Abstract: A software emulation system for a gas delivery system of a substrate processing system includes an input/output bus and an emulator bus. An input/output bus adapter includes a switch configured to route data packets from a system controller for the substrate processing system to one of the input/output bus and the emulator bus. A gas delivery system emulator in communication with the emulator bus is configured to receive the data packets from the input/output bus adapter via the emulator bus and perform software-based emulation of a plurality of hardware components of the gas delivery system that are interconnected. The plurality of hardware components are modelled using one or more software models and include a gas source and at least one of a valve and a mass flow controller.

Abstract: A data collection system for semiconductor manufacturing includes: T substrate processing tools, where each of the T substrate processing tools includes: N processing chambers, where each of the N processing chambers includes a processing chamber controller configured to receive a plurality of different types of data during operating of the corresponding one of the N processing chambers, where the plurality of different types of data have different formats, where the processing chamber controller is further configured to format the plurality of different types of data into formatted data, and where T and N are integers; and a data diagnostic services computer configured to: receive and store the formatted data as categories in a common file having a table-like data structure including rows with contextual data; and in response to a request, generate an output file including a subset of the data from the common file.

Abstract: For etching tools, a neural network model is trained to predict optimum scheduling parameter values. The model is trained using data collected from preventive maintenance operations, recipe times, and wafer-less auto clean times as inputs. The model is used to capture underlying relationships between scheduling parameter values and various wafer processing scenarios to make predictions. Additionally, in tools used for multiple parallel material deposition processes, a nested neural network based model is trained using machine learning. The model is initially designed and trained offline using simulated data and then trained online using real tool data for predicting wafer routing path and scheduling. The model improves accuracy of scheduler pacing and achieves highest tool/fleet utilization, shortest wait times, and fastest throughput.

Abstract: A system includes an interface and a controller. The interface is configured to receive a state of a substrate processing tool comprising a plurality of process modules configured to process a substrate. The controller is configured to correlate the state with an input previously received by the substrate processing tool from the interface based on the state and to generate an output to control the substrate processing tool based on the correlation.

Abstract: A software emulation system for a gas delivery system of a substrate processing system includes an input/output bus and an emulator bus. An input/output bus adapter includes a switch configured to route data packets from a system controller for the substrate processing system to one of the input/output bus and the emulator bus. A gas delivery system emulator in communication with the emulator bus is configured to receive the data packets from the input/output bus adapter via the emulator bus and perform software-based emulation of a plurality of hardware components of the gas delivery system that are interconnected. The plurality of hardware components are modelled using one or more software models and include a gas source and at least one of a valve and a mass flow controller.

Abstract: A system includes an interface and a controller. The interface is configured to receive a state a substrate processing tool comprising a plurality of process modules configured to process a substrate. The controller is configured to correlate the state with an input previously received by the substrate processing tool from the interface based on the state and to generate an output to control the substrate processing tool based on the correlation.

Abstract: Integration of semiconductor tool maintenance operations on mobile devices to allow technicians to more accurately perform semiconductor tool maintenance and to allow more accurate analysis of data to improve maintenance procedures to be more repeatable, consistent, and efficient. Remote control of maintenance operations for the semiconductor tool via a portable electronic device decreases the time required to service semiconductor tools and thus increase throughput.

Abstract: Methods and systems for sharing information related to operational metrics of a plurality of equipment used in manufacturing of semiconductor wafer includes interfacing a server with the equipment to allow the server to receive a plurality of parameters including operational metrics associated with operation of each of the plurality of equipment. The plurality of parameters are processed to identify event-related data, message-related data and to generate human-readable interpretation for the identified event-related data and the message related data. Users are identified for receiving the operational metrics of each of the plurality of equipment. The event-related data, message-related data and the corresponding human-readable interpretation for the operational metrics associated with each of the equipment are forwarded to a social network service for performing a posting operation to social data streams associated with the identified users.

Abstract: A method for establishing a virtual tether between a mobile device and a semiconductor processing tool, the method including: obtaining, by a mobile device, a unique key associated with the semiconductor processing tool; establishing a unique pairing between the mobile device and the semiconductor processing tool based on the unique key that is obtained by the mobile device; in response to successfully establishing the unique pairing, authenticating a user of the mobile device for access to the semiconductor processing tool; in response to successfully authenticating the user, performing resource arbitration on the semiconductor processing tool which includes reserving one or more resources associated with the semiconductor processing tool based on a level of access granted to the user; monitoring an activity level of the mobile device over a period of time; and comparing the activity level to a predetermined activity level threshold.

Abstract: Methods and systems for sharing information related to operational metrics of a plurality of equipment used in manufacturing of semiconductor wafer includes interfacing a server with the equipment to allow the server to receive a plurality of parameters including operational metrics associated with operation of each of the plurality of equipment. The plurality of parameters are processed to identify event-related data, message-related data and to generate human-readable interpretation for the identified event-related data and the message related data. Users are identified for receiving the operational metrics of each of the plurality of equipment. The event-related data, message-related data and the corresponding human-readable interpretation for the operational metrics associated with each of the equipment are forwarded to a social network service for performing a posting operation to social data streams associated with the identified users.

Abstract: A method for establishing a virtual tether between a mobile device and a semiconductor processing tool, the method including: obtaining, by a mobile device, a unique key associated with the semiconductor processing tool; establishing a unique pairing between the mobile device and the semiconductor processing tool based on the unique key that is obtained by the mobile device; in response to successfully establishing the unique pairing, authenticating a user of the mobile device for access to the semiconductor processing tool; in response to successfully authenticating the user, performing resource arbitration on the semiconductor processing tool which includes reserving one or more resources associated with the semiconductor processing tool based on a level of access granted to the user; monitoring an activity level of the mobile device over a period of time; and comparing the activity level to a predetermined activity level threshold.

Abstract: Integration of semiconductor tool maintenance operations on mobile devices to allow technicians to more accurately perform semiconductor tool maintenance and to allow more accurate analysis of data to improve maintenance procedures to be more repeatable, consistent, and efficient. Remote control of maintenance operations for the semiconductor tool via a portable electronic device decreases the time required to service semiconductor tools and thus increase throughput.

Abstract: A process-level troubleshooting architecture (PLTA) configured to facilitate substrate processing in a plasma processing system is provided. The architecture includes a process module controller. The architecture also includes a plurality of sensors, wherein each sensor of the plurality of sensors communicates with the process module controller to collect sensed data about one or more process parameters. The architecture further includes a process-module-level analysis server, wherein the process-module-level analysis server communicates directly with the plurality of sensors and the process module controller. The process-module-level analysis server is configured for receiving data, wherein the data include at least one of the sensed data from the plurality of sensors and process module and chamber data from the process module controller.

Abstract: A method of operating one or more back end circuits of a plasma processing system, comprising: prior to a front end module receiving one or more wafers to be processed, receiving preliminary data at a back end circuit, wherein the preliminary data indicates a recipe and a predetermined number, the predetermined number indicating a number of wafers to be processed; determining whether a plasma processing chamber is ready for processing; and if the chamber is ready for processing and via the back end circuit, selecting a load lock, based on the predetermined number, instructing the front end module to pull the one or more wafers into the load lock, enabling the chamber to process a first wafer of the one or more wafers according to the recipe, and subsequent to the processing of the first wafer, instructing the front end module to remove the first wafer from the chamber.

Abstract: The amount of RF power supplied to a plasma in a vacuum plasma processing chamber is gradually changed on a preprogrammed basis in response to signals stored in a computer memory. The computer memory stores signals so that other processing chamber parameters (pressure, gas species and gas flow rates) remain constant while the gradual change occurs. The stored signals enable rounded corners, instead of sharp edges, to be etched, e.g., at an intersection of a trench wall and base.

Abstract: A computer-implemented method for performing data management in a plasma processing system is provided. The method includes providing a recipe-and component control module (RACCM). The RACCM is a server that includes a plurality of intelligent agents, which are configured to interact with the plurality of components. The RACCM also includes a coordinating agent, which is configured to receive processed data from the plurality of intelligent agents. The RACCM further includes a set of provisional agents, which is configured to perform recipe management by distributing at least part of a recipe to at least one of the plurality of intelligent agents and the coordinating agent.

Abstract: Methods and apparatus for controlling a plasma processing system in a purely pull mode or a hybrid pull mode. In the purely pull mode, the back end assumes master control at least for requesting and scheduling loading of production wafers. In the hybrid pull mode, the back end assumes master control at least for tool maintenance/cleaning while the front end retains master control for production wafers.

Abstract: Methods and systems to optimize wafer placement repeatability in semiconductor manufacturing equipment using a controlled series of wafer movements are provided. In one embodiment, a preliminary station calibration is performed to teach a robot position for each station interfaced to facets of a vacuum transfer module used in semiconductor manufacturing. The method also calibrates the system to obtain compensation parameters that take into account the station where the wafer is to be placed, position of sensors in each facet, and offsets derived from performing extend and retract operations of a robot arm. In another embodiment where the robot includes two arms, the method calibrates the system to compensate for differences derived from using one arm or the other. During manufacturing, the wafers are placed in the different stations using the compensation parameters.

Abstract: The amount of RF power supplied to a plasma in a vacuum plasma processing chamber is gradually changed on a preprogrammed basis in response to signals stored in a computer memory. The computer memory stores signals so that other processing chamber parameters (pressure, gas species and gas flow rates) remain constant while the gradual change occurs. The stored signals enable rounded corners, instead of sharp edges, to be etched, e.g., at an intersection of a trench wall and base.

Abstract: A system for facilitating plasma processing tool component management across plurality of tools is provided. The system includes means for receiving first component data for first plurality of components, including identification and usage history for a first plurality of components, at first database associated with first tool. The system also includes means for receiving second component data for second plurality of components at second database associated with second tool, which is different from first tool. The system further includes means for synchronizing first and second component data with third database. The synchronizing includes synchronizing between third database and at least one of first and second database rules that govern usage of at least one component of first and second plurality of components. The third database is coupled to exchange data with plurality of tools.