Patents by Inventor Chien Chih Chen
Chien Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210405534Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.Type: ApplicationFiled: July 2, 2021Publication date: December 30, 2021Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
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Publication number: 20210389670Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate. The photoresist layer includes a photoresist composition includes a polymer. The polymer includes a monomer unit having a pendant sensitizer and crosslinking group, and a monomer unit having a pendant acid labile group. The photoresist layer is selectively exposed to actinic radiation, and the selectively exposed photoresist layer is developed.Type: ApplicationFiled: April 15, 2021Publication date: December 16, 2021Inventor: Chien-Chih CHEN
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Patent number: 11199736Abstract: An electronic device is disclosed, which includes a first substrate structure, a flexible substrate and a first recess. The flexible substrate is disposed on the first substrate structure. The first recess is disposed on a first surface of the flexible substrate, and the first surface is close to the first substrate structure, wherein the first recess at least overlaps the first substrate structure.Type: GrantFiled: April 25, 2019Date of Patent: December 14, 2021Assignee: INNOLUX CORPORATIONInventors: Kuan-Jen Wang, Chien-Chih Chen, Chih-Chieh Fan, Chin-Der Chen, Cheng-Fu Wen, Chin-Lung Ting
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Publication number: 20210375199Abstract: A display panel and a spliced display are provided. The display panel includes a substrate, a plurality of light-emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole, and the through hole includes a hole. The plurality of the light-emitting elements are disposed on the substrate. The through hole is located in a region between two of the plurality of the light-emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of the light-emitting elements. The optical sensor is disposed corresponding to the through hole and receives sensing light through the hole. The width W of the hole meets the equation of H?W<D. H is the depth of the hole, and D is the distance between the two of the plurality of the light-emitting elements.Type: ApplicationFiled: May 4, 2021Publication date: December 2, 2021Applicant: Innolux CorporationInventors: Chin-Lung Ting, Chien-Chih Chen, Ti Chung Chang, Chih-Chieh Wang, Jenhung Li
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Patent number: 11187851Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.Type: GrantFiled: January 8, 2020Date of Patent: November 30, 2021Assignee: INNOLUX CORPORATIONInventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo
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Publication number: 20210364922Abstract: A method of manufacturing a semiconductor device includes forming a photoresist underlayer over a semiconductor substrate. The photoresist underlayer includes a polymer, including a main polymer chain having pendant target groups, and pendant organic groups or photoacid generator groups. The main polymer chain is a polystyrene, a polyhydroxystyrene, a polyacrylate, a polymethylacrylate, a polymethylmethacrylate, a polyacrylic acid, a polyvinyl ester, a polymaleic ester, a poly(methacrylonitrile), or a poly(methacrylamide). Pendant target groups are selected from the group consisting of a substituted or unsubstituted: C2-C30 diol group, C1-C30 aldehyde group, and C3-C30 ketone group. Pendant organic groups are C3-C30 aliphatic or aromatic groups having at least one photosensitive functional group, and pendant photoacid generator groups are C3-050 substituted aliphatic or aromatic groups. A photoresist layer is formed over the photoresist underlayer.Type: ApplicationFiled: April 15, 2021Publication date: November 25, 2021Inventor: Chien-Chih CHEN
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Patent number: 11173661Abstract: A 3D printing head having a carrier, a pair of nozzle assemblies, a swing arm and a driving mechanism is provided. The nozzle assemblies are arranged on the carrier. Each nozzle assembly has a nozzle and a reset elastic member. Each nozzle is connected to the carrier and up-down movable relative to the carrier. The reset elastic members are connected between the carrier and the respective corresponding nozzles. The swing arm is pivoted on the carrier and able to swing one end thereof between the nozzles to selectively press one of the nozzles down. The driving mechanism is connected with the swing arm to rotate the swing arm. The swing arm can be rotated by the driving mechanism to press the operated nozzle down for printing, and a height difference between the nozzles is thereby formed to prevent the product from being scratched by the idle nozzle when printing.Type: GrantFiled: January 15, 2020Date of Patent: November 16, 2021Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.Inventors: Chien-Chih Chen, Shih-Wei Huang, Yang-Teh Lee
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Patent number: 11175354Abstract: A method for scanning artificial structure, wherein a scanning artificial structure apparatus comprises four magnetic-field sensors, the four magnetic-field sensors are non-coplanar configured, the method comprises following steps of: moving the scanning artificial structure apparatus along a scanning path within a to-be-tested area, in the meantime, measuring magnetic field by the four magnetic-field sensors, and recording a position sequence when measuring magnetic field, wherein four magnetic-field measurement sequences are measured by the four magnetic-field sensors; and calculating a magnetic-field variation distribution from the four magnetic-field measurement sequences and the position sequence, wherein the magnetic-field variation distribution is corresponding to at least one artificial structure distribution.Type: GrantFiled: October 4, 2019Date of Patent: November 16, 2021Assignee: NATIONAL CENTRAL UNIVERSITYInventors: Chien-Chih Chen, Yi-Chen Chu, Yung-Chieh Chuang
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Publication number: 20210319693Abstract: Various aspects of methods, systems, and use cases include a robotic system and control or use of the robotic system. A method for autonomous movement of the robotic system may include receiving a target location, identifying robotic components of the robotic system that are in contact with a surface, and determining a robotic component of the robotic components to activate to cause the robotic system to move closer to the target location. The method may include activating, based on the determination, a motor of the robotic component to push against the surface to cause the robotic system to move towards the target location.Type: ApplicationFiled: June 25, 2021Publication date: October 14, 2021Inventor: Chien-Chih CHEN
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Patent number: 11134567Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.Type: GrantFiled: September 2, 2020Date of Patent: September 28, 2021Assignee: Unimicron Technology Corp.Inventors: Yu-Shen Chen, I-Ta Tsai, Chien-Chih Chen
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Patent number: 11062905Abstract: A lithography method is provided in accordance with some embodiments. The lithography method includes forming a metal-containing layer on a substrate, the metal-containing layer including a plurality of conjugates of metal-hydroxyl groups; treating the metal-containing layer at temperature that is lower than about 300° C. thereby causing a condensation reaction involving the plurality of conjugates of metal-hydroxyl groups; forming a patterned photosensitive layer on the treated metal-containing layer; and developing the patterned photosensitive layer so as to allow at least about 6% decrease of optimum exposure (Eop).Type: GrantFiled: November 4, 2019Date of Patent: July 13, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien-Chih Chen, Chien-Wei Wang
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Patent number: 11054748Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.Type: GrantFiled: September 21, 2018Date of Patent: July 6, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
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Patent number: 11007715Abstract: A 3D print head includes a carrier connected with a horizontal slide rail, a pair of nozzle assemblies disposed on the carrier, a swing arm and a push rod. Each nozzle assembly includes a nozzle and an elastic member, and movably coupled to the carrier and capable of raising and lowering relative to the carrier. Each elastic member is connected between the carrier and the corresponding nozzle to raise the nozzle relative to the carrier. The swing arm is pivoted to the carrier, and one end there of can be moved between the nozzles to push one of the nozzles down. The push rod is extended from the swing arm. While the carrier moving along the horizontal slide rail, the push rod can be pushed to rotate the swing arm to push the print nozzle down, thus the product can be prevented from scratching by another idle nozzle while printing.Type: GrantFiled: January 2, 2020Date of Patent: May 18, 2021Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.Inventors: Shih-Wei Huang, Chien-Chih Chen, Yang-Teh Lee
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Patent number: 11003082Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a material layer over a substrate and providing a resist solution. The resist solution includes a plurality of first polymers and a plurality of second polymers, each of the first polymers includes a first polymer backbone, and a first acid-labile group (ALG) with a first activation energy bonded to the first polymer backbone. Each of the second polymers includes a second polymer backbone, and a second acid-labile group with a second activation energy bonded to the second polymer backbone, the second activation energy is greater than the first activation energy. The method includes forming a resist layer over the material layer, and the resist layer includes a top portion and a bottom portion, and the first polymers diffuse to the bottom portion, and the second polymers diffuse to the top portion.Type: GrantFiled: July 5, 2018Date of Patent: May 11, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien-Chih Chen, Yahru Cheng, Ching-Yu Chang
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Publication number: 20210120701Abstract: The present disclosure provides a connector assembly including a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell and includes a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate. The heat dissipating base plate has a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region. The solder is provided within the soldering region in a manner such that a face of the soldering region is covered by the solder.Type: ApplicationFiled: October 14, 2020Publication date: April 22, 2021Applicant: Molex, LLCInventor: Chien-Chih CHEN
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Publication number: 20210078246Abstract: A 3D print head includes a carrier connected with a horizontal slide rail, a pair of nozzle assemblies disposed on the carrier, a swing arm and a push rod. Each nozzle assembly includes a nozzle and an elastic member, and movably coupled to the carrier and capable of raising and lowering relative to the carrier. Each elastic member is connected between the carrier and the corresponding nozzle to raise the nozzle relative to the carrier. The swing arm is pivoted to the carrier, and one end there of can be moved between the nozzles to push one of the nozzles down. The push rod is extended from the swing arm. While the carrier moving along the horizontal slide rail, the push rod can be pushed to rotate the swing arm to push the print nozzle down, thus the product can be prevented from scratching by another idle nozzle while printing.Type: ApplicationFiled: January 2, 2020Publication date: March 18, 2021Inventors: Shih-Wei HUANG, Chien-Chih CHEN, Yang-Teh LEE
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Publication number: 20210078247Abstract: A 3D printing head having a carrier, a pair of nozzle assemblies, a swing arm and a driving mechanism is provided. The nozzle assemblies are arranged on the carrier. Each nozzle assembly has a nozzle and a reset elastic member. Each nozzle is connected to the carrier and up-down movable relative to the carrier. The reset elastic members are connected between the carrier and the respective corresponding nozzles. The swing arm is pivoted on the carrier and able to swing one end thereof between the nozzles to selectively press one of the nozzles down. The driving mechanism is connected with the swing arm to rotate the swing arm. The swing arm can be rotated by the driving mechanism to press the operated nozzle down for printing, and a height difference between the nozzles is thereby formed to prevent the product from being scratched by the idle nozzle when printing.Type: ApplicationFiled: January 15, 2020Publication date: March 18, 2021Inventors: Chien-Chih CHEN, Shih-Wei HUANG, Yang-Teh LEE
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Publication number: 20210082970Abstract: An electronic device is provided. The electronic device includes a supporting substrate, a flexible substrate disposed on the supporting substrate, a first conductive layer disposed on the flexible substrate, a second conductive layer disposed on the first conductive layer, a plurality of organic elements disposed between the first conductive layer and the second conductive layer, and an opening passing through the supporting substrate and exposing a portion of the flexible substrate. The first conductive layer alternately contacts the second conductive layer and the plurality of organic elements.Type: ApplicationFiled: December 2, 2020Publication date: March 18, 2021Inventors: Ti-Chung CHANG, Chih-Chieh WANG, Chien-Chih CHEN
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Patent number: 10950685Abstract: A tiled electronic device includes a first electronic device and a second electronic device adjacent to each other. The first electronic device includes a first substrate having a first upper surface, a first lower surface, and a first side surface; and a first flexible substrate including a first upper portion, a first lower portion, and a first connection portion. The first upper portion is disposed corresponding to the first upper surface. The first lower portion is disposed corresponding to the first lower surface. The first connection portion is disposed corresponding to the first side surface. The second electronic device includes a second substrate having a second upper surface, a second lower surface, and a second side surface. The second side surface is opposite and adjacent to the first side surface. The first connection portion is located between the first side surface and the second side surface.Type: GrantFiled: February 28, 2019Date of Patent: March 16, 2021Assignee: INNOLUX CORPORATIONInventors: Chien-Chih Chen, Shan-Hung Tsai, Chin-Der Chen, Cheng-Fu Wen, Chin-Lung Ting
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Publication number: 20210057797Abstract: An antenna structure capable of transmitting a WiGig band for a head-mounted wireless transmission display device including a display screen and an overhead device is disclosed. The antenna structure includes at least two body portions, each of the body portions having at least a signal transceiving end, the body portions are respectively arranged at left and right sides of the display screen, and signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen respectively.Type: ApplicationFiled: November 9, 2020Publication date: February 25, 2021Applicant: HTC CORPORATIONInventors: Sheng Cherng LIN, Hsiao-Ling CHAN, Chen-Hao CHANG, Chien-Chih CHEN