steps of providing a heat dissipating fin and a heat pipe, wherein the heat dissipating fin includes a fin body, a through hole and a collar portion, the through hole is formed on the fin body, the collar portion extends from a periphery of the through hole and has a first U-shaped protruding ear, the first U-shaped protruding ear has a first opening, the heat pipe has a heat dissipating end and a heat absorbing end, and the heat dissipating end is opposite to the heat absorbing end; inserting the heat dissipating end into the through hole and the collar portion; and punching the collar portion to shrink the first opening of the first U-shaped protruding ear, such that the collar portion fixes the heat dissipating end in a tight-fitting manner.

Abstract: A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Abstract: A heat dissipating device includes a heat dissipating fin module, a second base, a third base, a heat pipe, a first sleeve and a fourth base. The heat dissipating fin module includes a first base and a plurality of first heat dissipating fins. A recess is formed on the second base. The third base is disposed in the recess. The heat pipe includes a heat dissipating segment, a heat absorbing segment and a connecting segment connecting the heat dissipating segment and the heat absorbing segment. The heat dissipating segment is disposed in the first base. The heat absorbing segment is disposed in the second and third bases and contacts the third base directly. The first sleeve at least covers the connecting segment. The fourth base is formed by a die casting process and covers peripheries of the first and second bases and the first sleeve.

Abstract: A forming plate is provided for fabricating profiled fibers. The forming plate includes plural forming units, and each of the units includes an opening, a sidewall, and at least one extension wall. The opening includes a narrow region and two wide regions. The wide regions are connected to two sides of the narrow region respectively and disconnected to each other. The sidewall surrounds the opening and extends toward a direction. The extension wall is connected to the sidewall, surrounding the wide regions, and extending toward the same direction.

Abstract: A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end and is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.

Abstract: A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a fixing portion, wherein the heat dissipating portion extends from the fixing portion, and the fixing portion has a first recess structure. The base and the heat dissipating fin are combined with each other by a punching process, such that the fixing portion is fixed in the accommodating recess in a tight-fitting manner and a first side wall of the accommodating recess is embedded in the first recess structure.

Abstract: A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a protruding portion, wherein the protruding portion protrudes from an end of the heat dissipating portion and is disposed in the accommodating recess. The base and the heat dissipating fin are combined with each other by a punching process, such that a first side wall of the accommodating recess covers at least a part of the protruding portion.

Abstract: A method for manufacturing a heat-dissipating module includes following steps. A hollow aluminum tube is put on a corresponding heat pipe to form an aluminum-skinned heat pipe. Then, one or more aluminum-skinned heat pipes are disposed in a casting space of a die casting mold. Fins are disposed into the die casting mold. Molten aluminum materials are filled in the casting space of the die casting mold to form a heat-dissipating module. By using a die casting process, molten aluminum materials are used to cover at least one aluminum-skinned heat pipe and connect with the fins, thereby finishing the heat-dissipating module.

Abstract: A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.

Abstract: A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.

Abstract: A heat dissipating device includes a heat dissipating fin module, a second base, a third base, a heat pipe, a first sleeve and a fourth base. The heat dissipating fin module includes a first base and a plurality of first heat dissipating fins. A recess is formed on the second base. The third base is disposed in the recess. The heat pipe includes a heat dissipating segment, a heat absorbing segment and a connecting segment connecting the heat dissipating segment and the heat absorbing segment. The heat dissipating segment is disposed in the first base. The heat absorbing segment is disposed in the second and third bases and contacts the third base directly. The first sleeve at least covers the connecting segment. The fourth base is formed by a die casting process and covers peripheries of the first and second bases and the first sleeve.

Abstract: A method of manufacturing a heat dissipating base includes steps of providing a first base, wherein the first base is made of a first heat conducting material; putting the first base into a mold; pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than that of the second heat conducting material; and processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed.

Abstract: A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.

Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.

Abstract: An ultrasonic sensor device includes a sensing unit and a component module disposed in a casing. The sensing unit is configured to generate a sensing signal in response to receipt of an external sound wave. The component module includes a base seat, a circuit unit and a cushioning unit. The base seat has a base board and a lower seat portion under the base board. The base board is formed with a recess. The circuit unit is disposed in the recess, is coupled electrically to the sensing unit for receiving the sensing signal therefrom, and is to be coupled electrically to an external electronic circuit. The cushioning unit is disposed at the base seat, and is proximate to the sensing unit.

Abstract: In a heat-dissipating module and a method for manufacturing the same, a hollow aluminum tube is put on a corresponding heat pipe to form an aluminum-skinned heat pipe. Then, one or more aluminum-skinned heat pipes are disposed in a casting space of a die casting mold. Fins are disposed into the die casting mold. Molten aluminum materials are filled in the casting space of the die casting mold to form a heat-dissipating module. By using a die casting process, molten aluminum materials are used to cover at least one aluminum-skinned heat pipe and connect with the fins, thereby finishing the heat-dissipating module.