Patents by Inventor Dan Millward
Dan Millward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140247476Abstract: Some embodiments include system and methods to obtain information for adjusting variations in features formed on a substrate of a semiconductor device. Such methods can include determining a first pupil in an illumination system used to form a first feature, and determining a second pupil used to form a second feature. The methods can also include determining a pupil portion belonging to only one of the pupils, and generating a modified pupil portion from the pupil portion. Information associated with the modified pupil portion can be obtained for controlling a portion of a projection lens assembly of an illumination system. Other embodiments are described.Type: ApplicationFiled: May 14, 2014Publication date: September 4, 2014Applicant: Micron Technology, Inc.Inventors: Yuan He, Jianming Zhou, Scott L. Light, Anton deVilliers, Kaveri Jain, Zishu Zhang, Dan Millward
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Patent number: 8815497Abstract: Some embodiments include methods of forming patterns. A semiconductor substrate is formed to comprise an electrically insulative material over a set of electrically conductive structures. An interconnect region is defined across the electrically conductive structures, and regions on opposing sides of the interconnect region are defined as secondary regions. A two-dimensional array of features is formed over the electrically insulative material. The two-dimensional array extends across the interconnect region and across the secondary regions. A pattern of the two-dimensional array is transferred through the electrically insulative material of the interconnect region to form contact openings that extend through the electrically insulative material and to the electrically conductive structures, and no portions of the two-dimensional array of the secondary regions is transferred into the electrically insulative material.Type: GrantFiled: July 15, 2013Date of Patent: August 26, 2014Assignee: Micron Technology, Inc.Inventors: Dan Millward, Kaveri Jain, Zishu Zhang, Lijing Gou, Anton J. deVillers, Jianming Zhou, Yuan He, Michael Hyatt, Scott L. Light
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Publication number: 20140205752Abstract: Some embodiments include methods of forming patterns. A block copolymer film may be formed over a substrate, with the block copolymer having an intrinsic glass transition temperature (Tg,0) and a degradation temperature (Td). A temperature window may be defined to correspond to temperatures (T) within the range of Tg,0?T?Td. While the block copolymer is in the upper half of the temperature window, solvent may be dispersed into the block copolymer to a process volume fraction that induces self-assembly of the block copolymer into a pattern. A defect specification may be defined, and the process volume fraction of solvent may be at level that achieves self-assembly within the defect specification. In some embodiments, the solvent may be removed from within the block copolymer while maintaining the defect specification.Type: ApplicationFiled: March 20, 2014Publication date: July 24, 2014Applicant: Micron Technology, Inc.Inventors: Dan Millward, Scott E. Sills
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Patent number: 8736814Abstract: Some embodiments include system and methods to obtain information for adjusting variations in features formed on a substrate of a semiconductor device. Such methods can include determining a first pupil in an illumination system used to form a first feature, and determining a second pupil used to form a second feature. The methods can also include determining a pupil portion belonging to only one of the pupils, and generating a modified pupil portion from the pupil portion. Information associated with the modified pupil portion can be obtained for controlling a portion of a projection lens assembly of an illumination system. Other embodiments are described.Type: GrantFiled: June 13, 2011Date of Patent: May 27, 2014Assignee: Micron Technology, Inc.Inventors: Yuan He, Jianming Zhou, Scott L. Light, Anton deVilliers, Kaveri Jain, Zishu Zhang, Dan Millward
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Patent number: 8728721Abstract: A method of processing a substrate includes forming first photoresist on a substrate. A portion of the first photoresist is selectively exposed to actinic energy and then the first photoresist is negative tone developed to remove an unexposed portion of the first photoresist. Second photoresist is formed on the substrate over the developed first photoresist. A portion of the second photoresist is selectively exposed to actinic energy and then the second photoresist is negative tone developed to remove an unexposed portion of the second photoresist and form a pattern on the substrate which comprises the developed first photoresist and the developed second photoresist. Other implementations are disclosed.Type: GrantFiled: August 8, 2011Date of Patent: May 20, 2014Assignee: Micron Technology, Inc.Inventors: Scott L. Light, Kaveri Jain, Zishu Zhang, Anton J deVilliers, Dan Millward, Jianming Zhou, Michael D. Hyatt
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Patent number: 8696918Abstract: Some embodiments include methods of forming patterns. A block copolymer film may be formed over a substrate, with the block copolymer having an intrinsic glass transition temperature (Tg,O) and a degradation temperature (Td). A temperature window may be defined to correspond to temperatures (T) within the range of Tg,O?T?Td. While the block copolymer is in the upper half of the temperature window, solvent may be dispersed into the block copolymer to a process volume fraction that induces self-assembly of the block copolymer into a pattern. A defect specification may be defined, and the process volume fraction of solvent may be at level that achieves self-assembly within the defect specification. In some embodiments, the solvent may be removed from within the block copolymer while maintaining the defect specification.Type: GrantFiled: May 5, 2010Date of Patent: April 15, 2014Assignee: Micron Technology, Inc.Inventors: Dan Millward, Scott Sills
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Patent number: 8625078Abstract: A method for reducing the effects of lens heating of a lens in an imaging process includes determining heat load locations on the lens according to an illumination source and a reticle design, obtaining a lens response characterization according to the heat load locations, and utilizing the heat load locations and the lens response characterization to generate a lens heating sensitivity map.Type: GrantFiled: April 6, 2011Date of Patent: January 7, 2014Assignee: Nanya Technology Corp.Inventors: Jianming Zhou, Scott Light, Dan Millward, Yuan He, Kaveri Jain, Lijing Gou, Zishu Zhang, Anton DeVilliers, Michael Hyatt
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Publication number: 20130323628Abstract: A reticle with a composite polarizer includes: a transparent substrate; a patterned layer disposed on said transparent substrate; and a polarizing filter disposed on said transparent substrate, wherein said transparent substrate is substantially transparent with respect to illumination light, said patterned layer is partially opaque with respect to said illumination light, and said polarizing filter is capable of selectively polarizing said illumination light.Type: ApplicationFiled: June 5, 2012Publication date: December 5, 2013Inventors: SCOTT LIGHT, DAN MILLWARD, ANTON DEVILLIERS, YUAN HE, MICHAEL HYATT, LIJING GOU, KAVERI JAIN, ZISHU ZHANG, JIANMING ZHOU
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Publication number: 20130302981Abstract: Some embodiments include methods of forming patterns. A semiconductor substrate is formed to comprise an electrically insulative material over a set of electrically conductive structures. An interconnect region is defined across the electrically conductive structures, and regions on opposing sides of the interconnect region are defined as secondary regions. A two-dimensional array of features is formed over the electrically insulative material. The two-dimensional array extends across the interconnect region and across the secondary regions. A pattern of the two-dimensional array is transferred through the electrically insulative material of the interconnect region to form contact openings that extend through the electrically insulative material and to the electrically conductive structures, and no portions of the two-dimensional array of the secondary regions is transferred into the electrically insulative material.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Inventors: Dan Millward, Kaveri Jain, Zishu Zhang, Lijing Gou, Anton J. deVilliers, Jianming Zhou, Yuan He, Michael D. Hyatt, Scott L. Light
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Publication number: 20130270226Abstract: Block copolymers can be self-assembled and used in methods as described herein for sub-lithographic patterning, for example. The block copolymers can be diblock copolymers, triblock copolymers, multiblock copolymers, or combinations thereof. Such methods can be useful for making devices that include, for example, sub-lithographic conductive lines.Type: ApplicationFiled: June 7, 2013Publication date: October 17, 2013Inventor: Dan Millward
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Publication number: 20130183827Abstract: A method of patterning a substrate includes forming spaced first features over a substrate. Individual of the spaced first features include sidewall portions of different composition than material that is laterally between the sidewall portions. A mixture of immiscible materials is provided between the spaced first features. At least two of the immiscible materials are laterally separated along at least one elevation between adjacent spaced first features. The laterally separating forms a laterally intermediate region including one of the immiscible materials between two laterally outer regions including another of the immiscible materials along the one elevation. The laterally outer regions are removed and material of the spaced first features is removed between the sidewall portions to form spaced second features over the substrate. Other embodiments are disclosed.Type: ApplicationFiled: January 13, 2012Publication date: July 18, 2013Applicant: MICRON TECHNOLOGY, INC.Inventor: Dan Millward
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Patent number: 8486611Abstract: Some embodiments include methods of forming patterns. A semiconductor substrate is formed to comprise an electrically insulative material over a set of electrically conductive structures. An interconnect region is defined across the electrically conductive structures, and regions on opposing sides of the interconnect region are defined as secondary regions. A two-dimensional array of features is formed over the electrically insulative material. The two-dimensional array extends across the interconnect region and across the secondary regions. A pattern of the two-dimensional array is transferred through the electrically insulative material of the interconnect region to form contact openings that extend through the electrically insulative material and to the electrically conductive structures, and no portions of the two-dimensional array of the secondary regions is transferred into the electrically insulative material.Type: GrantFiled: July 14, 2010Date of Patent: July 16, 2013Assignee: Micron Technology, Inc.Inventors: Dan Millward, Kaveri Jain, Zishu Zhang, Lijing Gou, Anton de Villiers, Jianming Zhou, Yuan He, Michael Hyatt, Scott L. Light
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Patent number: 8394579Abstract: Some embodiments include methods of forming patterns in which a block copolymer-containing composition is formed over a substrate, and is then patterned to form a first mask. The block copolymer of the composition is subsequently induced into forming a repeating pattern within the first mask. Portions of the repeating pattern are then removed to form a second mask from the first mask. The patterning of the block copolymer-containing composition may utilize photolithography. Alternatively, the substrate may have regions which wet differently relative to one another with respect to the block copolymer-containing composition, and the patterning of the first mask may utilize such differences in wetting in forming the first mask.Type: GrantFiled: December 1, 2011Date of Patent: March 12, 2013Assignee: Micron Technology, Inc.Inventors: Scott Sills, Dan Millward
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Publication number: 20130040245Abstract: A method of processing a substrate includes forming first photoresist on a substrate. A portion of the first photoresist is selectively exposed to actinic energy and then the first photoresist is negative tone developed to remove an unexposed portion of the first photoresist. Second photoresist is formed on the substrate over the developed first photoresist. A portion of the second photoresist is selectively exposed to actinic energy and then the second photoresist is negative tone developed to remove an unexposed portion of the second photoresist and form a pattern on the substrate which comprises the developed first photoresist and the developed second photoresist. Other implementations are disclosed.Type: ApplicationFiled: August 8, 2011Publication date: February 14, 2013Inventors: Scott L. Light, Kaveri Jain, Zishu Zhang, Anton J. de Villiers, Dan Millward, Jianming Zhou, Michael D. Hyatt
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Patent number: 8357784Abstract: The present invention provides metal-containing compounds that include at least one ?-diketiminate ligand, and methods of making and using the same. In certain embodiments, the metal-containing compounds include at least one ?-diketiminate ligand with at least one fluorine-containing organic group as a substituent. In other certain embodiments, the metal-containing compounds include at least one ?-diketiminate ligand with at least one aliphatic group as a substituent selected to have greater degrees of freedom than the corresponding substituent in the ?-diketiminate ligands of certain metal-containing compounds known in the art. The compounds can be used to deposit metal-containing layers using vapor deposition methods. Vapor deposition systems including the compounds are also provided. Sources for ?-diketiminate ligands are also provided.Type: GrantFiled: August 15, 2011Date of Patent: January 22, 2013Assignee: Micron Technology, Inc.Inventors: Dan Millward, Timothy A. Quick
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Publication number: 20130005903Abstract: In one embodiment, a block copolymer-containing composition includes PS-b-PXVP and a lithium salt, where “X” is 2 or 4. All lithium salt is present in the composition at no greater than 1 ppm by weight. In one embodiment, a homogenous block copolymer-including comprising has PS-b-PXVP present in the composition at no less than 99.99998% by weight, where “X” is 2 or 4. Methods of forming such compositions are disclosed.Type: ApplicationFiled: September 11, 2012Publication date: January 3, 2013Applicant: MICRON TECHNOLOGY, INC.Inventors: Dan Millward, Scott Sills
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Publication number: 20120314196Abstract: Some embodiments include system and methods to obtain information for adjusting variations in features formed on a substrate of a semiconductor device. Such methods can include determining a first pupil in an illumination system used to form a first feature, and determining a second pupil used to form a second feature. The methods can also include determining a pupil portion belonging to only one of the pupils, and generating a modified pupil portion from the pupil portion. Information associated with the modified pupil portion can be obtained for controlling a portion of a projection lens assembly of an illumination system. Other embodiments are described.Type: ApplicationFiled: June 13, 2011Publication date: December 13, 2012Applicant: MICRON TECHNOLOGY, INCInventors: Yuan He, Jianming Zhou, Scott L. Light, Anton de Villiers, Kaveri Jain, Zishu Zhang, Dan Millward
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Patent number: 8314206Abstract: In one embodiment, a block copolymer-containing composition includes PS-b-PXVP and a lithium salt, where “X” is 2 or 4. All lithium salt is present in the composition at no greater than 1 ppm by weight. In one embodiment, a homogenous block copolymer-including comprising has PS-b-PXVP present in the composition at no less than 99.99998% by weight, where “X” is 2 or 4. Methods of forming such compositions are disclosed.Type: GrantFiled: December 2, 2008Date of Patent: November 20, 2012Assignee: Micron Technology, Inc.Inventors: Dan Millward, Scott Sills
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Publication number: 20120266913Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.Type: ApplicationFiled: June 27, 2012Publication date: October 25, 2012Applicant: MICRON TECHNOLOGY, INC.Inventors: Neil Joseph Greeley, Dan Millward, Wayne Huang
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Publication number: 20120257177Abstract: A method for reducing the effects of lens heating of a lens in an imaging process includes determining heat load locations on the lens according to an illumination source and a reticle design, obtaining a lens response characterization according to the heat load locations, and utilizing the heat load locations and the lens response characterization to generate a lens heating sensitivity map.Type: ApplicationFiled: April 6, 2011Publication date: October 11, 2012Inventors: JIANMING ZHOU, SCOTT LIGHT, DAN MILLWARD, YUAN HE, KAVERI JAIN, LIJING GOU, ZISHU ZHANG, ANTON DEVILLIERS, MICHAEL HYATT