Abstract: The invention is directed to methods of treating fungal and yeast infections using lupeol or solvates, hydrates, or clathrates thereof. The method also encompasses methods of treating fungal and yeast infections by administering to a mammal in need of such treatment a therapeutically effective amount of lupeol. Among the methods used include topical formulations for the improvement of skin appearance.

Abstract: A decoupling device (10) includes a plurality of capacitors having different capacitances (14,16,18) physically mounted in a package (12, 212), and terminals including at least one first terminal (24, 224) and at least one second terminal (26, 226) adapted for mounting the package to a circuit panel. The plural capacitors are connected in parallel between the first and second terminals so as to form plural circuits with different self-resonant frequencies. The device can be mounted as a unit on a circuit board with the first terminals connected to a power conductor and the second terminals connected to a ground conductor, and provides low impedance shunting of noise over a wide frequency spectrum.

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

Abstract: An integrated circuit memory device includes a memory, a read control circuit operatively associated with the memory and configured to produce data from the memory responsive to an externally-applied input clock signal, and an output latch configured to transfer data at an input thereof to an output pad of the memory device responsive to an externally-applied output clock signal. The device further includes a clock domain alignment circuit configured to receive the data produced by the memory and to responsively provide the data at the input of the output latch based on relative timing of the input clock signal and the output clock signal.

Abstract: A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.

Abstract: A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or both relative to other stacks so that corresponding edges of the stacks face one another to facilitate communication between the stacks. Communication between the stacks may be carried along traces on one or more interposers intercepting the stacks remote from the circuit board. Within each stack, conducting paths may extend in vertical columns or in other arrangements such as a stair step arrangement wherein each conductive path traverses a series of column positions, or in a crossing arrangement such two conductive paths cross back and forth between column positions along the vertical extend of the stack. A stack may include portions disposed above and below the circuit board.

Abstract: A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic element. One or more passive elements, e.g., a resistor, inductor, capacitor, or combination of the same are mounted to the microelectronic element, with an inner terminal of the passive element conductively mounted to an exposed surface of one contact and an outer terminal displaced vertically from the major surface of the microelectronic element.

Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses.

Abstract: A synthetic crossband is disclosed. The synthetic crossband comprises impregnated paper, which is impregnated with a saturating resin which includes phenolic resin, such as phenolic-formaldehyde resin, that is then cured. At least a portion of one side of the impregnated paper includes a layer of partially cured adhesive resin, which includes melamine-formaldehyde resin, urea-formaldehyde resin, or a mixture thereof.

Abstract: A method and apparatus for mixing audio signals. Each audio signal is digitized and then transformed into a predefined visual image, which is displayed in a three-dimensional space. Audio effects added to the audio signals are transformed into predefined visual effects images, which are also displayed in a three-dimensional space. Selected audio characteristics of the audio signal, such as frequency, amplitude, time and spatial placement, are correlated to selected visual characteristics of the visual image, such as size, location, texture, density and color. Dynamic changes or adjustment to any one of these parameters, or parameters of the audio effect images, causes a corresponding change in the correlated parameter or audio effect.

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses.

Abstract: A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure.

Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

Abstract: A solvent modified resin underfill material comprising a resin in combination with a filler of functionalized colloidal silica and solvent to form a transparent B-stage resin composition, which may then be cured to form a low CTE, high Tg thermoset resin. Embodiments of the disclosure include use as a wafer level filler, and an encapsulant for electronic chips.

Abstract: A method and apparatus for analyzing fluids by means of x-ray fluorescence. The method and apparatus are applicable to any fluid, including liquids and gases, having at least one component that emits x-ray fluorescence when exposed to x-rays. The apparatus includes an x-ray source (82) including an x-ray tube (64) having improved heat dissipating properties due to the thermal coupling of the x-ray tube with a thermally-conductive, dielectric material (70, 1150). The x-ray tube also includes means for aligning (100, 2150, 2715) the x-ray tube with the x-ray source housing whereby the orientation of the x-ray beam produced by the x-ray source can be optimized, and stabilized various over operating conditions. The method and apparatus may also include an x-ray detector having a small-area, for example, a PIN-diode type semiconductor x-ray detector (120), that can provide effective x-ray detection at room temperature.

Abstract: A fitting for the connection of a tubing end. The fitting includes a body having a bore with an internally-threaded opening which extends to a seating surface, and a front ferrule which is receivable coaxially over the tubing end. An externally-threaded nut is receivable coaxially over the outer diameter of the tubing end to be positionable thereon rearwardly of the front ferrule such that, with the tubing end and front ferrule being inserted through the bore opening, the nut is threadably engageable with the body urging an outer surface of the ferrule into a canning engagement against the body seating surface. The axial length of the seating surface is provided to extend substantially the entire length of the ferrule outer surface so as to constrain the radial outward expansion of the ferrule rearward end.

Abstract: An integrated circuit chip includes a plurality of independent FIFO memory devices that are each configured to support all four combinations of DDR and SDR write modes and DDR and SDR read modes and collectively configured to support all four multiplexer, demultiplexer, broadcast and multi-Q operating modes.

Abstract: An x-ray diffraction measurement apparatus for measuring a sample, having an x-ray source and detector coupled together in a combination for coordinated rotation around the sample, such that x-ray diffraction data can be taken at multiple phi angles. The apparatus may provide a pole figure representation of crystal orientation of the sample, wherein the pole figure represents the crystal alignment, and a full width half maximum value is calculated from the pole figure for crystal alignment quantification. Data may be taken at discrete positions along a length of the sample, and the sample is in a fixed position during measuring; or data may be taken continuously along a length of the article, as the sample continuously moves along its length in a movement path between the source and detector. The sample may be in the form of a tape, linearly passing through a measurement zone.

Abstract: A method for forming a superconductive article is disclosed. According to one method, a substrate is provided, the substrate having an aspect ratio of not less than about 1×103, forming a buffer layer overlying the substrate, forming a superconductor layer overlying the buffer layer, and characterizing at least one of the substrate, the buffer layer and the superconductor layer by x-ray diffraction. In this regard, x-ray diffraction is carried out such that data are taken at multiple phi angles. Data acquisition at multiple phi angles permits robust characterization of the film or layer subject to characterization, and such data may be utilized for process control and/or quality control. Additional methods for forming superconductive articles, and for characterizing same with XRD are also disclosed.