Abstract: A liquid purification system is provided. Although not limited to water, the purification system is especially suitable for water. The purification system utilizes a vessel having antimicrobial inner wall load bearing surfaces and/or antimicrobial (antibacterial, anti-fungal, anti-mold, etc.) interior non-load bearing surfaces. When the liquid moves within the vessel and contacts the antimicrobial surfaces, the liquid becomes purified or sanitized. The inner wall load bearing surfaces and non-load bearing interior surfaces of the vessel may be manufactured from a host polymer that has antimicrobial organo-metallic additives which form a solid-solution with the host polymer and are distributed homogeneously throughout the host polymer. The host polymer matrix may be an organic material, an inorganic material or an organic-inorganic material blend. The antimicrobial agent polymer matrix may be located in localized zones within the vessel.

Abstract: A liquid purification system is provided. Although not limited to water, the purification system is especially suitable for water. The purification system utilizes a vessel having antimicrobial inner wall load bearing surfaces and/or antimicrobial (antibacterial, anti-fungal, anti-mold, etc.) interior non-load bearing surfaces. When the liquid moves within the vessel and contacts the antimicrobial surfaces, the liquid becomes purified or sanitized. The inner wall load bearing surfaces and non-load bearing interior surfaces of the vessel may be manufactured from a host polymer that has antimicrobial organo-metallic additives which form a solid-solution with the host polymer and are distributed homogeneously throughout the host polymer. The host polymer matrix may be an organic material, an inorganic material or an organic-inorganic material blend. The antimicrobial agent polymer matrix may be located in localized zones within the vessel.

Abstract: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Abstract: A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards.

Abstract: A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value.

Abstract: An electroluminescent display device contains an electroluminescent phosphor sandwiched between a pair of electrodes and a graphic arts element. The device is fabricated by bonding a generic electroluminescent base laminate containing an electrode and an electroluminescent layer, to a custom graphic arts film containing a graphic element and a corresponding electrode. The generic electroluminescent base laminate is made at a first location or time, and the custom graphic arts film is made at a second location or time.

Abstract: A protective photochromic barrier film for a light-sensitive printed electronic substrate. Light-sensitive semiconductor devices on a dielectric substrate are electrically connected by conductors. A barrier layer containing photochromic dyes covers some or all of the light-sensitive semiconductor devices. Upon exposure to visible, infrared, or ultraviolet light, the photochromic dyes change chemical structure and decrease the amount of visible or non-visible light that can impinge upon the light-sensitive electronic devices. Upon removal of the visible or non-visible light, the photochromic dyes either revert to their original structure or maintain their altered state.

Abstract: A semiconductor device made on a polymer substrate using graphic arts printing technology uses a printable organic semiconductor. An electrode is situated on the substrate, and a dielectric layer is situated over the electrode. Another electrode(s) is situated on the dielectric layer. The exposed surfaces of the dielectric and the top electrode are treated with a reactive silane to alter the surface of the electrode and the dielectric sufficiently to allow an overlying organic semiconductor layer to have good adhesion to both the electrode and the dielectric. In various embodiments, the electrodes may be printed, and the dielectric layer may also be printed.

Abstract: An electroluminescent display contains an array of dynamically addressable pixels. The pixels are arranged on one side of a carrier substrate. Conductive vias in the substrate are electrically connected to each of the pixels. Each pixel consists of a bottom electrode that is coupled to a via, an electroluminescent material, and a dielectric material. A common top electrode is disposed on the dielectric material. A driver circuit conductor or connector is situated on the other side of the substrate and is electrically coupled to each of the conductive vias and to the common top electrode, so that each pixel can be individually addressed to illuminate the electroluminescent material on individual pixels.

Abstract: A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value.

Abstract: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Abstract: An inverter circuit (500) having a drive transistor (102) that operably couples to a voltage bias input (101) (and where that drive transistor controls the inverter circuit output by opening and closing a connection between the output (105) and ground (104)) is further operably coupled to a feedback switch (401). In a preferred approach the feedback switch is itself also operably coupled to the voltage bias input and the output and preferably serves, when the drive transistor is switched “off,” to responsively couple the voltage bias input to the drive transistor in such a way as to cause a gate terminal of the drive transistor to have its polarity relative to a source terminal of the drive transistor reversed and hence permit the inverter circuit to operate across a substantially full potential operating range of the drive transistor.

Abstract: An object (201) (such as a containment mechanism) supports both a functional electrical circuit (203) and an electrical circuit (202) to which the functional electrical circuit is responsive. In a preferred approach the functional electrical circuit has both a low power state of operation and a higher power state of operation. Upon detecting (104) that an area of connectivity of the electrical circuit has been severed (via, for example, corresponding manipulation of the object itself), the functional electrical circuit responsively operates (106) using the higher power state of operation.

Abstract: A printing platform receives (102) (preferably in-line with a semiconductor device printing process (101)) a substrate having at least one semiconductor device printed thereon and further having a test structure printed thereon, which test structure comprises at least one printed semiconductor layer. These teachings then provide for the automatic testing (103) of the test structure with respect to at least one static (i.e., relatively unchanging) electrical characteristic metric. The static electrical characteristic metric (or metrics) of choice will likely vary with the application setting but can include, for example, a measure of electrical resistance, a measure of electrical reactance, and/or a measure of electrical continuity. Optionally (though preferably) the semiconductor device printing process itself is then adjusted (105) as a function, at least in part, of this metric.

Abstract: A printed read only memory (ROM) device that consists of an array of memory resistors, a reference resistor, and analog-to-digital circuit is disclosed. Resistance values are dependent on the data to be stored in the read only memory. During read operation, a resistor in the array is powered, activating a voltage divider between the powered resistor and the reference resistor. The analog-to-digital circuit will read the divided voltage level between the two resistors, compare the voltage supply level and interpret it into bits of memory data. During the manufacturing of the ROM circuit, an array of memory resistors is printed as the means for storage of the data. Resistive inks of specific resistance values are selected and printed in a preferred layout that includes a reference resistor coupled to the determined array of memory resistors and an analog to digital converter so as to form a read only memory with the received data.

Abstract: A low-temperature process for creating a semiconductive device by printing a liquid composition containing semiconducting nanoparticles. The semiconductive device is formed on a polymeric substrate by printing a composition that contains nanoparticles of inorganic semiconductor suspended in a carrier, using a graphic arts printing method. The printed deposit is then heated to remove substantially all of the carrier from the printed deposit. The low-temperature process does not heat the substrate or the printed deposit above 300° C. The mobility of the resulting semiconductive device is between about 10 cm2/Vs and 200 cm2/Vs.

Abstract: An electronic apparatus, includes a plurality of electronic modules, each having a maximum thickness of no more than 90 microns, each comprising a substrate having a two sided edge connection pattern. The electronic modules are arranged adjacent to each other. Each pad of a first set of connection pads on a first electronic module is conductively connected to an opposing pad of a second set of connection pads of a second electronic module. The first set of connection pads is separated from the second set of connection pads by electrically conductive material that is less than 15 microns thick.

Abstract: An apparatus having an electronic drawing surface includes a common electrode overlying a least part of the outer surface of a housing, or other object, and a bistable media layer overlying the common electrode. The bistable media layer has at least two stable states and is operable to assume a first stable state in the region of a drawing tool when an electrical voltage difference is generated between the drawing tool and the common electrode. The voltage difference produces an electrical field across a region of the bistable media layer when the drawing tool is in close proximity to the bistable layer. Optionally, an outer surface of a plurality of transparent electrodes overlies the bistable media layer.

Abstract: A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards.

Abstract: An integrated electrically-responsive lenticular display apparatus (300) includes a lenticular lens (301) integrally combined with at least one electrically-responsive light-emissive pattern (202). The electrically-responsive light-emissive pattern (202) is a printed electrically-responsive light-emissive pattern. The printed pattern may be printed directly onto the lenticular lens (301) or onto a substrate (502), which then attaches to the lenticular lens (301). The electrically-responsive light-emissive pattern (202) can be interleaved with another pattern (203). The other pattern (203) may include another electrically-responsive light-emissive pattern or a non-electrically-responsive light-emissive pattern.