Abstract: A method according to the present disclosure includes providing a substrate, depositing an underlayer over the substrate, depositing a photoresist layer over the underlayer, exposing a portion of the photoresist layer and a portion of the underlayer to a radiation source according to a pattern, baking the photoresist layer and underlayer, and developing the exposed portion of the photoresist layer to transfer the pattern to the photoresist layer. The underlayer includes a polymer backbone, a polarity switchable group, a cross-linkable group bonded to the polymer backbone, and photoacid generator. The polarity switchable group includes a first end group bonded to the polymer backbone, a second end group including fluorine, and an acid labile group bonded between the first end group and the second end group. The exposing decomposes the photoacid generator to generate an acidity moiety that detaches the second end group from the polymer backbone during the baking.

Abstract: A lithography method includes forming a bottom anti-reflective coating (BARC) layer on a substrate, wherein the BARC layer includes an organic polymer and a reactive chemical group having at least one of chelating ligands and capping monomers, wherein the reactive chemical group is bonded to the organic polymer; coating a metal-containing photoresist (MePR) layer on the BARC layer, wherein the MePR being sensitive to an extreme ultraviolet (EUV) radiation; performing a first baking process to the MePR layer and the BARC layer, thereby reacting a metal chemical structure of the MePR layer and the reactive chemical structure of the BARC layer and forming an interface layer between the MePR layer and the BARC layer; performing an exposure process using the EUV radiation to the MePR layer; and developing the MePR layer to form a patterned photoresist layer.

Abstract: A separate quantization method of forming a combination of 4-bit and 8-bit data of a neural network is disclosed. When a training data set and a validation data set exist, a calibration manner is used to determine a threshold for activations of each of a plurality of layers of a neural network model, so as to determine how many of the activations to perform 8-bit quantization. In a process of weight quantization, the weights of each layer are allocated to 4-bit weights and 8-bit weights according to a predetermined ratio, so as to make the neural network model have a reduced size and a combination of 4-bit and 8-bit weights.

Abstract: A connector assembly is provided which includes a shielding shell, a receptacle connector and a heat sink. The shielding shell has a top wall, a receiving cavity positioned inside, an inserting opening which is positioned at a front end of the shielding shell and communicated with the receiving cavity and a window which is formed to the top wall, extends rearwardly and is communicated with the receiving cavity. The receptacle connector is provided to a rear segment of the receiving cavity. The heat sink is provided to the top wall and includes a heat dissipating base. A bottom face of the heat dissipating base downwardly enters the receiving cavity via the window and directly faces a top face of the receptacle connector. The bottom face of the heat dissipating base facing the receptacle connector is provided with a front stopping portion which is adapted to stop a mating module.

Abstract: The present disclosure is related to an electronic device that includes a display area and a non-display area. The electronic device includes a supporting substrate, a flexible substrate, a first organic insulating layer, a first conductive layer, a second conductive layer, a second organic insulating layer, and a resilient structure. The flexible substrate is disposed on the supporting substrate. The first organic insulating layer is disposed on the flexible substrate. The first conductive layer is disposed on the first organic insulating layer. The second conductive layer is disposed on the first conductive layer. The second organic insulating layer is disposed on the second conductive layer. The resilient structure includes resilient elements disposed between the first conductive layer and the second conductive layer. The first conductive layer alternately contacts the second conductive layer and the resilient elements.

Abstract: A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubble is between the bonded first and second wafers in the bonding tool is detected.

Abstract: A method for folding and extending an antenna structure capable of transmitting a WiGig band is provided. The method has the following steps: (1) mounting a WiGig module within a base; (2) pivotally arranging the antenna structure on the base; and (3) folding or extending the antenna structure relative to the base to correspondingly reduce or increase the antenna structure for transmitting and receiving a valid range of a wireless signal. The antenna structure has two body portions, and each of the two body portions has a pivoting end and a signal receiving end opposite to the pivoting end. Each of the pivoting ends is pivotally disposed on the base at a first specific angle with respect to a horizontal plane, and each of the signal receiving ends is inclined downward by a second specific angle with respect to the body portion and disposed away from the body portion.

Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.

Abstract: Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments, the resist layer includes a multi-metal complex including an extreme ultraviolet (EUV) absorption element and a bridging element. By way of example, the EUV absorption element includes a first metal type and the bridging element includes a second metal type. In some embodiments, an exposure process is performed to the resist layer. After performing the exposure process, the exposed resist layer is developed to form a patterned resist layer.

Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.

Abstract: A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.

Abstract: A beverage supplier includes: an inlet conduit communicated with a beverage container; a pumping and cooling device communicated with the inlet conduit, pumping and cooling a beverage from the beverage container, and outputting a cooled beverage; and an output unit, which is electrically connected to the pumping and cooling device and controls output of the cooled beverage. In a first state, the pumping and cooling device pumps and cools the beverage from the beverage container through the inlet conduit. In a second state, the pumping and cooling device empties the cooled beverage remained in the pumping and cooling device.

Abstract: An electronic device is disclosed which includes: a substrate; a plurality of active elements disposed on the substrate; a common electrode disposed on the active elements and including a plurality of openings; and a plurality of light-emitting elements, at least one of the light-emitting elements disposed on the common electrode partially, wherein the light-emitting elements each include a first pad and a second pad, and the first pad and the second pad are disposed on a same side of each said light-emitting element, wherein the first pad of one of the light-emitting elements is disposed corresponding to one of the openings of the common electrode and the first pad of the one of the light-emitting elements electrically connects to one of the active elements, and the second pad electrically connects to the common electrode.

Abstract: A near magnetic field variation detection method comprises following steps of: measuring magnetic field by a first magnetic field sensor and a second magnetic field sensor respectively; and calculating a magnetic field measurement difference, wherein the magnetic field measurement difference is (1) a magnitude of a difference of a first-magnetic-field-measurement measured by the first magnetic field sensor and a second-magnetic-field-measurement measured by the second magnetic field sensor, or (2) a magnitude of a difference of a first-magnetic-field-measurement-component measured by the first magnetic field sensor along a characteristic direction and a second-magnetic-field-measurement-component measured by the second magnetic field sensor along the characteristic direction; wherein a near magnetic field variation is occurred when (a) the magnetic field measurement difference is continuously greater than a characteristic-threshold within a characteristic-time-period, or (b) an average value of the magnetic f

Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.

Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.

Abstract: A 3-D printing apparatus includes a body, a disposed in the body, a control module, a print head module assembled to the body and electrically connected with the control module and a sensing module. The sensing module is assembled to the print head module to move along with the print head module in the body and electrically connected with the control module and includes a probe. The control module drives the print head module to move and causes a part of the body to hit the sensing module, thereby driving the probe to protrude from the print head module to form a first state. In the first state, the control module drives the print head module to move and causes the probe to contact the platform, thereby determining a surface state of the platform.

Abstract: An electronic device is provided and includes a first voltage trace, a second voltage trace, a first region electrode, a second region electrode, and a voltage source module. The second voltage trace is electrically insulated from the first voltage trace, the first region electrode is electrically connected to the first voltage trace, and the second region electrode is electrically connected to the second voltage trace. The voltage source module provides a first driving voltage to the first voltage trace and provides a second driving voltage to the second voltage trace, in which the first driving voltage is different from the second driving voltage.

Abstract: An electronic device includes a flexible substrate and a conductive wire. The flexible substrate includes a first bending region and a side region connected to the first bending region. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. A ratio of a total width of the metal portion disposed in the first bending region to a total width of the metal portion disposed in the side region is in a range from 0.8 to 1.2, and a length of one of the openings in the first bending region is less than or equal to a length of one of the openings in the side region.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.