Abstract: The present invention provides for pharmaceutical compositions that includes a triterpene (e.g., betulin) and an essential oil (Vicks® Vapor Rub). The present invention also provides for a cosmetic formulation that includes a triterpene (e.g., betulin) and an essential oil (Vicks® Vapor Rub). The present invention also provides a method of treating a fungal infection that includes administering (e.g., topically applying) an effective amount of the pharmaceutical composition to the tissue afflicted with the fungal infection, or the tissue at risk of being afflicted with the fungal infection.

Abstract: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

Abstract: A method and apparatus for mixing audio signals. Each audio signal is digitized and then transformed into a predefined visual image, which is displayed in a three-dimensional space. Audio effects added to the audio signals are transformed into predefined visual effects images, which are also displayed in a three-dimensional space. Selected audio characteristics of the audio signal, such as frequency, amplitude, time and spatial placement, are correlated to selected visual characteristics of the visual image, such as size, location, texture, density and color. Dynamic changes or adjustment to any one of these parameters, or parameters of the audio effect images, causes a corresponding change in the correlated parameter or audio effect.

Abstract: A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure.

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses.

Abstract: The invention provides an NDO or NDO related complex comprising at least one alpha-subunit polypeptide that comprises: 1) a substituted amino acid at the position corresponding to position 352 in NDO, 2) a substituted amino acid at the position corresponding to position 201, 202, 260, 316, 351, 358, 362, or 366 in NDO, or 3) a substituted amino acid at the position corresponding to position 352 in NDO, and a substituted amino acid at the position corresponding to position 201, 202, 260, 316, 351, 358, 362, or 366 in NDO; or a catalytically active fragment thereof. The invention also provides DNA encoding such polypeptides, host cells augmented by such DNA, and methods for using the enzymes or host cells to provide useful and novel synthons. The invention also provides novel compounds prepared with the complexes or methods of the invention.

Abstract: The present invention relates to systems and methods for obtaining optimized EPO dosage regimens for a desired pharmacodynamic/pharmacokinetic response. The system includes choosing one or more EPO dosage regimens, then using a PK/PD model to determine the pharmacodynamic/pharmacokinetic profile of one or more EPO dosage regimens, and finally selecting one of the EPO dosage regimens for administration to achieve the desired pharmacodynamic/pharmacodynamic response based on the EPO profile.

Abstract: The present invention relates to systems and methods for obtaining optimized EPO dosage regimens for a desired pharmacodynamic/pharmacokinetic response. The system includes choosing one or more EPO dosage regimens, then using a PK/PD model to determine the pharmacodynamic/pharmacokinetic profile of one or more EPO dosage regimens, and finally selecting one of the EPO dosage regimens for administration to achieve the desired pharmacodynamic/pharmacodynamic response based on the EPO profile.

Abstract: A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.

Abstract: The present invention relates to systems and methods for obtaining optimized EPO dosage regimens for a desired pharmacodynamic/pharmacokinetic response. The system includes choosing one or more EPO dosage regimens, then using a PK/PD model to determine the pharmacodynamic/pharmacokinetic profile of one or more EPO dosage regimens, and finally selecting one of the EPO dosage regimens for administration to achieve the desired pharmacodynamic/pharmacodynamic response based on the EPO profile.

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

Abstract: A processing system comprising processors and the dynamically configurable communication elements coupled together in an interspersed arrangement. The processors each comprise at least one arithmetic logic unit, an instruction processing unit, and a plurality of processor ports. The dynamically configurable communication elements each comprise a plurality of communication ports, a first memory, and a routing engine. For each of the processors, the plurality of processor ports is configured for coupling to a first subset of the plurality of dynamically configurable communication elements. For each of the dynamically configurable communication elements, the plurality of communication ports comprises a first subset of communication ports configured for coupling to a subset of the plurality of processors and a second subset of communication ports configured for coupling to a second subset of the plurality of dynamically configurable communication elements.

Abstract: The Rotational Canted-Joint Missile (RCJM) Control System utilizes a single or multiple body joints that rotate in planes that are not perpendicular to the missile body axis. The result is the deflection of a portion of the missile body for flight control purposes. The canted interface plane between any two adjacent movable sections of the missile body and a joint at the interface plane that allows one of the sections to be rotated by a pre-determined angle with respect to the other section comprise a rotational plane mechanism that offers an inclined bearing plane with a large mechanical advantage over typical “brute force” ball joint methods.

Abstract: The present invention relates to systems and methods for obtaining optimized EPO dosage regimens for a desired pharmacodynamic/pharmacokinetic response. The system includes choosing one or more EPO dosage regimens, then using a PK/PD model to determine the pharmacodynamic/pharmacokinetic profile of one or more EPO dosage regimens, and finally selecting one of the EPO dosage regimens for administration to achieve the desired pharmacodynamic/pharmacodynamic response based on the EPO profile.

Abstract: A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.

Abstract: The Rotational Canted-Joint Missile (RCJM) Control System utilizes a single or multiple body joints that rotate in planes that are not perpendicular to the missile body axis. The result is the deflection of a portion of the missile body for flight control purposes. The canted interface plane between any two adjacent movable sections of the missile body and a joint at the interface plane that allows one of the sections to be rotated by a pre-determined angle with respect to the other section comprise a rotational plane mechanism that offers an inclined bearing plane with a large mechanical advantage over typical “brute force” ball joint methods.

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses.

Abstract: A fitting for the connection of a tubing end. The fitting includes a body having a bore with an internally-threaded opening which extends to a seating surface, and a front ferrule which is receivable coaxially over the tubing end. An externally-threaded nut is receivable coaxially over the outer diameter of the tubing end to be positionable thereon rearwardly of the front ferrule such that, with the tubing end and front ferrule being inserted through the bore opening, the nut is threadably engageable with the body urging an outer surface of the ferrule into a canning engagement against the body seating surface. The axial length of the seating surface is provided to extend substantially the entire length of the ferrule outer surface so as to constrain the radial outward expansion of the ferrule rearward end.

Abstract: Inkjet printhead chips comprise a substrate, a plurality of transducers, a plurality of interconnects and driver circuitry capable of electrically connecting the transducers and the interconnects. The substrate has a surface with opposing first and second edges, with a plurality of transducers arranged along the first edge and a plurality of interconnects arranged along the second edge. The driver circuitry is arranged on the substrate. The printhead chips can also be included in inkjet printhead chip assemblies wherein the printhead chip is arranged on a print surface of a body, and wherein the print surface is capable of being arranged generally parallel to a surface of a print-receiving medium. In this embodiment, an edgefeed is disposed between the first edge and the printhead body, and is in fluid communication with an ink reservoir.

Abstract: A method and apparatus for mixing audio signals. Each audio signal is digitized and then transformed into a predefined visual image, which is displayed in a three-dimensional space. Audio effects added to the audio signals are transformed into predefined visual effects images, which are also displayed in a three-dimensional space. Selected audio characteristics of the audio signal, such as frequency, amplitude, time and spatial placement, are correlated to selected visual characteristics of the visual image, such as size, location, texture, density and color. Dynamic changes or adjustment to any one of these parameters, or parameters of the audio effect images, causes a corresponding change in the correlated parameter or audio effect.