Abstract: A social networking system selects a set of contacts for presentation to a user of the social networking system. A contact is an additional user or a group of users maintained by the social networking system. To select the set of contacts, the social networking system generates scores associated with additional users of the social networking system and groups of users based on interactions between the user and various additional users and between the user and groups of users. Based on the scores associated with additional users and with groups of users, the social networking system selects a set of contacts from the additional users and the groups of users. Information identifying the set of contacts is communicated from the social networking system to a client device for presentation to the user.

Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.

Abstract: In some embodiments, the present disclosure relates to a back-side image (BSI) sensor having a global shutter pixel with a reflective material that prevents contamination of a pixel-level memory node. In some embodiments, the BSI image sensor has an image sensing element arranged within a semiconductor substrate and a pixel-level memory node arranged within the semiconductor substrate at a location laterally offset from the image sensing element. A reflective material is also arranged within the semiconductor substrate at a location between the pixel-level memory node and a back-side of the semiconductor substrate. The reflective material has an aperture that overlies the image sensing element. The reflective material allows incident radiation to reach the image sensing element while preventing the incident radiation from reaching the pixel-level memory node, thereby preventing contamination of the pixel-level memory node.

Abstract: A pad structure for a complementary metal-oxide-semiconductor (CMOS) image sensor is provided. A semiconductor substrate is arranged over a back end of line (BEOL) metallization stack, and comprises a scribe line opening. A buffer layer lines the scribe line opening. A conductive pad comprises a base region and a protruding region. The base region is arranged over the buffer layer in the scribe line opening, and the protruding region protrudes from the base region into the BEOL metallization stack. A dielectric layer fills the scribe line opening over the conductive pad, and is substantially flush with an upper surface of the semiconductor substrate. Further, a method for manufacturing the pad structure, as well as the CMOS image sensor, are provided.

Abstract: Provided are a method and device for updating an input method system, a computer storage medium, and a device. The method comprises: receiving multiple operation logs from multiple user terminals on which the input method system is installed, the operation logs recording log entries which indicate an operations of input corresponding candidate items; extracting log entries from the received operation logs; determining a quantity of log entries of each type; and sending, according to the determined quantity, log entries in a preset type to the user terminals on which the input method system is installed, so as to update the input method system.

Abstract: A pad structure for a complementary metal-oxide-semiconductor (CMOS) image sensor is provided. A semiconductor substrate is arranged over a back end of line (BEOL) metallization stack, and comprises a scribe line opening. A buffer layer lines the scribe line opening. A conductive pad comprises a base region and a protruding region. The base region is arranged over the buffer layer in the scribe line opening, and the protruding region protrudes from the base region into the BEOL metallization stack. A dielectric layer fills the scribe line opening over the conductive pad, and is substantially flush with an upper surface of the semiconductor substrate. Further, a method for manufacturing the pad structure, as well as the CMOS image sensor, are provided.

Abstract: Among other things, one or more image sensors and techniques for forming image sensors are provided. An image sensor comprises a photodiode array configured to detect light. The image sensor comprises an oxide grid comprising a first oxide grid portion and a second oxide grid portion. A metal grid is formed between the first oxide grid portion and the second oxide grid portion. The oxide grid and the metal grid define a filler grid. The filler grid comprises a filler grid portion, such as a color filter, that allows light to propagate through the filler grid portion to an underlying photodiode. The oxide grid and the metal grid confine or channel the light within the filler grid portion. The oxide grid and the metal grid are formed such that the filler grid provides a relatively shorter propagation path for the light, which improves light detection performance of the image sensor.

Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.

Abstract: Among other things, one or more image sensors and techniques for forming image sensors are provided. An image sensor comprises a photodiode array configured to detect light. The image sensor comprises an oxide grid comprising a first oxide grid portion and a second oxide grid portion. A metal grid is formed between the first oxide grid portion and the second oxide grid portion. The oxide grid and the metal grid define a filler grid. The filler grid comprises a filler grid portion, such as a color filter, that allows light to propagate through the filler gird portion to an underlying photodiode. The oxide grid and the metal grid confine or channel the light within the filler gird portion. The oxide grid and the metal grid are formed such that the filler grid provides a relatively shorter propagation path for the light, which improves light detection performance of the image sensor.

Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.

Abstract: A social networking system selects a set of contacts for presentation to a user of the social networking system. A contact is an additional user or a group of users maintained by the social networking system. To select the set of contacts, the social networking system generates scores associated with additional users of the social networking system and groups of users based on interactions between the user and various additional users and between the user and groups of users. Based on the scores associated with additional users and with groups of users, the social networking system selects a set of contacts from the additional users and the groups of users. Information identifying the set of contacts is communicated from the social networking system to a client device for presentation to the user.

Abstract: Among other things, one or more image sensors and techniques for forming image sensors are provided. An image sensor comprises a photodiode array configured to detect light. The image sensor comprises an oxide grid comprising a first oxide grid portion and a second oxide grid portion. A metal grid is formed between the first oxide grid portion and the second oxide grid portion. The oxide grid and the metal grid define a filler grid. The filler grid comprises a filler grid portion, such as a color filter, that allows light to propagate through the filler gird portion to an underlying photodiode. The oxide grid and the metal grid confine or channel the light within the filler gird portion. The oxide grid and the metal grid are formed such that the filler grid provides a relatively shorter propagation path for the light, which improves light detection performance of the image sensor.

Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.

Abstract: A method of forming an integrated circuit structure includes providing a silicon substrate, and implanting a p-type impurity into the silicon substrate to form a p-type region. After the step of implanting, performing an anneal to form a silicon oxide region, with a portion of the p-type region converted to the silicon oxide region.

Abstract: A shredder comprises a shredder housing and a shredder mechanism received in the housing. The shredder mechanism includes a motor and cutter elements and enables at least one article to be shredded to be fed into the cutter elements. The motor is operable to drive the cutter elements in a shredding direction. The shredder also includes a plurality of supporting structures between the shredder mechanism and the shredder housing. The shredder housing has a plurality of support surfaces. Each of the plurality of supporting structures is engaged but not fixedly connected on a corresponding support surface, thus allowing movement of the shredder mechanism in X, Y, and Z directions. At least one motion limiter is provided to limit the relative movement between the mechanism and the housing. The shredder mechanism may be urged to a centered position. The supporting structures may reduce vibrations and noise during operation of the shredder.

Abstract: The present invention discloses a biochip with a three-dimensional structure. The surface of the three-dimensional mesoporous layer is chemically modified to recognize labeled DNAs, proteins, peptides, saccharides, and cells. In addition, this invention also discloses a method for preparing the biochip with a three-dimensional mesoporous layer, including a blending process, a heating process, a coating process, a gelation process, a cleaning process, a drying process, and a surface modification process.

Abstract: The present invention discloses a biochip comprising a substrate and a three-dimensional mesoporous layer on top of it, wherein the mesoporous layer on top is chemically modified to recognize labeling DNAs, proteins, peptides, saccharides, and cells. In addition, this invention also discloses a method for forming the biochip with a three-dimensional mesoporous layer, including a blending process, a heating process, a coating process, a gelation process, a drying process, and a surface modification process.

Abstract: The present invention discloses a biochip comprising a substrate and a three-dimensional mesoporous layer on top of it, wherein the mesoporous layer on top is chemically modified to recognize labeling DNAs, proteins, peptides, saccharides, and cells. In addition, this invention also discloses a method for forming the biochip with a three-dimensional mesoporous layer, including a blending process, a heating process, a coating process, a gelation process, a drying process, and a surface modification process.

Abstract: The present invention discloses a biochip with a three-dimensional structure. The surface of the three-dimensional mesoporous layer is chemically modified to recognize labeled DNAs, proteins, peptides, saccharides, and cells. In addition, this invention also discloses a method for preparing the biochip with a three-dimensional mesoporous layer, including a blending process, a heating process, a coating process, a gelation process, a cleaning process, a drying process, and a surface modification process.

Abstract: The present invention discloses a biochip with a three-dimensional structure. The surface of the three-dimensional mesoporous layer is chemically modified to recognize labeled DNAs, proteins, peptides, saccharides, and cells. In addition, this invention also discloses a method for preparing the biochip with a three-dimensional mesoporous layer, including a blending process, a heating process, a coating process, a gelation process, a cleaning process, a drying process, and a surface modification process.