Abstract: In some embodiments, the present disclosure relates to an integrated chip including a gate electrode over a substrate. A pair of source/drain regions are disposed in the substrate on opposing sides of the gate electrode. A dielectric layer is over the substrate. An etch stop layer is between the gate electrode and the dielectric layer. A gate capping layer overlies the gate electrode, continuously extends from a top surface of the etch stop layer to a top surface of the gate electrode, and comprises a curved sidewall over the top surface of the etch stop layer. A conductive contact overlies an individual source/drain region. A width of the conductive contact continuously decreases from a top surface of the conductive contact to a first point disposed above a lower surface of the gate capping layer. The conductive contact extends along the curved sidewall of the gate capping layer.

Abstract: The present disclosure provides an image sensor, which may include a driving layer, a negative electrode layer formed in the driving layer, a N-region layer formed above the negative electrode layer. The N-region layer includes multiple cylindrical structures formed of semiconductor materials. The image sensor may also include a light absorption layer formed above the N-region layer. The light absorption layer is composed of a multi-layer structure including a P-region layer formed using quantum dot semiconductor materials. The image sensor may further include a positive electrode layer formed above the light absorption layer and configured to receive incoming light signals.

Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: The present disclosure discloses an advanced mental fatigue early warning system, electronic device and storage medium, including a data acquisition module, a preprocessing module, an adjustment ability calculation module, a fatigue early warning module, a communication module and a storage module; the data acquisition module is configured for obtaining pupil diameter data; the preprocessing module is configured for preprocessing the pupil diameter data, removing invalid data, and performing linear interpolation; the adjustment ability calculation module is configured for performing calculation and correcting the preprocessed pupil diameter data; the fatigue early warning module is configured for performing mathematical modeling, establishing an advanced prediction model, and calculating a remaining time for an upcoming mental fatigue occurs and issuing an alarm; the communication module is configured for uploading mental fatigue adjustment abilities and alarm methods; the storage module is configured for arc

Abstract: The present disclosure relates to a collection device and a preparation system, including a pre-adjustment mechanism which is disposed in a housing and configured to adjust at least one bundle of carbon nanotube aggregates, and includes a first pre-adjustment sub-mechanism and a second pre-adjustment sub-mechanism for adjusting carbon nanotube aggregations along a first direction and a second direction, respectively; a winding mechanism for winding and collecting the carbon nanotube aggregates passing through the pre-adjustment mechanism.

Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: A closed variable-frequency heat pump drying device with a heat regenerator includes a variable-frequency compressor, a condenser, a throttling valve, an evaporator, a heat regenerator, a three-way valve, a variable-frequency fan, an air inlet temperature sensor, an air inlet humidity sensor, a drying bin, an air outlet temperature sensor, an air outlet humidity sensor and a controller. The controller regulates frequency of the variable-frequency compressor by comparing magnitudes of actual and set air inlet temperatures; a ratio of a straight-through air volume to a regenerated air volume of the three-way valve by comparing magnitudes of actual and set air inlet humidity; and frequency of the variable-frequency fan by comparing magnitudes of actual and set air humidity difference and magnitudes of actual and set air temperature difference of medium air entering and exiting the drying bin.

Abstract: Example methods and apparatus for transmitting ACK/NACK information for data are disclosed. One method includes sending a data packet from a base station to a user equipment. A control signaling is transmitted from the base station to the user equipment and is used to indicate a subframe to be used by the user equipment to send ACK/NACK information corresponding to the data packet.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: In some embodiments, the present disclosure relates to a method for manufacturing an integrated chip. The method includes forming a transistor structure over a substrate. The transistor structure comprises a pair of source/drain regions and a gate electrode between the source/drain regions. A lower inter-level dielectric (ILD) layer is formed over the pair of source/drain regions and around the gate electrode. A gate capping layer is formed over the gate electrode. A selective etch and deposition process is performed to form a dielectric protection layer on the gate capping layer while forming a contact opening within the lower ILD layer. A lower source/drain contact is formed within the contact opening.

Abstract: An autofocus system includes a focus light source, an objective lens, a defocus lens, a first image sensor, and a controller. The defocus lens is disposed on the transmission path of the focus light beam, so that a minimum light point of the focus light beam passing through the objective lens deviates from a focus of the objective lens. The first image sensor is configured to receive a focus reflected light beam generated after the focus light beam is reflected by the sample. The controller is electrically connected to the first image sensor. According to a center change of gravity, a position change, or an energy change of a light spot formed by the focus reflected light beam on an image plane of the first image sensor, the controller drives the objective lens or the sample to move, so that the focus of the objective lens falls on the sample.

Abstract: Disclosed are a thermoforming device and method for a flexible printed circuit board. The thermoforming device may include: a first forming mechanism provided with a first forming portion, the first forming portion being configured to carry the flexible printed circuit board to be processed; a second forming mechanism provided with a second forming portion which matches with the first forming portion, at least one of the first forming portion or the second forming portion is provided with a corresponding heating module configured for heat treatment of the flexible printed circuit board; a first driving mechanism configured to drive the first forming mechanism and the second forming mechanism to be displaced relative to each other in a first direction; a second driving mechanism configured to drive the second forming mechanism and the first forming mechanism to be displaced relative to each other in a second direction perpendicular to the first direction; and a controller.

Abstract: A load sensor calibration method and apparatus, and a computer-readable storage medium are provided. The load sensor calibration method includes: acquiring operation data of a wind turbine generator set, wherein the operation data comprises data of the wind turbine generator set operating in a normal operating state or data of the wind turbine generator set operating under different predetermined pitch angle idling states; generating a calibration training set on the basis of the operation data; and calibrating a load sensor according to the calibration training set.

Abstract: An electronic device is provided with a first connector module configured to mate with an external plug. The first connector module includes a first set of terminals; a first wafer supporting the first set of terminals, a first one or more of the second ends of the first set of terminals are bent to form a first set of tails, and a second one or more of the second ends of the first set of terminals terminate within the first wafer; and a tail alignment structure positioned to support the first set of tails. The electronic device further includes a cable arrangement forming a connection with the second one or more of the second ends of the first set of terminals; a host board configured to form an electrical connection with the first set of tails; and a shield assembly.

Abstract: There is provided a method and system for vehicle security protection. The method comprises: determining, at a detector, a first sensor signal from a flex sensor in an exterior panel of a vehicle, wherein the flex sensor and detector are powered by a power supply of the vehicle, and wherein a magnitude of the first sensor signal is based on an amount of bending of the flex sensor; determining, at the detector, based on the first sensor signal, that the exterior panel of the vehicle is deformed; and outputting, from the detector, a first alert signal, wherein a first controller of the vehicle is configured to transition from a low-power state to a high-power state based at least in part on the first sensor signal.

Abstract: A reflector unit may behave as a retroreflector to reflect light of a selected color. The reflector unit may comprise a first reflector having a first color, a second reflector having a second color, and a mask that either allows incoming light to reach the first reflector and not the second reflector or allows incoming light to reach the second reflector and not the first reflector. An active light unit may emit light of a particular color in response to receiving light. In this fashion, the active light unit may simulate the operation of a reflector. The reflector unit and the active light unit may operate on a bi-directional vehicle.