Abstract: A power circuit includes a first regulator and an impedance adjustment unit. The first regulator has a loop-back impedance, and provides a first power signal. The impedance adjustment unit is coupled to the first regulator, and operates to cause the first regulator to provide a second power signal having a power level different from that of the first power signal.

Abstract: A method provides an integrated circuit (IC) substrate having first and second alignment marks defined in a first pattern layer, and third and fourth alignment marks defined in a second pattern layer. The first and second alignment marks are illuminated, through a photomask, with a first light to determine a first layer alignment error including a first alignment error and a second alignment error. The first alignment error has more weight than the second alignment error in determining the first layer alignment error. The third and fourth alignment marks are illuminated with a second light to determine a second layer alignment error including a third alignment error in relation to the third alignment mark and a fourth alignment error in relation to the fourth alignment mark. The third alignment error has more weight than the fourth alignment error in determining the second layer alignment error.

Abstract: Among other things, one or more systems and techniques for promoting metal plating uniformity are provided. An insulator plate is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. The insulator plate comprises an insulator ring that provides a resistance to electrical plating current passing through the insulator ring to the semiconductor wafer. The insulator plate comprises one or more porous regions, such as holes, that introduce little to no additional resistance to electrical plating current passing through such porous regions to the semiconductor wafer. The insulator plate influences electrical plating current so that edge plating current has a current value similar to a center plating current. The similarity in plating current promotes metal plating uniformity for the semiconductor wafer.

Abstract: A system and method for forming a resistor system is provided. An embodiment comprises a resistor formed in a U-shape. The resistor may comprise multiple layers of conductive materials, with a dielectric layer filling the remainder of the U-shape. The resistor may be integrated with a dual metal gate manufacturing process or may be integrated with multiple types of resistors.

Abstract: An oscillator module used with a plurality of power sources includes an oscillator unit, a clock monitor unit (CMU), a software module and a digital calibration circuit. The oscillator unit generates a clock signal. The CMU is coupled to the oscillator unit, determines whether an amplitude of the clock signal exceeds a predetermined threshold, and outputs an alarm signal if the amplitude of the clock signal is lower than the predetermined threshold. The software module is coupled to the CMU, and receives the alarm signal to output a calibration signal. The digital calibration circuit is coupled to the oscillator and the software module, and outputs a control signal in response to the clock signal and the calibration signal, adjusting the plurality of power sources to modify the clock signal.

Abstract: In a method for adjusting brightness of a display screen of an electronic device, a current brightness value of the display screen and a current illumination value of ambient lights are acquired, and then are processed by denoising and normalizing. The current brightness value is adjusted to meet user preferences by self-learning according to the current illumination value and a brightness/illumination relationship table which stores a relationship between brightness values of the display screen and illumination values of ambient lights determined according to the user preferences.

Abstract: A method is provided to control speed of an electric vehicle. On operating the electric vehicle, temperature of a controller of the electric vehicle is monitored. The temperature of the controller monitored is compared with a preset temperature to find whether the temperature is too high. When the temperature of the controller is found to be too high, the current provided to the controller is reduced. Thus, the speed of the electric vehicle is lowered down while the temperature of the controller is further lowered down. Hence, good safety is achieved on operating the electric vehicle and use-life of the electric vehicle is prolonged.

Abstract: An integrated circuit comprises a power supply input pin receiving an off-chip supply voltage having a variable current, an on-chip power source powered by the off-chip supply voltage and providing a regulated current, a memory array, and a set of one or more circuits coupled to the memory array and powered by the regulated current from the on-chip power source. The IC can include control circuitry performing memory operations on the memory array, said control circuitry powered by at least the off-chip supply voltage from the power supply pin.

Abstract: A decode switch and a method for controlling a decode switch are provided. The decode switch includes a power source providing a first voltage, a source capacitance coupled to the power source, and a target capacitance coupled to the power source. The power source charges the source capacitance to the first voltage. The source capacitance is connected to the target capacitance and the source capacitance charges the target capacitance to a second voltage. The power source charges the target capacitance from the second voltage to the first voltage.

Abstract: Some embodiments of the present disclosure provide a semiconductor structure, including a substrate and a regrowth region. The substrate is made of a first material with a first lattice constant, and the regrowth region is made of the first material and a second material, having a lattice constant different from the first lattice constant. The regrowth region is partially positioned in the substrate. The regrowth region has a “tip depth” measured vertically from a surface of the substrate to a widest vertex of the regrowth region, and the tip depth being less than 10 nm. The regrowth region further includes a top layer substantially made of the first material, and the top layer has substantially the first lattice constant.

Abstract: A sapphire substrate with patterned structure includes a sapphire base; a plurality of the cavities formed on a surface of the sapphire base; and a template layer. The plurality of the cavities are periodically arranged at a predetermined distance from each other, and each of the plurality of the cavities has a bottom surface and a top opening. Each of the plurality of the cavities comprises at least a first and a second inclined surfaces, and the first and the second inclined surfaces are inclined by a first and a second angles respectively with respect to the bottom surface of the plurality of the cavities.

Abstract: A system and method for forming a resistor system is provided. An embodiment comprises a resistor formed in a U-shape. The resistor may comprise multiple layers of conductive materials, with a dielectric layer filling the remainder of the U-shape. The resistor may be integrated with a dual metal gate manufacturing process or may be integrated with multiple types of resistors.

Abstract: A power circuit includes a first regulator and an impedance adjustment unit. The first regulator has a loop-back impedance, and provides a first power signal. The impedance adjustment unit is coupled to the first regulator, and operates to cause the first regulator to provide a second power signal having a power level different from that of the first power signal.

Abstract: A detachable projection module and an electronic device having the same integrate an optical engine and an image processing unit into an independent detachable module, where the module case is fixedly connected to a device body of the electronic device, so that projection module can receive image signals from the electronic device and convert the received image signals into projection signals to be projected onto a surface near the device body of the electronic device. Through a dedicated or generic connector interface, the detachable projection module may be removed from one electronic device and be mounted to another electronic device, giving an electronic device capability of equipping a projection module to extend the electronic device with a secondary display or empower an electronic device, which has no display at first, with display ability.

Abstract: A power drop detector circuit includes a detect element, for coupling to a first source voltage, for detecting a voltage level of the first source voltage, and a memory element coupled to the detect element and switchable between a first memory state and a second memory state based on the voltage level of the first source voltage.

Abstract: A sapphire substrate with patterned structure includes a sapphire base; a plurality of the cavities formed on a surface of the sapphire base; and a template layer. The plurality of the cavities are periodically arranged at a predetermined distance from each other, and each of the plurality of the cavities has a bottom surface and a top opening. Each of the plurality of the cavities comprises at least a first and a second inclined surfaces, and the first and the second inclined surfaces are inclined by a first and a second angles respectively with respect to the bottom surface of the plurality of the cavities.

Abstract: A cooling structure integrated all-in-one computer includes a display device including a hollow frame having retaining members located therein, a first electric connector mounted in the hollow frame and a display module mounted in the hollow frame, and a mainframe including an aluminum extruded casing slidably inserted into a back opening of the hollow frame, engaging members located in the casing for engaging the retaining members upon insertion of the casing into the hollow frame, and a motherboard mounted in a recessed accommodation chamber in the casing with heat-emitting sources thereof abutted against respective heat-transferring bearing blocks of the casing for quick dissipation of heat and a second electric connector thereof connected to the first electric connector.

Abstract: A detachable projection module and an electronic device having the same integrate an optical engine and an image processing unit into an independent detachable module, where the module case is fixedly connected to a device body of the electronic device, so that projection module can receive image signals from the electronic device and convert the received image signals into projection signals to be projected onto a surface near the device body of the electronic device. Through a dedicated or generic connector interface, the detachable projection module may be removed from one electronic device and be mounted to another electronic device, giving an electronic device capability of equipping a projection module to extend the electronic device with a secondary display or empower an electronic device, which has no display at first, with display ability.

Abstract: Adjustable electronic device stand includes a base member defining therein a circular accommodation recess, an adjustment mechanism including an axial rotary table, a rotating component set consisting of a stub rod member, a driving plate, a rotating plate and a position-limit plate for rotatably securing the axial rotary table to the base member and a longitudinal adjustment unit pivotally coupled with a first pivot at one side thereof to the axial rotary table, and an electronic device holder including a mating connection member pivotally coupled to a second pivot at an opposite side of the longitudinal adjustment unit, a supporting platform for holding an electronic device, an electrical connector for the connection of an electrical connector of the loaded electronic device and a retractable clamp for clamping on the loaded electronic device.

Abstract: An integrated circuit comprises a power supply input pin for receiving an off-chip supply voltage which can have a variable current, an on-chip power source to be powered by the off-chip supply voltage and which can provide a regulated current, a set of one or more circuits to be powered by at least one of the off-chip supply voltage and the on-chip power source, a configuration memory storing a set of one or more memory settings that indicate whether a circuit of said set of one or more circuits is powered by the on-chip power source, and control circuitry responsive to the at least one memory setting to control whether said circuit of said set of one or more circuits is powered by the on-chip power source.