Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

Abstract: A micromechanical sound transducer system and a corresponding manufacturing method, in which the micromechanical sound transducer system includes a substrate having a front side and a back side, the substrate having a through opening extending between the back side and the front side, and a coil configuration on the front side having a coil axis, which runs essentially parallel to the front side, the coil configuration covering the through opening at least partially. Also provided is a magnet device, which is situated so as to allow for an axial magnetic flux to be generated through the coil configuration. The coil configuration has a winding device which has at least first winding sections made from at least one layer of a low-dimensional conductive material, the coil configuration being configured to inductively detect and/or generate sound.

Abstract: A vertical microelectronic component includes a semiconductor substrate having a front side and a back side, and a multiplicity of fins formed on the front side. Each fin has a side wall and an upper side and is separated from other fins by trenches. Each fin includes a GaN/AlGaN heterolayer region formed on the side wall and including a channel region extending essentially parallel to the side wall. Each fin includes a gate terminal region arranged above the GaN/AlGaN heterolayer region and electrically insulated from the channel region in the associated trench on the side wall. A common source terminal region arranged above the fins is connected to a first end of the channel region in a vicinity of the upper sides. A common drain terminal region arranged above the back side is connected to a second end of the channel region in a vicinity of the front side.

Abstract: The disclosure relates to a micro-electromechanical membrane arrangement with a substrate, which has a multiplicity of recesses on a surface, a first electrically conductive electrode layer, which is arranged on the surface of the substrate and has a multiplicity of first depressions coinciding with the recesses, and an electrically conductive membrane layer, which can be deflected in a direction perpendicular to the active surface of the substrate, is arranged over the first electrode layer and is kept at a distance therefrom by a first distance value.

Abstract: A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Abstract: Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.

Abstract: Measures are provided which are used for stabilizing the substructure of the connecting areas of ASIC elements. These measures relate to ASIC elements including an ASIC substrate, into which electrical circuit functions are integrated, and including an ASIC layer structure on the ASIC substrate, which includes multiple wiring levels for the circuit functions, which are separated from one another by insulation layers and are interconnected via metallic plugs. At least one connecting area for placing wire bonds or for wafer bonding is implemented in at least one of the uppermost wiring levels. At least one chain of metallic plugs arranged vertically in a direct line is implemented in the ASIC layer structure below the connecting area, which extends from the uppermost wiring level up to the ASIC substrate or oxide trenches introduced therein.

Abstract: A sensor arrangement includes an infrared sensor and at least one acceleration sensor. The infrared sensor is configured to detect infrared radiation, and to output infrared image data. The at least one acceleration sensor is configured to detect an instantaneous acceleration of the sensor arrangement, and to output acceleration data. The output of the infrared image data from the infrared sensor is blocked when the instantaneous acceleration of the sensor arrangement exceeds a preprogrammed threshold value.

Abstract: Measures are described by which the back volume of a microphone component can be realized regardless of its packaging. Within the framework of a microphone module, a circuit board is used for the 2nd-level mounting of at least one microphone component part, in whose surface at least one connection opening is formed, which terminates in a cavity in the layer structure of the circuit board. In addition, the circuit board surface having the connection opening is configured for a sealing mounting of the microphone component part above the connection opening, so that the microphone component is acoustically connected to the cavity in the circuit board via the connection opening in the circuit board surface, and this cavity functions as backside volume for the microphone component part.

Abstract: Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.

Abstract: To implement cavities having different internal pressures in joining two semiconductor elements, at least one of the two element surfaces to be joined is structured, so that at least one circumferential bonding frame area is recessed or elevated in comparison with at least one other circumferential bonding frame area. At least one connecting layer should then be applied to this structured element surface and at least two circumferential bonding frames should be structured out of this connecting layer on different surface levels of the element surface. The topography created in the element surface permits sequential bonding in which multiple cavities between the two elements may be successively hermetically sealed, so that a defined internal pressure prevails in each of the cavities.

Abstract: A microphone structure of an MEMS device has a layer construction including: a base substrate; a deflectable microphone diaphragm at least partly spanning a through-opening in the substrate; a deflectable electrode of a microphone condenser system; a stationary counter-element having ventilation openings situated in the layer construction over the microphone diaphragm and acting as a bearer for a stationary electrode of the microphone condenser system. The diaphragm is bonded into the layer construction on the substrate via a flexible beam. The otherwise free edge region of the diaphragm is curved in a pan shape, so that it extends both vertically and also in some regions laterally beyond the edge region of the through-opening, and the edge region of the through-opening forms a lower stop for the diaphragm movement.

Abstract: A micro-hotplate apparatus including a diaphragm carrier device; a diaphragm that at least in part spans at least one cavity embodied in the diaphragm carrier device; and at least one heating conductor disposed on and/or in the diaphragm, the micro-hotplate apparatus additionally encompassing at least one reflector element that is disposed on an inner side, directed toward the cavity, of the diaphragm, in such a way that by way of the at least one reflector element a thermal radiation emitted from the at least one heating conductor and/or from the diaphragm is reflectable at least in part back onto and/or into the diaphragm. A sensor having a micro-hotplate apparatus is also described.

Abstract: A micromechanical structure includes a substrate, a micromechanical functional structure, and a conductor track arrangement. The substrate has a top side, and the micromechanical functional structure is formed in the substrate on the top side. The conductor track arrangement is formed above the top side of the substrate, and the conductor track arrangement includes at least two insulation layers of non-conductive material and a conductor track layer of conductive material located between the at least two insulation layers.

Abstract: A new signal acquisition concept is provided for MEMS components having a pressure-sensitive diaphragm element, which at least partially spans a pressure connection opening. This signal acquisition concept is distinguished by an especially high sensitivity. For this purpose, the MEMS component includes a resonant vibrator device having a vibrating element, which is suspended, capable of vibrating, within a closed cavity and is equipped with at least one drive electrode and at least one sensing electrode. The vibrating element of the resonant vibrator device is coupled mechanically to the diaphragm element, so that the vibrating element is deformed in the case of a diaphragm deflection.

Abstract: A bonding pad for thermocompression bonding of a carrier material to a further carrier material includes a base layer and a top layer. The base layer is made of metal, is deformable, and is connected to the carrier material. The metal is nickel-based. The top layer is metallic and is connected directly to the base layer. The top layer is arranged at least on a side of the base layer which faces away from the carrier material. The top layer has a smaller layer thickness than the base layer. In at least one embodiment, the top layer has a greater oxidation resistance than the base layer.

Abstract: An infrared sensor device includes at least one sensor element formed in a semiconductor substrate, an SOI wafer that defines a gap below and around the sensor element, and a suspension device that is configured to suspend the sensor element in the SOI wafer. The sensor element is substantially arranged below the suspension device, thereby achieving a high sensitivity, low thermal capacity, low thermal coupling to the substrate and a high image refresh rate.

Abstract: An implementation for an electret in a capacitive MEMS element including a pressure-sensitive diaphragm, which is produce-able using standard methods of semiconductor technology for easy integration into the manufacturing process of MEMS semiconductor elements. Such MEMS elements include at least one pressure-sensitive diaphragm including at least one deflectable diaphragm electrode of a capacitor system for signal detection and one fixed non-pressure-sensitive counter-element including at least one counter-electrode of this capacitor system, at least one electrode of the capacitor system being provided with an electrically charged electret, so that there is a potential difference between the two electrodes of the capacitor system. The electret includes at least two adjacent layers made from different dielectric materials, electrical charges being stored on their boundary surface.

Abstract: An image pixel apparatus for detecting electromagnetic radiation includes an absorption structure device configured to absorb the electromagnetic radiation and to take it up as a quantity of heat. At least one plasmonic resonance structure device of the apparatus is configured to forward the electromagnetic radiation to the absorption structure device. A detection device that has at least one detection element is configured to detect the electromagnetic radiation by way of changes in an electrical property of the at least one detection element that are caused by the quantity of heat taken up.