Abstract: A pyramid bump structure for electrically coupling to a bond pad on a carrier comprises a conductive block disposed at the bond pad and an oblique pyramid insulation layer covered at one side of the conductive block. The oblique pyramid insulation layer comprises a bottom portion and a top portion, and outer diameter of the oblique pyramid insulation layer is tapered from the bottom portion to the top portion. When the carrier is connected with a substrate and an anisotropic conductive film disposed at the substrate, the pyramid bump structure may rapidly embed into the anisotropic conductive film to raise the flow rate of the anisotropic conductive film. Further, a short phenomenon between adjacent bumps can be avoided to raise the yield rate of package process.

Abstract: The present disclosure provides a solar cell device. The device has solar cells having multijunction. A supplemental current source is connected with one of the solar cells having a smallest current in the device. Thus, through providing required current by the supplemental current source, usage performance of the device is enhanced.

Abstract: A driving circuit for driving light emitting diodes includes a signal-extending circuit and a current sink. The signal-extending circuit is used for receiving an original dimming signal and extending a duty cycle of the original dimming signal. The current sink is coupled to the signal-extending circuit for generating a driving current for driving a series of light emitting diode.

Abstract: A ratchet wrench includes a handle and a wrench head unit having head body rotatably mounted on a head portion of the handle, a plurality of tubular coupling member angularly displaced from each other, and a plurality of driving heads, each coupled with the respective tubular coupling member by means of a ratchet unit. By virtue of the ratchet unit, the driving head can be selectively turned in a clockwise direction, a counterclockwise direction, or both thereof. By virtue of the driving heads, the ratchet wrench can be used to turn a variety of fasteners.

Abstract: A solar cell with a superlattice structure and a fabricating method thereof are provided, which includes fabricating a superlattice structure of GaAsN/GaInAs, GaAsN/GaSbAs, or GaAsN/GaInSbAs between a base and an emitter of a middle cell of a triple junction solar cell by a strain-compensation technology. The provided solar cell not only decreases crystalline defects and increases the critical thickness of the crystal, but also makes the energy bandgap of GaAsN and GaInAs reach around the energy of 1.0 eV (electron volt). Hence, the absorption region can be raised to around the energy of 1.0 eV to enhance the efficiency of the solar cell.

Abstract: A method for making semiconductor electrodes includes provided a wafer. The wafer includes at least one conductive unit, a plurality of first connective units connected to the conductive unit, a plurality of first metal layers connected to the first connective units and a plurality of second connective units connected to the first metal layers. Photo-resist is provided on the first and second connective units. A second metal layer is provided on each of the first metal layers via using an electroplating device. The wafer is cut through the photo-resist, thus forming semiconductor electrodes.

Abstract: A solar cell is provided Its light absorption area is close to a heat-dissipation apparatus. Thus, an excellent dissipation efficiency is obtained. The solar cell has a strong structure, an easy fabrication method and a low cost. Thus, the present invention is fit for mass-production.

Abstract: A clip includes a beam for contact with a face of a wafer, a first oblique section and a second oblique section for contact with an opposite face of the wafer. The beam includes a supporting section formed thereon. The first oblique section extends from the beam so that there is an acute angle between the first oblique section and the beam. The second oblique section extends from the first oblique section so that there is an acute angle between the first and second oblique sections and that there is an acute angle between a plane in which the supporting section lies.

Abstract: An ohmic contact is fabricated. The ohmic contact has low electric resistivity and high thermal conductivity. The materials for fabricating the ohmic contact include silver. Thus, equipments for fabricating the ohmic contact are compatible to modern generally used equipments.

Abstract: A TiON, TaON or ZrON thin film is fabricated through an easy process. The film is corrosion resistant, electric conductive and decorative. The process uses no chloride (Cl) and so is environmental protected. The present disclosure is fit for mass production.

Abstract: A solar cell is fabricated. Its light-absorbing part is close to a heat-diffusing device. Thus, the solar cell has low electrical and thermal Impedance. The solar cell has a strong structure, high efficiency and is fit for mass production.

Abstract: A light-collection apparatus includes a core, a first layer and a second layer. The core is made in the form of a frustum and used as a solid light-passing zone. The first layer is provided on the core. The second layer is provided on the first layer. Therefore, the light-collection apparatus is excellent in collecting light, easily mass-produced at a low cost, durable and environmentally friendly.

Abstract: A small area IO circuit is provided. The IO circuit has one or more parallel circuit unit(s) and an ESD protector set between a core circuit/pre-driver and an IO pad. Each circuit unit includes an off-chip driver and an output resistor, wherein the ESD protector protects ESD event occurred at the IO pad, and the resistor in each circuit unit acts as an ESD block circuit to block ESD current from corresponding off-chip driver. Therefore, transistors in each off-chip driver do not have to be restricted by strict ESD design rules, such that at least a transistor of the off-chip driver(s) is implemented in a single finger layout to lower equivalent capacitance of the off-chip driver(s), and layout areas of the off-chip driver(s) as well as the whole IO circuit can be reduced to achieve a small area IO circuit.

Abstract: There is disclosed a method for coating an electrode on a wafer. Firstly, there is provided a wafer. Secondly, a metal area is defined in an upper surface of the wafer. Thirdly, the metal area is roughened via etching. Finally, an electrode is coated on the metal area via deposition.

Abstract: The present invention discloses a device for spin cleaning and etching wet processor. The support is kept in a fixed level, and the drain tank can be lifting and lowering to collect and drain out the liquid from the support. This device consists of a suport, a set of drain tank and a lifting and lowering device to move the drain tank so that one of the drain tank is in the same level with the suport. The suport is used to support a wafer to process etching and cleaning, can spin with different speed and supply etching solution and DI water. The number of drain tanks are selected by the number of etching solutions and DI water. A stationary axaust appratus kept in a fixed level as the support is used to axaust the acidic gas from the drain tanks.

Abstract: A light-collecting device has a hollow at center. Three layers are sequentially pasted on and around the hollow. The device collects light efficiently with different materials of the layers. And the device has a long life of use, is environmentally friendly and is easily mass-produced.

Abstract: The present disclosure provides a system and method for recognizing a defect image associated with a semiconductor substrate. In one example, the method includes collecting defect data of the defect image by testing and measuring the semiconductor substrate, extracting a pattern from the defect data, normalizing a location, orientation, and size of the pattern, and identifying the pattern after the pattern is normalized.

Abstract: A base body comprises two frames to put lens and solar cells. The working process is simple and the weight and the cost of the base body is reduced.

Abstract: A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.

Abstract: A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application.