Patents by Inventor Damien Slevin
Damien Slevin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220415620Abstract: A thermal choke rod connecting a radio frequency source to a substrate support of a plasma processing system includes a tubular member having a first connector for connecting to an RF rod coupled to the substrate support and a second connector for connecting to an RF strap that couples to the RF source. A tubular segment extends between the first and second connectors. The first connector has a conically-shaped end region that tapers away from the inner surface thereof to an outer surface in a direction toward the tubular segment, and slits that extend for a prescribed distance from a terminal end of the first connector. The outer surface of the tubular segment has a threaded region for threaded engagement with an annular cap that fits over the first connector and reduces an inner diameter of the first connector upon contact with the conically-shaped end region of the first connector.Type: ApplicationFiled: August 31, 2022Publication date: December 29, 2022Inventors: Timothy S. THOMAS, Vincent BURKHART, Joel HOLLINGSWORTH, David FRENCH, Damien SLEVIN
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Patent number: 11469084Abstract: A thermal choke rod connecting a radio frequency source to a substrate support of a plasma processing system includes a tubular member having a first connector for connecting to an RF rod coupled to the substrate support and a second connector for connecting to an RF strap that couples to the RF source. A tubular segment extends between the first and second connectors. The first connector has a conically-shaped end region that tapers away from the inner surface thereof to an outer surface in a direction toward the tubular segment, and slits that extend for a prescribed distance from a terminal end of the first connector. The outer surface of the tubular segment has a threaded region for threaded engagement with an annular cap that fits over the first connector and reduces an inner diameter of the first connector upon contact with the conically-shaped end region of the first connector.Type: GrantFiled: September 5, 2017Date of Patent: October 11, 2022Assignee: Lam Research CorporationInventors: Timothy S. Thomas, Vince Burkhart, Joel Hollingsworth, David French, Damien Slevin
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Patent number: 10774588Abstract: A cluster tool system, including: a load lock; a first wafer transfer module; a buffer module; a second wafer transfer module; wherein the load lock, the first wafer transfer module, the buffer module, and the second wafer transfer module are positioned in a linear arrangement; a first process module connected to the first wafer transfer module on a first side of the linear arrangement; a second process module connected to the second wafer transfer module on the first side; a third process module connected to the first wafer transfer module on a second side of the linear arrangement that is opposite the first side; a fourth process module connected to the second wafer transfer module on the second side; a first ladder assembly connected to the buffer module on the first side; a second ladder assembly connected to the buffer module on the second side.Type: GrantFiled: July 26, 2019Date of Patent: September 15, 2020Assignee: Lam Research CorporationInventors: Miguel Benjamin Vasquez, Damien Slevin
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Patent number: 10760160Abstract: A showerhead tilt adjustment mechanism is provided which supports a showerhead module in a top plate of a semiconductor substrate processing apparatus, the showerhead tilt adjustment mechanism including a differential screw which provides coarse and fine adjustments to adjust gap/tilt/planarization of a faceplate of the showerhead module with respect to an upper surface of a substrate pedestal module adjacent the faceplate in the semiconductor substrate processing apparatus.Type: GrantFiled: January 25, 2019Date of Patent: September 1, 2020Assignee: Lam Research CorporationInventors: Bin Luo, Timothy Scott Thomas, Damien Slevin, David Kamp
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Publication number: 20190345766Abstract: A cluster tool system, including: a load lock; a first wafer transfer module; a buffer module; a second wafer transfer module; wherein the load lock, the first wafer transfer module, the buffer module, and the second wafer transfer module are positioned in a linear arrangement; a first process module connected to the first wafer transfer module on a first side of the linear arrangement; a second process module connected to the second wafer transfer module on the first side; a third process module connected to the first wafer transfer module on a second side of the linear arrangement that is opposite the first side; a fourth process module connected to the second wafer transfer module on the second side; a first ladder assembly connected to the buffer module on the first side; a second ladder assembly connected to the buffer module on the second side.Type: ApplicationFiled: July 26, 2019Publication date: November 14, 2019Inventors: Miguel Benjamin Vasquez, Damien Slevin
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Patent number: 10378279Abstract: A ladder assembly is provided, including the following: a mounting plate that connects to a side surface of a module in a fabrication facility; a step ladder, including, a ladder frame having an arm that connects to the mounting plate at a first joint, wherein the step ladder rotates about the first joint between a lowered position and a raised position, the lowered positioned defined by resting of the step ladder on a floor of the fabrication facility, and the raised position defined by suspension of the step ladder off of the floor and substantially over the module; a plurality of step plates connected to the ladder frame, the step plates defining step surfaces for a user when the step ladder is in the lowered position. A sleeve extends below one of the step plates of the step ladder, to house electronic equipment used in the fabrication facility.Type: GrantFiled: July 12, 2017Date of Patent: August 13, 2019Assignee: Lam Research CorporationInventors: Miguel Benjamin Vasquez, Damien Slevin
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Patent number: 10358722Abstract: A face plate of a showerhead assembly of a deposition apparatus in which semiconductor substrates are processed includes gas holes arranged in an asymmetric pattern with a hole density which is substantially uniform or varies across the face plate. The face plate can include a lower wall and an outer wall extending vertically upwardly from an outer periphery of the lower wall. The outer wall is sealed to an outer periphery of a back plate such that an inner plenum is formed between the face plate and the back plate. The gas hole pattern in the face plate avoids symmetry which can cause defects on processed substrates.Type: GrantFiled: December 14, 2015Date of Patent: July 23, 2019Assignee: LAM RESEARCH CORPORATIONInventors: John Wiltse, Damien Slevin
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Publication number: 20190153601Abstract: A showerhead tilt adjustment mechanism is provided which supports a showerhead module in a top plate of a semiconductor substrate processing apparatus, the showerhead tilt adjustment mechanism including a differential screw which provides coarse and fine adjustments to adjust gap/tilt/planarization of a faceplate of the showerhead module with respect to an upper surface of a substrate pedestal module adjacent the faceplate in the semiconductor substrate processing apparatus.Type: ApplicationFiled: January 25, 2019Publication date: May 23, 2019Applicant: LAM RESEARCH CORPORATIONInventors: Bin Luo, Timothy Scott Thomas, Damien Slevin, David Kamp
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Publication number: 20190071778Abstract: A thermal choke rod connecting a radio frequency source to a substrate support of a plasma processing system includes a tubular member having a first connector for connecting to an RF rod coupled to the substrate support and a second connector for connecting to an RF strap that couples to the RF source. A tubular segment extends between the first and second connectors. The first connector has a conically-shaped end region that tapers away from the inner surface thereof to an outer surface in a direction toward the tubular segment, and slits that extend for a prescribed distance from a terminal end of the first connector. The outer surface of the tubular segment has a threaded region for threaded engagement with an annular cap that fits over the first connector and reduces an inner diameter of the first connector upon contact with the conically-shaped end region of the first connector.Type: ApplicationFiled: September 5, 2017Publication date: March 7, 2019Inventors: Timothy S. Thomas, Vince Burkhart, Joel Hollingsworth, David French, Damien Slevin
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Publication number: 20190032214Abstract: A showerhead tilt adjustment mechanism is provided which supports a showerhead module in a top plate of a semiconductor substrate processing apparatus, the showerhead tilt adjustment mechanism including a differential screw which provides coarse and fine adjustments to adjust gap/tilt/planarization of a faceplate of the showerhead module with respect to an upper surface of a substrate pedestal module adjacent the faceplate in the semiconductor substrate processing apparatus.Type: ApplicationFiled: July 25, 2017Publication date: January 31, 2019Applicant: LAM RESEARCH CORPORATIONInventors: Bin Luo, Timothy Scott Thomas, Damien Slevin, Dave Kamp
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Patent number: 10190216Abstract: A showerhead tilt adjustment mechanism is provided which supports a showerhead module in a top plate of a semiconductor substrate processing apparatus, the showerhead tilt adjustment mechanism including a differential screw which provides coarse and fine adjustments to adjust gap/tilt/planarization of a faceplate of the showerhead module with respect to an upper surface of a substrate pedestal module adjacent the faceplate in the semiconductor substrate processing apparatus.Type: GrantFiled: July 25, 2017Date of Patent: January 29, 2019Assignee: LAM RESEARCH CORPORATIONInventors: Bin Luo, Timothy Scott Thomas, Damien Slevin, Dave Kamp
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Publication number: 20190017323Abstract: A ladder assembly is provided, including the following: a mounting plate that connects to a side surface of a module in a fabrication facility; a step ladder, including, a ladder frame having an arm that connects to the mounting plate at a first joint, wherein the step ladder rotates about the first joint between a lowered position and a raised position, the lowered positioned defined by resting of the step ladder on a floor of the fabrication facility, and the raised position defined by suspension of the step ladder off of the floor and substantially over the module; a plurality of step plates connected to the ladder frame, the step plates defining step surfaces for a user when the step ladder is in the lowered position. A sleeve extends below one of the step plates of the step ladder, to house electronic equipment used in the fabrication facility.Type: ApplicationFiled: July 12, 2017Publication date: January 17, 2019Inventors: Miguel Benjamin Vasquez, Damien Slevin
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Publication number: 20170167024Abstract: A face plate of a showerhead assembly of a deposition apparatus in which semiconductor substrates are processed includes gas holes arranged in an asymmetric pattern with a hole density which is substantially uniform or varies across the face plate. The face plate can include a lower wall and an outer wall extending vertically upwardly from an outer periphery of the lower wall. The outer wall is sealed to an outer periphery of a back plate such that an inner plenum is formed between the face plate and the back plate. The gas hole pattern in the face plate avoids symmetry which can cause defects on processed substrates.Type: ApplicationFiled: December 14, 2015Publication date: June 15, 2017Applicant: Lam Research CorporationInventors: John Wiltse, Damien Slevin
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Patent number: 9637821Abstract: A method for supplying vapor to a chamber includes providing a first diverter valve that, when open, diverts vapor away from the chamber, and a second diverter valve that, when open, supplies the vapor to the chamber; supplying a carrier gas to the chamber; after supplying the carrier gas, creating plasma in the chamber while a substrate is in the chamber; opening the first diverter valve and closing the second diverter valve; supplying the vapor by vaporizing at least one liquid precursor in a carrier gas; after a first predetermined period sufficient for the vapor to reach steady-state flow, closing the first diverter valve and opening the second diverter valve to supply the vapor to the chamber; and after a second predetermined period following the first predetermined period, opening the first diverter valve and closing the second diverter valve to stop supplying the vapor to the chamber.Type: GrantFiled: December 4, 2013Date of Patent: May 2, 2017Assignee: LAM RESEARCH CORPORATIONInventors: Damien Slevin, Brad Laird, Curtis Bailey, Ming Li, Sirish Reddy, James Sims, Mohamed Sabri, Saangrut Sangplug
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Patent number: 9236244Abstract: Disclosed herein are methods of depositing layers of material on multiple semiconductor substrates at multiple processing stations within one or more reaction chambers. The methods may include dosing a first substrate with film precursor at a first processing station and dosing a second substrate with film precursor at a second processing station with precursor flowing from a common source, wherein the timing of said dosing is staggered such that the first substrate is dosed during a first dosing phase during which the second substrate is not substantially dosed, and the second substrate is dosed during a second dosing phase during which the first substrate is not substantially dosed. Also disclosed herein are apparatuses having a plurality of processing stations contained within one or more reaction chambers and a controller with machine-readable instructions for staggering the dosing of first and second substrates at first and second processing stations.Type: GrantFiled: December 15, 2014Date of Patent: January 12, 2016Assignee: Lam Research CorporationInventors: Ramesh Chandrasekharan, Adrien LaVoie, Damien Slevin, Karl Leeser
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Publication number: 20150099372Abstract: Disclosed herein are methods of depositing layers of material on multiple semiconductor substrates at multiple processing stations within one or more reaction chambers. The methods may include dosing a first substrate with film precursor at a first processing station and dosing a second substrate with film precursor at a second processing station with precursor flowing from a common source, wherein the timing of said dosing is staggered such that the first substrate is dosed during a first dosing phase during which the second substrate is not substantially dosed, and the second substrate is dosed during a second dosing phase during which the first substrate is not substantially dosed. Also disclosed herein are apparatuses having a plurality of processing stations contained within one or more reaction chambers and a controller with machine-readable instructions for staggering the dosing of first and second substrates at first and second processing stations.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Inventors: Ramesh Chandrasekharan, Adrien LaVoie, Damien Slevin, Karl Leeser
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Patent number: 8985152Abstract: A point-of-use valve (POU valve) manifold is provided that allows for multiple precursors to be delivered to a semiconductor processing chamber through a common outlet. The manifold may have a plurality of precursor inlets and a purge gas inlet. The manifold may be configured such that there are zero dead legs in the manifold when the purge gas is routed through the manifold, and may provide mounting location for the POU valves that alternate sides. One or more internal flow path volumes may include elbow features.Type: GrantFiled: September 25, 2012Date of Patent: March 24, 2015Assignee: Novellus Systems, Inc.Inventors: Ramesh Chandrasekharan, Chunguang Xia, Karl F. Leeser, Damien Slevin, Thomas G. Jewell
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Patent number: 8940646Abstract: Disclosed herein are methods of depositing layers of material on multiple semiconductor substrates at multiple processing stations within one or more reaction chambers. The methods may include dosing a first substrate with film precursor at a first processing station and dosing a second substrate with film precursor at a second processing station with precursor flowing from a common source, wherein the timing of said dosing is staggered such that the first substrate is dosed during a first dosing phase during which the second substrate is not substantially dosed, and the second substrate is dosed during a second dosing phase during which the first substrate is not substantially dosed. Also disclosed herein are apparatuses having a plurality of processing stations contained within one or more reaction chambers and a controller with machine-readable instructions for staggering the dosing of first and second substrates at first and second processing stations.Type: GrantFiled: December 18, 2013Date of Patent: January 27, 2015Assignee: Lam Research CorporationInventors: Ramesh Chandrasekharan, Adrien Lavoie, Damien Slevin, Karl Leeser
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Publication number: 20150017812Abstract: Disclosed herein are methods of depositing layers of material on multiple semiconductor substrates at multiple processing stations within one or more reaction chambers. The methods may include dosing a first substrate with film precursor at a first processing station and dosing a second substrate with film precursor at a second processing station with precursor flowing from a common source, wherein the timing of said dosing is staggered such that the first substrate is dosed during a first dosing phase during which the second substrate is not substantially dosed, and the second substrate is dosed during a second dosing phase during which the first substrate is not substantially dosed. Also disclosed herein are apparatuses having a plurality of processing stations contained within one or more reaction chambers and a controller with machine-readable instructions for staggering the dosing of first and second substrates at first and second processing stations.Type: ApplicationFiled: December 18, 2013Publication date: January 15, 2015Inventors: Ramesh Chandrasekharan, Adrien Lavoie, Damien Slevin, Karl Leeser
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Patent number: D956705Type: GrantFiled: May 5, 2020Date of Patent: July 5, 2022Assignee: Lam Research CorporationInventors: Bin Luo, Damien Slevin, Allan Matthew Jones