Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.

Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.

Abstract: Structures and methods for controlling dopant diffusion and activation are disclosed. In one example, a semiconductor structure is disclosed. The semiconductor structure includes: a channel layer; a barrier layer over the channel layer; a gate electrode over the barrier layer; and a doped layer formed between the barrier layer and the gate electrode. The doped layer includes (a) an interface layer in contact with the barrier layer and (b) a main layer between the interface layer and the gate electrode. The doped layer comprises a dopant whose doping concentration in the interface layer is lower than that in the main layer.

Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.

Abstract: A high electron mobility transistor (HEMT) device and a method of forming the same are provided. The method includes forming a first III-V compound layer over a substrate. A second III-V compound layer is formed over the first III-V compound layer. The second III-V compound layer has a greater band gap than the first III-V compound layer. A third III-V compound layer is formed over the second III-V compound layer. The third III-V compound layer and the first III-V compound layer comprise a same III-V compound. A passivation layer is formed along a topmost surface and sidewalls of the third III-V compound layer. A fourth III-V compound layer is formed over the second III-V compound layer. The fourth III-V compound layer has a greater band gap than the first III-V compound layer.

Abstract: The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.

Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.

Abstract: An error checking and correcting (ECC) decoding method and apparatus are provided. A decoding circuit decodes a codeword using (or without using) reference information, wherein when the decoding circuit fails to decode a first codeword, the decoding circuit decodes a second codeword to produce decoded data. The decoding circuit checks whether a change has occurred from each codeword bit of the second codeword to a corresponding bit of the decoded data. In accordance with a bit position of the changed corresponding bit, the decoding circuit correspondingly changes the first codeword to a modified codeword, and/or correspondingly changes the reference information to modified information. The decoding circuit performs the ECC decoding again on the modified codeword (or the first codeword) using (or without using) the modified information.

Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.

Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: A cooling fan assembly is provided which includes a fan housing and an axial fan. The fan housing has a shroud panel with cutout portions along the airflow path of the axial fan. Fixed members separate the cutout portions. Flap members are attached to the fixed members so that the flap members can pivot between an open position and a closed position. The flap members are pushed by airflow from the axial fan into an open position when the fan is operational. When the fan is non-operational or when air begins to enter the fan in the reverse direction of the axial fan's airflow path, the flap members are configured to move to a closed position. In the closed position, air cannot flow through the reverse direction of the axial fan's airflow path.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: A driver circuit supplies a positive voltage and a negative voltage to a load. The driver circuit includes: a positive power conversion circuit, coupled to the load, and generating the positive voltage according to an input voltage; a negative power conversion circuit, coupled to the positive power conversion circuit and the load, and generating the negative voltage according to the positive voltage; and a headroom adaptive adjustment circuit, coupled to the positive power conversion circuit and the load, and generating an adjustment signal according to one or more of a load current flowing through the load, the positive voltage Vp and the negative voltage Vn. The adjustment signal is sent to the positive power conversion circuit to adjust a regulation target of the positive voltage.

Abstract: A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.

Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.

Abstract: An error checking and correcting (ECC) decoding method and apparatus are provided. A decoding circuit decodes a codeword using (or without using) reference information, wherein when the decoding circuit fails to decode a first codeword, the decoding circuit decodes a second codeword to produce decoded data. The decoding circuit checks whether a change has occurred from each codeword bit of the second codeword to a corresponding bit of the decoded data. In accordance with a bit position of the changed corresponding bit, the decoding circuit correspondingly changes the first codeword to a modified codeword, and/or correspondingly changes the reference information to modified information. The decoding circuit performs the ECC decoding again on the modified codeword (or the first codeword) using (or without using) the modified information.

Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.

Abstract: A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.

Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.