Abstract: An integrated circuit (IC) package that includes a first die, a wire bond coupled to the first die, a first encapsulation layer that at least partially encapsulates the first die and the wire bond, a second die, a redistribution portion coupled to the second die, and a second encapsulation layer that at least partially encapsulates the second die. In some implementations, the wire bond is coupled to the redistribution portion. In some implementations, the integrated circuit (IC) package further includes a package interconnect that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package further includes a via that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package has a height of about 500 microns (?m) or less.

Abstract: A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.

Abstract: An integrated package may be manufactured in a die face up orientation with a component proximate to the attached die by creating a cavity in the mold compound during fabrication. The cavity is created with an adhesive layer on the bottom to hold a component such that the top surface of the component is co-planar with the top surface of the attached die. This may allow backside grinding to take place that will not damage the component because the top surface alignment between the attached die and the component prevents the depth of the cavity from extending into the portion of the package that is ground away.

Abstract: To achieve a package-on-package having an advantageously reduced height, a first package substrate has a window sized to receive a second package die. The first package substrate interconnects to the second package substrate through a plurality of package-to-package interconnects such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.

Abstract: Some features pertain to a package on package (PoP) device that includes a first package, a first solder interconnect coupled to the first integrated circuit package, and a second package coupled to the first package through the first solder interconnect. The second package includes a first die, a package interconnect comprising a first pad, where the first solder interconnect is coupled to the first pad of the package interconnect. The second package also includes a redistribution portion coupled to the first die and the package interconnect, an encapsulation layer at least partially encapsulating the first die and the package interconnect. The first pad may include a surface that has low roughness. The encapsulation layer may encapsulate the package interconnect such that the encapsulation layer encapsulates at least a portion of the first solder interconnect.

Abstract: A dynamically controlled drill string includes a communications sub, a circulation sub and a measurement sub. The communications sub is operable to receive a wireless signals and retransmit the signals wirelessly. The measurement sub is operable to detect a downhole condition and transmit wirelessly a corresponding data signal. The circulation sub is operable to selectively permit fluid communication between the interior fluid conduit and the exterior of the dynamically controlled drill string at the circulation sub. The circulation sub is operable to selectively permit fluid communication through the internal fluid conduit at the circulation sub. A method for using the dynamically controlled drill string in a well bore includes the steps of introducing the dynamically controlled drill string into the well bore and introducing fluid operable to modify a detected downhole conditions into the well bore.

Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.

Abstract: Methods are disclosed to treat or prevent at least one disease or condition in a subject in need thereof comprising administering a compound of Formula (I): or a pharmaceutically acceptable salt, or ester thereof, wherein R1 and R2 are independently chosen from a hydrogen atom or linear, branched, and/or cyclic C1-C6 alkyl groups, with the proviso that R1 and R2 are not both hydrogen or a pharmaceutically acceptable salt or ester thereof. Such diseases or conditions may relate to coronary heart disease (CHD), for example atherosclerosis; metabolic syndrome/insulin resistance; and/or a dyslipidemic condition such as hypertriglyceridemia (HTG), elevated LDL-cholesterol, elevated total-cholesterol, elevated Apo B and low HDL-cholesterol. The present disclosure further provides for a method of reducing atherosclerosis development. Pharmaceutical compositions comprising a compound of Formula (I) are also disclosed.

Abstract: Some features pertain to an integrated device that includes a first substrate, a first solder resist layer coupled to the first substrate, a second solder resist layer coupled to the first solder resist layer, and an opening in the first and second solder resist layers, the opening comprising a sidewall completely covered with the second solder resist layer, where a sidewall of the second solder resist layer covers a sidewall of the first solder resist layer. In some implementations, the opening is at least partially filled with an electrically conductive material. The electrically conductive material includes one of solder and/or an interconnect. The integrated device includes a first interconnect coupled to the electrically conductive material. The first interconnect is one of at least a solder, and/or an interconnect ball. In some implementations, the integrated device includes a pad coupled to the substrate, and a first interconnect coupled to the pad.

Abstract: Some features pertain to an integrated circuit device that includes a first package substrate, a first die coupled to the first package substrate, a second package substrate, and a solder joint structure coupled to the first package substrate and the second package substrate. The solder joint structure includes a solder comprising a first melting point temperature, and a conductive material comprising a second melting point temperature that is less than the first melting point temperature. In some implementations, the conductive material is one of at least a homogeneous material and/or a heterogeneous material. In some implementations, the conductive material includes a first electrically conductive material and a second material. The conductive material is an electrically conductive material.

Abstract: A breathing assistance apparatus adapted to deliver humidified gases at a desired level of humidity to a patient including a humidifier and a heated conduit is disclosed. The humidifier includes a controller which controls the humidifier, or the humidifier and the heated conduit to deliver the gases to the patient at the required humidity or temperature, without the requirement for sensors in the gases stream. The controller uses information already available to the controller, without the requirement for additional information to be provided by sensors in the gases stream. This means the need for sensors in the gases stream is dispensed with. A significant benefit is achieved as sensors are not required in the conduit and thus the apparatus is simple and less bulky.

Abstract: In some embodiments, a method comprises displaying a pre-registration invitation on a first digital device connected to a wireless network, determining one or more wireless network identifiers associated with the wireless network, generating a pre-registration code request, the request including the one or more wireless network identifiers, providing the pre-registration code request to a virtual network server, the server generating a pre-registration code in response to the pre-registration code request, the pre-registration code associated with the one or more wireless network identifiers, receiving the pre-registration code, providing a registration request from a second digital device, the registration request comprising the pre-registration code, and provisioning an account based on the registration request and the wireless network identifiers, the wireless network identifiers identified based on the pre-registration code.

Abstract: Some features pertain to an integrated device that includes a first substrate, a first solder resist layer coupled to the first substrate, a second solder resist layer coupled to the first solder resist layer, and an opening in the first and second solder resist layers, the opening comprising a sidewall completely covered with the second solder resist layer, where a sidewall of the second solder resist layer covers a sidewall of the first solder resist layer. In some implementations, the opening is at least partially filled with an electrically conductive material. The electrically conductive material includes one of solder and/or an interconnect. The integrated device includes a first interconnect coupled to the electrically conductive material. The first interconnect is one of at least a solder, and/or an interconnect ball. In some implementations, the integrated device includes a pad coupled to the substrate, and a first interconnect coupled to the pad.

Abstract: Systems and methods of providing a content feed in an entry site for a user device accessing a network device, such as a wireless network access device, are provided. Content items may be gathered. Whether a whether a first user device is accessing a first network device configured to provide wireless network access at a first location in a first geographical area may be determined. A first entry site for the first user device to access network resources through the network device may be managed. One or more of the content items may be selected for the first entry site based on selection criteria particular to the first location. The one or more content items may be incorporated into a first content feed. The first content feed may be provided to the user device.

Abstract: In some embodiments, a method comprises displaying a pre-registration invitation on a first digital device connected to a wireless network, determining one or more wireless network identifiers associated with the wireless network, generating a pre-registration code request, the request including the one or more wireless network identifiers, providing the pre-registration code request to a virtual network server, the server generating a pre-registration code in response to the pre-registration code request, the pre-registration code associated with the one or more wireless network identifiers, receiving the pre-registration code, providing a registration request from a second digital device, the registration request comprising the pre-registration code, and provisioning an account based on the registration request and the wireless network identifiers, the wireless network identifiers identified based on the pre-registration code.

Abstract: Methods and apparatuses for land seismic survey are provided. The methods and apparatuses utilize spatial derivatives of a seismic wavefield to interpolate, regularize or extrapolate seismic data. The methods and apparatuses may considerably reduce land seismic field efforts and/or compensate data gaps.

Abstract: The present disclosure relates to food supplement, dietary supplement, nutritional supplement, over-the-counter (OTC) supplement, medical food, or pharmaceutical grade supplement compositions comprising omega-3 fatty acids and vitamin D for use in improving at least one parameter associated with acne and/or eczema (dermatitis).

Abstract: The present disclosure relates to pharmaceutical compositions comprising omega-3 fatty acids and vitamin D for use in at least one of preventing and treating psoriasis, and to food supplement, dietary supplement, nutritional supplement, over-the-counter (OTC) supplement, medical food, or pharmaceutical grade supplement compositions comprising omega-3 fatty acids and vitamin D for use in improving at least one parameter associated with psoriasis.

Abstract: Methods and apparatuses for acquiring marine seismic data to generate images or determine properties of an interior section of the Earth using vessels ing simultaneous sources. The time required to acquire a seismic survey is decreased by increasing the speed of the source towing vessel (or decreasing the data sampling density, or increased sampling interval) using multiple simultaneous sources. After separation with simultaneous source technique and combination of separated datasets, seismic data with designed data sampling density or better are acquired.

Abstract: Methods of acquiring and processing seismic data using derivative sensors, such as strain sensors, that facilitate ground roll noise attenuation with seismic interferometry are disclosed. The methods use both seismic data and their spatial derivatives in computing ground-roll noises which are removed from processed seismic data.