FIG. 1 depicts a perspective view of a first cooling plate for a semiconductor processing apparatus.
FIG. 2 depicts another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 3 depicts yet another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 4 depicts another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 5 depicts yet another perspective view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 6 depicts a top view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 7 depicts a bottom view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 8 depicts a front view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 9 depicts a back view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 10 depicts a right side view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 11 depicts a left side view of the first cooling plate for a semiconductor processing apparatus of FIG. 1.
FIG. 12 depicts a perspective view of a second cooling plate for a semiconductor processing apparatus.
FIG. 13 depicts another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 14 depicts yet another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 15 depicts another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 16 depicts yet another perspective view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 17 depicts a top view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 18 depicts a bottom view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 19 depicts a front view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 20 depicts a back view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 21 depicts a right side view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 22 depicts a left side view of the second cooling plate for a semiconductor processing apparatus of FIG. 12.
FIG. 23 depicts a perspective view of a third cooling plate for a semiconductor processing apparatus.
FIG. 24 depicts another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 25 depicts yet another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 26 depicts another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 27 depicts yet another perspective view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 28 depicts a top view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 29 depicts a bottom view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 30 depicts a front view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 31 depicts a back view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
FIG. 32 depicts a right side view of the third cooling plate for a semiconductor processing apparatus of FIG. 23; and,
FIG. 33 depicts a left side view of the third cooling plate for a semiconductor processing apparatus of FIG. 23.
Broken, dashed lines are used to represent portions of the article that do not form a part of the design. The broken, dash-dot-dash boundary line is used to represent a boundary between claimed and unclaimed subject matter.
