Abstract: In order to reduce the occurrence of current alarms in a semiconductor etching or deposition process, a controller determines an offset in relative positions of a cover ring and a shield over a wafer within a vacuum chamber. The controller provides a position alarm and/or adjusts the position of the cover ring or shield when the offset is greater than a predetermined value or outside a range of acceptable values.

Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: In example implementations, a computing device is provided. The computing device includes an expansion interface, a first device, a second device, and a processor communicatively coupled to the expansion interface. The expansion interface includes a plurality of slots. Two slots of the plurality of slots are controlled by a single reset signal. The first device is connected to a first slot of the two slots and has a feature that is compatible with the single reset signal. The second device is connected to a second slot of the two slots and does not have the feature compatible with the single reset signal. The process is to detect the first device connected to the first slot and the second device connected to the second slot and disable the feature by preventing the first slot and the second slot from receiving the single reset signal.

Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.

Abstract: A semiconductor package and a manufacturing method thereof are described. The semiconductor package includes a package having dies encapsulated by an encapsulant, a redistribution circuit structure, first and second modules and affixing blocks. The redistribution circuit structure is disposed on the package. The first and second modules are disposed on and respectively electrically connected to the redistribution circuit structure by first and second connectors disposed there-between. The first and second modules are adjacent to each other and disposed side by side on the redistribution circuit structure. The affixing blocks are disposed on the redistribution circuit structure and between the first and second modules and the redistribution circuit structure. The affixing blocks include first footing portions located below the first module, second footing portions located below the second module, and exposed portions exposed from the first and second modules.

Abstract: A semiconductor structure includes a semiconductor wafer, a first surface mount component, a second surface mount component and a first barrier structure. The first surface mount component is disposed on the semiconductor wafer, and electrically connected to the semiconductor wafer through a plurality of first electrical connectors. The second surface mount component is disposed on the semiconductor wafer, and electrically connected to the semiconductor wafer through a plurality of second electrical connectors, wherein an edge of the second surface mount component is overhanging a periphery of the semiconductor wafer. The first barrier structure is disposed on the semiconductor wafer in between the second electrical connectors and the edge of the second surface mount component, wherein a first surface of the first barrier structure is facing the second electrical connectors, and a second surface of the first barrier structure is facing away from the second electrical connectors.

Abstract: The present invention provides a method for OSA (Obstructive Sleep Apnea) severity detection using recording-based electrocardiography (ECG) Signal. The major feature of the present invention emphasizes on using a recording-based ECG Signal as an input, which is different from the deep learning-based prior art of using segment-based signals as an input to a model, and the segment-based signals has only two classification results, i.e. normal or apnea. The present invention provides a method for a model to detect and output directly a value of apnea-hypopnea index (AHI) for the OSA Severity.

Abstract: The present invention provides a method for OSA (Obstructive Sleep Apnea) severity classification by using recording-based Peripheral Oxygen Saturation Signal. The major feature of the present invention emphasizes on using a recording-based Peripheral Oxygen Saturation Signal (SpO2 signal) as an input, which is different from the deep learning-based prior art of using segment-based signals as an input to a model, and the segment-based signals has only two classification results, i.e. normal or apnea.

Abstract: A carrier assembly for mounting equipment into a carrier slot includes an electro-magnetic interference (EMI) shield and an EMI finger. The EMI shield protects the mounted equipment from EMI. The EMI shield is formed in a first plane of the carrier assembly. The EMI finger protrudes from the EMI shield and is coupled to the EMI shield. The EMI finger is formed in a second plane perpendicular to the first plane. The EMI finger operates, when the carrier assembly is installed into the carrier slot, to couple the EMI shield to the carrier slot. The EMI finger, when viewed from a first direction that is perpendicular to both the first plane and the second plane, is formed in a tear-drop shape.

Abstract: A method for transmitting compressed brainwave physiological signals is provided and including detecting a plurality of brainwave physiological signals of a subject, and generating an electroencephalography based on a time sequence of the plurality of brainwave physiological signals; splitting the electroencephalography into a plurality of sub-images based on the time sequence; using a plurality of static feature tags and a plurality of dynamic displacement tags stored in a brainwave database to identify at least one static feature tag and a plurality of associated dynamic displacement tags based on the time sequence according to the plurality of sub-images; generating at least one superimposed group tag, the superposed group tag is used to integrate the identified static feature tag and the associated dynamic displacement tag according to the time sequence; and transmitting the identified static feature tag, the associated dynamic displacement tag, and the superimposed group tag to a remote cloud system acco

Abstract: An automatic evolution method used for a brainwave database which collects physiological information of brainwaves about healthy and clinical groups, the automatic evolution method includes: classifying the physiological information of brainwaves collected by the brainwave database according to data characteristics; establishing a feedback algorithm model based on a neural network architecture according to the physiological information of brainwaves classified by the parameters; using the feedback algorithm model to input a subject's physiological information of brainwaves; measuring an accuracy of the subsequent performance data calculated by the feedback algorithm model; and incorporating the physiological information of brainwaves of the subject into the brainwave database, establishing an updated feedback algorithm model based on an updated neural network architecture, and feeding a comparison result generated by the updated feedback algorithm model back to the subject.

Abstract: Provided is a method for long-distance transmission of physiological signals in a closed loop system, including generating a signal at a user terminal of the closed loop system, compressing the signal to generate a compressed signal, transmitting the compressed signal from the user terminal to a computing terminal of the closed loop system, receiving and comparing the compressed signal with a database at the computing terminal to generate a comparison result and a feedback signal, and transmitting the feedback signal from the computing terminal to the user terminal. A time interval between generating the signal and receiving the feedback signal at the user terminal is less than a threshold.

Abstract: The invention provides an oriented and covalent method for immobilizing a glycoprotein and an antibody on a chip. The method includes providing a silver-coated solid surface equipped with alkynes and cuprous oxide nanoparticles. The azido boronic acid tosyl probe is conjugated to the silver-coated solid surface by the cuprous oxide nanoparticles through the self-catalyzed azide-alkyne cycloaddition reaction. The glycan(s) of a glycoprotein or an antibody is provided to the boronic acid tosyl probe, and alcohol groups of the glycan(s) of the glycoprotein or the antibody and the boronic acid group of boronic acid tosyl probe form boronate ester. The nucleophilic residues on the glycoprotein or the antibody replace the tosyl group by SN2 reaction, so as to immobilize the glycoprotein or the antibody through the covalent bond formation.

Abstract: An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.

Abstract: A local wearable brain wave cap device for detection is provided to simultaneously detect brainwave and heart rate variability data of a subject and includes a brain wave detection cap, at least one ear electrode and a transmission unit. The brain wave detection cap includes a wearable device and a plurality of electrode units. The wearable device is suitable for arranging the plurality of electrode units on brain wave positions corresponding to head of a subject. Each of the plurality of electrode units includes an accelerator, a storage unit, an input/output unit and a primary amplifier for detecting a brain wave.

Abstract: A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

Abstract: A system for providing real-time biological feedback training through remote transmission is provided and includes a local brain wave collection device, a docking device, and a dongle. The local brain wave collection device is used to detect a brain wave and a heart rate variability data of a subject. The docking device communicates with the local brain wave collection device remotely to connect a remote cloud system to compare the brain wave and the heart rate variability data with a brain wave database to generate a comparison result, and according to the comparison result, the system provides the subject a feedback training interface.