Patents by Inventor Chun Wang

Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135956
    Abstract: The application provides a method and an apparatus for measuring speech-image synchronicity, and a method and an apparatus for training a model, where the method for measuring speech-image synchronicity includes: acquiring a speech segment and an image segment of a video, where there is a correspondence between the speech segment and the image segment in the video; processing the speech segment and the image segment to obtain a speech feature of the speech segment and a visual feature of the image segment; and determining, according to the speech feature of the speech segment and the visual feature of the speech segment, whether there is synchronicity between the speech segment and the image segment, where the synchronicity is used for characterizing matching between a sound in the speech segment and a movement of a target character in the image segment.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Inventors: Chun WANG, Dingheng ZENG, Haiying WU, Xunyi ZHOU, Ning JIANG
  • Publication number: 20240135861
    Abstract: The present disclosure provides a display apparatus including an LED array. The display apparatus comprises a light emitting diode (LED) array, a power source, a controller, a PWM switch, and a current source module. The controller is configured to generate a control signal for controlling a first LED column during a scan period. The PWM switch is electrically connected between the first LED column and a second power level. The current source module is electrically connected between the first LED column and the second power level. The current source module is configured to provide a current flow with multiple levels. The PWM switch is controlled based on a first portion of the control signal, and the amount of the current flow provided by the current source module in the scan period depends on a second portion of the control signal.
    Type: Application
    Filed: October 23, 2022
    Publication date: April 25, 2024
    Inventors: Tsun-I WANG, Ching-Chun WU, Chia-Liang YANG
  • Publication number: 20240132487
    Abstract: Disclosed are TRPM8 modulators as defined by formula (I) for achieving a cooling effect on skin and mucousa.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 25, 2024
    Inventors: Nicolas COCITO ARMANINO, Agnes BOMBRUN, An CHAI, Julie CHARPENTIER, Chun CHEN, Roger EMTER, Marion MATHYS, Andreas NATSCH, Chao WANG, Lijun ZHOU
  • Publication number: 20240135643
    Abstract: The embodiment of the present application provides an information processing method, a device, a computer device, and a storage medium. The embodiment of the present application obtains a target video, each frame of the target video including a face image corresponding to a same object; inputting the face image of each frame into a first target preset backbone model, and outputting a first target image feature; inputting the first target image feature into a first target preset network model, and correspondingly outputting a first target expression coefficients. By decoupling the first target expression coefficient from non-expression coefficient, an accuracy of the expression coefficient that is extracted is greatly improved.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 25, 2024
    Inventors: Chun Wang, Dingheng Zeng, Xunyi Zhou, Ning Jiang
  • Publication number: 20240135747
    Abstract: An information processing method is provided. The method includes obtaining a target video. A first target image feature corresponding to a face image of each frame is obtained. A target identity coefficient and a target texture coefficient corresponding to the target image feature in the face image of a different frame in the target video are obtained. A first target identity feature is obtained according to the target identity coefficient, and a first target texture feature is obtained according to the target texture coefficient. Once a first target feature is obtained by splicing the target image feature, the first target identity feature and the first target texture feature, a first target expression coefficient is obtained based on the first target feature.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 25, 2024
    Inventors: Chun Wang, Dingheng Zeng, Xunyi Zhou, Ning Jiang
  • Publication number: 20240134155
    Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 25, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Yu-Tai TSENG, Yu-Chun KE, Kuo-Jui WANG, Tzu-Chieh KUO
  • Patent number: 11966628
    Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 23, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Wei-Chen Wang, Han-Wen Hu, Yung-Chun Li, Huai-Mu Wang, Chien-Chung Ho, Yuan-Hao Chang, Tei-Wei Kuo
  • Patent number: 11966338
    Abstract: This disclosure provides a method, a computing system, and a computer program product for managing prefetching of pages in a database system. The method comprises obtaining shared information associated with page access, wherein the shared information associated with the page access includes information associated with the page access from a plurality of computing nodes. The method further comprises determining whether to prefetch a number of pages into a global buffer pool based at least on the shared information associated with the page access using a sequential prefetching method.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Sheng Yan Sun, Xiaobo Wang, Shuo Li, Chun Lei Xu
  • Patent number: 11967622
    Abstract: Embodiments provide a dielectric inter block disposed in a metallic region of a conductive line or source/drain contact. A first and second conductive structure over the metallic region may extend into the metallic region on either side of the inter block. The inter block can prevent etchant or cleaning solution from contacting an interface between the first conductive structure and the metallic region.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Te-Chih Hsiung, Jyun-De Wu, Yi-Chen Wang, Yi-Chun Chang, Yuan-Tien Tu
  • Patent number: 11966374
    Abstract: The present invention discloses a medical clinical data quality analysis system based on big data, which relates to the field of medical big data technologies. The present invention is used to solve the technical problems that multi-link classified acquisition cannot be carried out on medical behaviors, and the quality of clinical data cannot be analyzed and reflected at the front end, middle link, and tail end of management. In the present invention, authenticity data, compliance data, process data and conclusive data are comprehensively acquired in admission, hospitalization, and discharge links of medical clinical data quality management, which is conducive to implementing multi-link classified acquisition of clinical medical behaviors, thereby facilitating subsequent dynamic and orderly quality analysis and control of clinical data.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: April 23, 2024
    Assignee: SERV MEDICAL PTE. LTD.
    Inventors: Chun-Chieh Hsu, Shiyu Zhang, Jiangjiu Huang, Yingxi Wang, Rashaad Nawaz Tawquir
  • Publication number: 20240128858
    Abstract: Methods and systems for operating a voltage regulator are described. A integrated circuit can be configured to adjust at least one of a deadtime parameter and a drive strength parameter of a power stage based on at least one of an input voltage being provided to a power stage, a switch node voltage of the power stage, and an output current of the power stage. A controller of the power stage can be further configured to adjust a deadtime of the power stage based on adjustment of the deadtime parameter. The controller can be further configured to adjust a drive strength of the first driver and the second driver based on adjustment of the drive strength parameter.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Applicant: Renesas Electronics America Inc.
    Inventors: Chun Cheung, Ankit Sharma, Bo Wang
  • Publication number: 20240124298
    Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 18, 2024
    Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
  • Publication number: 20240127918
    Abstract: A healthcare method provides services to establish portfolios of a healthcare plan according to user's health condition for managing their requirements for a period of time. These requirements may be classified to a variety of elements such as exercise, nutrients, diet, medical treatment and other services. Generally, most of people are very busy on their business and suffering from a lot of stress, it is easily to make them accumulate negative thinking, mood, health condition and dietary habit. It may make them neglect requirements of healthcare. Moreover, few people are interested in implementations of healthcare knowledge such as exercise, nutrition, disease, medical treatment and others. They usually like to google latest healthcare knowledge and keep it in their mind. However, these implementations are sophisticated and connected with each other. It is hard to be completely and accurately implemented for us.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 18, 2024
    Inventor: Ping-Chun Wang
  • Publication number: 20240128178
    Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.
    Type: Application
    Filed: February 8, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Hung LIN, Wei-Ming WANG, Su-Chun YANG, Jih-Churng TWU, Shih-Peng TAI, Kuo-Chung YEE
  • Publication number: 20240130246
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
  • Publication number: 20240128216
    Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Ching-Chun Wang, Hsiao-Hui Tseng, Chen-Jong Wang, Dun-Nian Yaung
  • Patent number: 11961893
    Abstract: Improved conductive contacts, methods for forming the same, and semiconductor devices including the same are disclosed. In an embodiment, a semiconductor device includes a first interlayer dielectric (ILD) layer over a transistor structure; a first contact extending through the first ILD layer, the first contact being electrically coupled with a first source/drain region of the transistor structure, a top surface of the first contact being convex, and the top surface of the first contact being disposed below a top surface of the first ILD layer; a second ILD layer over the first ILD layer and the first contact; and a second contact extending through the second ILD layer, the second contact being electrically coupled with the first contact.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Te-Chih Hsiung, Jyun-De Wu, Yi-Chen Wang, Yi-Chun Chang, Yuan-Tien Tu
  • Patent number: 11962986
    Abstract: The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes a thermoplastic polyester elastomer film layer, a thermoplastic polyester elastomer being a copolymer composed of a hard segment A of polyester and a soft segment B of polyether or aliphatic polyester, wherein the thermoplastic polyester elastomer film layer has Young's modulus of 1-1000 MPa, with an elastic recovery rate after 10% strain being greater than or equal to 80%. The speaker diaphragm has a good stiffness, a good damping performance and a good resilience.
    Type: Grant
    Filed: October 13, 2018
    Date of Patent: April 16, 2024
    Assignee: Goertek Inc.
    Inventors: Ting Wang, Guodong Zhao, Jie Zhu, Chun Li, Chunfa Liu
  • Patent number: 11963279
    Abstract: A wearable electronic device including: a first portion and a second portion. The first portion includes a first conductive area on a first inner surface of the first portion and a third conductive area on a first outer surface of the first portion. The second portion includes one or more second conductive areas on a second outer surface of the second portion and a fourth conductive area on a second inner surface of the second portion, wherein the first portion is connected to the second portion. A circuit unit is disposed in a second space of the second portion, wherein the circuit unit is configured to enable an input/output unit of the circuit unit in response to the first conductive area and the second conductive areas are triggered.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: April 16, 2024
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Ming Leung Vincent Tse, Anson Chan, Yuelin Wang, Chun Zhang
  • Patent number: 11961900
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes device fins formed on a substrate; fill fins formed on the substrate and disposed among the device fins; and gate stacks formed on the device fins and the fill fins. The fill fins include a first dielectric material layer and a second dielectric material layer deposited on the first dielectric material layer. The first and second dielectric material layers are different from each other in composition.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuo-Cheng Chiang, Teng-Chun Tsai, Kuan-Lun Cheng, Chih-Hao Wang