Abstract: Methods of acquiring and processing seismic data using derivative sensors, such as strain sensors, that facilitate ground roll noise attenuation with seismic interferometry are disclosed. The methods use both seismic data and their spatial derivatives in computing ground-roll noises which are removed from processed seismic data.

Abstract: A shipping package (1) comprises an enclosure for receiving content within, a closure (14) for sealing the enclosure, a label comprising shipping information, a network module (380), a sensor module (382), and a battery module (384). The battery module provides power to the network module and the sensor module. The sensor module (382) providing location information to the network module, the network module transmits a shipping status message to an external device.

Abstract: Acquiring seismic data using time-distributed sources and converting the acquired data into impulsive data using a multiple-frequency approach. The methods are performed in frequency-source location domain, frequency-wavenumber domain, or frequency-slowness domain. The methods are applicable to single source acquisition or simultaneous source acquisition.

Abstract: A technique for reconstructing a seismic wavefield includes receiving data over one or more channels of a plurality of channels from a plurality of stations. The data is recorded by a plurality of seismic receivers and represent measurements of properties of the seismic wavefield. Each station includes a region in space including one or more seismic receivers. Each channel either measures a property of the seismic wavefield or a property of the seismic wavefield after the seismic wavefield has undergone a known transformation. At least one channel is derived as a function of one or more other channels. The technique includes using a processor based machine to process the data to model the seismic wavefield as a sum of basis functions; apply to the basis functions at least one forward transformation that describes the measurements received over the channel(s); and determine optimum basis functions based at least in part on the measurements.

Abstract: A semiconductor package comprises a substrate, a die mounted on the substrate, and a mold formed over the die and on the substrate, the mold having a top surface and a plurality of tapered side surfaces, wherein the tapered side surfaces provide uniform thickness of an electromagnetic interference (EMI) shielding film.

Abstract: The present invention is an apparatus used for the removal of moisture from of a section of polymer filament just prior to its consumption by an external process. The apparatus removes moisture by heating the polymer filament in a controlled manner to a temperature which releases the moisture from the polymer filament, but below the temperature that significantly distorts the polymer filament so that the mechanical structure of the polymer filament (diameter and linearity) is substantially maintained. As the polymer filament is externally consumed, it moves through the apparatus. The apparatus removes moisture from polymer filament more rapidly than other methods.

Abstract: A package that includes an integrated device partially enclosed in a conductive material and embedded in a package substrate. The package includes a package substrate having a first cavity, the integrated device having a first active side and an inactive side embedded in the first cavity, and a structure partially enclosing the integrated device having a first layer and a second layer, wherein the first layer is coupled between the package substrate and the integrated device, and wherein the second layer is disposed over the inactive side of the integrated device.

Abstract: A technique includes towing at least one seismic source in connection with a survey of a structure; and operating the seismic source(s) to fire shots, where each shot is associated with a frequency sweep. The technique includes varying phases of the frequency sweeps from shot to shot according to a predetermined phase sequence to allow noise in an energy sensed by seismic sensors to be attenuated.

Abstract: A multi-cable subsea lifting system including two or more load-cable lifting apparatus (2a, 2b); a load cable (4a, 4b) extending from each load-cable lifting apparatus (2a, 2b) to a subsea attachment point; a torque measuring device (22) associated with each load cable (4a, 4b); one or more subsea anti-cabling devices (20), each anti-cabling device (20) including a motor (24) connected to a respective load cable (4a, 4b); and a controller (30) in communication with each motor (24) and torque measuring device (22); wherein the controller (30) is configured to actuate each motor (24) to impart a rotational force to its respective load cable (4a, 4b) in response to measurements obtained from the torque measuring device (22) with the aim to limit cabling, remove cabling or control heading either automatically or from external control.

Abstract: Seismic surveying techniques are described in which seismic receivers in a seismic array are used as seismic sources. These receiver-sources may be used to determine the near-surface structures of the Earth, geometric properties of the survey array, receiver locations and operations of the survey array. The receiver-sources may be driven by drive sequences to produce amplified receiver-source signals, plane waves, surface waves converging towards a point inside the seismic array, surface waves sweeping through the seismic array and/or the like. The receiver-sources may comprise geophones, hydrophones, accelerometers and/or the like. A driver may be used to drive the receiver-sources and the driver may be controlled by a processor. By encoding drive sequences, seismic data generated by the receiver-sources may be separated from seismic data generated by another seismic source in the seismic array.

Abstract: Marine seismic vibrators in a marine seismic vibrator array for use in a seismic survey are activated to produce a source gradient wavefield to survey a target structure. The seismic survey may comprise a marine seismic survey conducted in a body of water.

Abstract: A package that includes an integrated device partially enclosed in a conductive material and embedded in a package substrate. The package includes a package substrate having a first cavity, the integrated device having a first active side and an inactive side embedded in the first cavity, and a structure partially enclosing the integrated device having a first layer and a second layer, wherein the first layer is coupled between the package substrate and the integrated device, and wherein the second layer is disposed over the inactive side of the integrated device.

Abstract: A breathing assistance apparatus adapted to deliver humidified gases at a desired level of humidity to a patient including a humidifier and a heated conduit is disclosed. The humidifier includes a controller which determines the flow rate of the gases and then determines the required power input to the humidifier to deliver the gases to the patient at the required patient humidity. This means the need for external sensors is dispensed with and thus the apparatus is simple and less bulky.

Abstract: A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.

Abstract: A breathing assistance apparatus adapted to deliver humidified gases at a desired level of humidity to a patient including a humidifier and a heated conduit is disclosed. The humidifier includes a controller which controls the humidifier, or the humidifier and the heated conduit to deliver the gases to the patient at the required humidity or temperature, without the requirement for sensors in the gases stream. The controller uses information already available to the controller, without the requirement for additional information to be provided by sensors in the gases stream. This means the need for sensors in the gases stream is dispensed with. A significant benefit is achieved as sensors are not required in the conduit and thus the apparatus is simple and less bulky.

Abstract: Marine seismic vibrators in a marine seismic vibrator array for use in a seismic survey are activated to produce a source gradient wavefield to survey a target structure. The seismic survey may comprise a marine seismic survey conducted in a body of water.

Abstract: A computing device includes a processing circuit and a data storage medium. The processing circuit is programmed to receive first vehicle usage data associated with a first user and second vehicle usage data associated with a second user. The processing device can identify a first pattern associated with the first vehicle usage data, identify a second pattern associated with the second vehicle usage data, and determine whether the first pattern is complementary to the second pattern.

Abstract: Marine seismic surveys, including ocean bottom surveys, utilizing marine vibrator arrays that are capable of being driven in anti-phase to produce a directional source gradient. Marine seismic surveys may include activating the vibrator array to emit a plurality of radiation patterns with at least a first radiation pattern that has a first notch at a take-off angle that is not close to vertical. Some marine seismic surveys includes emitting directive wavefields from two or more simultaneous seismic source arrays, where the two or more seismic source arrays have a phase that changes from shot-to-shot to allow simultaneous source separation of the directive wavefields.

Abstract: An integrated package may be manufactured in a die face up orientation with a component proximate to the attached die by creating a cavity in the mold compound during fabrication. The cavity is created with an adhesive layer on the bottom to hold a component such that the top surface of the component is co-planar with the top surface of the attached die. This may allow backside grinding to take place that will not damage the component because the top surface alignment between the attached die and the component prevents the depth of the cavity from extending into the portion of the package that is ground away.