Patents by Inventor Chun-Tang Lin

Chun-Tang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20120161301
    Abstract: A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.
    Type: Application
    Filed: May 20, 2011
    Publication date: June 28, 2012
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Jung-Pang Huang, Hui-Min Huang, Kuan-Wei Chuang, Chun-Tang Lin, Yih-Jenn Jiang