Patents by Inventor David Fraser

David Fraser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180143338
    Abstract: Marine seismic data can be processed to remove or reduce two or more source side acquisition effects jointly when 1) the effects are placed in the same data domain as the received data and 2) the effects are described using the same basis functions which may signify representing the received data and the effects in the same chosen transform domain. The data effects may include source signature removal, source radiation pattern removal, residual shot noise suppression and data regularization, multi-channel reconstruction or regularization, prediction of sea surface multiples, separation of simultaneous sources etc. The joint processing can use iterative or non-iterative inversion technique, where the iterative inversion technique may be a matching pursuit technique.
    Type: Application
    Filed: May 4, 2016
    Publication date: May 24, 2018
    Inventor: David Fraser HALLIDAY
  • Publication number: 20170363756
    Abstract: A seismic receiver may acquire seismic data reflected from one or more subterranean features of the Earth. The seismic receiver may include a housing and a four-component sensor that may measure four properties of a seismic wavefield. The four-component sensor may be disposed within the housing. The seismic receiver may also include a particle motion sensor that may measure a particle motion of the seismic wavefield in at least one direction. The particle motion sensor may be disposed within the housing, such that the four-component sensor and the particle motion sensor are separated by a distance in a first direction.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 21, 2017
    Inventors: Nihed El Allouche, David Fraser Halliday
  • Publication number: 20170363757
    Abstract: A method for processing seismic data may include receiving, via a processor, the seismic data acquired via a seismic survey. The seismic survey may include seismic sources that emit seismic wavefields at different locations. Each of the seismic sources may change a directivity pattern of a respective seismic wavefield based on a respective location of the respective seismic source. The seismic survey may also include seismic receivers that may receive the seismic data. The method may also include generating one or more basis functions that correspond to measurements of the seismic data, modelling a signal component of the seismic data as a sum of the one or more basis functions, and storing the signal component in a storage component. The signal component may be used to acquire an image of a subsurface region of the earth for identifying a feature in the subsurface region of the earth.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 21, 2017
    Inventors: David Fraser Halliday, Nihed El Allouche
  • Patent number: 9806048
    Abstract: A proposed device may reduce or eliminate a step between a die and a mold compound. Bottom and top surfaces of the die may respectively be the active and non-active sides of the die. The mold compound maybe above the top surface of the die in a fan-in area corresponding to a lateral width of the die and may also be in a fan-out area corresponding to an area that extends laterally away from a side surface of the die. The mold compound in the fan-in area need not be coplanar with the mold compound in at least a portion of the fan-out area. The device may also include a redistribution layer below the bottom surface of the die and below the mold compound, and may further include an interconnect below the redistribution layer and electrically coupled to the die through the redistribution layer. A portion of the redistribution layer may be in the fan-out area.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: October 31, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Lizabeth Ann Keser, David Fraser Rae, Reynante Tamunan Alvarado
  • Patent number: 9801071
    Abstract: In some embodiments, a method comprises displaying a pre-registration invitation on a first digital device connected to a wireless network, determining one or more wireless network identifiers associated with the wireless network, generating a pre-registration code request, the request including the one or more wireless network identifiers, providing the pre-registration code request to a virtual network server, the server generating a pre-registration code in response to the pre-registration code request, the pre-registration code associated with the one or more wireless network identifiers, receiving the pre-registration code, providing a registration request from a second digital device, the registration request comprising the pre-registration code, and provisioning an account based on the registration request and the wireless network identifiers, the wireless network identifiers identified based on the pre-registration code.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: October 24, 2017
    Assignee: Devicescape Software, Inc.
    Inventors: Simon Wynn, John Gordon, Jean-Marc Matteini, David Fraser
  • Publication number: 20170269241
    Abstract: A technique includes towing at least one seismic source in connection with a survey of a structure; and operating the seismic source(s) to fire shots, where each shot is associated with a frequency sweep. The technique includes varying phases of the frequency sweeps from shot to shot according to a predetermined phase sequence to allow noise in an energy sensed by seismic sensors to be attenuated.
    Type: Application
    Filed: February 28, 2017
    Publication date: September 21, 2017
    Inventors: David Fraser Halliday, Robert Montgomery Laws
  • Publication number: 20170271289
    Abstract: A proposed device may reduce or eliminate a step between a die and a mold compound. Bottom and top surfaces of the die may respectively be the active and non-active sides of the die. The mold compound maybe above the top surface of the die in a fan-in area corresponding to a lateral width of the die and may also be in a fan-out area corresponding to an area that extends laterally away from a side surface of the die. The mold compound in the fan-in area need not be coplanar with the mold compound in at least a portion of the fan-out area. The device may also include a redistribution layer below the bottom surface of the die and below the mold compound, and may further include an interconnect below the redistribution layer and electrically coupled to the die through the redistribution layer. A portion of the redistribution layer may be in the fan-out area.
    Type: Application
    Filed: March 16, 2016
    Publication date: September 21, 2017
    Inventors: Lizabeth Ann KESER, David Fraser RAE, Reynante Tamunan ALVARADO
  • Publication number: 20170184746
    Abstract: Acquiring seismic data using time-distributed sources and converting the acquired data into impulsive data using a multiple-frequency approach. The methods are performed in frequency-source location domain, frequency-wavenumber domain, or frequency-slowness domain. The methods are applicable to single source acquisition or simultaneous source acquisition.
    Type: Application
    Filed: March 19, 2015
    Publication date: June 29, 2017
    Inventor: David Fraser Halliday
  • Patent number: 9679873
    Abstract: An integrated circuit (IC) package that includes a first die, a wire bond coupled to the first die, a first encapsulation layer that at least partially encapsulates the first die and the wire bond, a second die, a redistribution portion coupled to the second die, and a second encapsulation layer that at least partially encapsulates the second die. In some implementations, the wire bond is coupled to the redistribution portion. In some implementations, the integrated circuit (IC) package further includes a package interconnect that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package further includes a via that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package has a height of about 500 microns (?m) or less.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: June 13, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Lizabeth Ann Keser, David Fraser Rae, Piyush Gupta
  • Patent number: 9651691
    Abstract: Methods and apparatuses for land seismic survey are provided. The methods and apparatuses utilize spatial derivatives of a seismic wavefield to interpolate, regularize or extrapolate seismic data. The methods and apparatuses may considerably reduce land seismic field efforts and/or compensate data gaps.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: May 16, 2017
    Assignee: WESTERNGECO L.L.C.
    Inventors: Pascal Edme, David Fraser Halliday, Everhard Johan Muijzert, Julian Edward Kragh
  • Publication number: 20170115415
    Abstract: A technique for reconstructing a seismic wavefield includes receiving data over one or more channels of a plurality of channels from a plurality of stations. The data is recorded by a plurality of seismic receivers and represent measurements of properties of the seismic wavefield. Each station includes a region in space including one or more seismic receivers. Each channel either measures a property of the seismic wavefield or a property of the seismic wavefield after the seismic wavefield has undergone a known transformation. At least one channel is derived as a function of one or more other channels. The technique includes using a processor based machine to process the data to model the seismic wavefield as a sum of basis functions; apply to the basis functions at least one forward transformation that describes the measurements received over the channel(s); and determine optimum basis functions based at least in part on the measurements.
    Type: Application
    Filed: April 28, 2015
    Publication date: April 27, 2017
    Inventors: Ali Ozbek, Massimiliano Vassallo, David Fraser Halliday, Jon-Fredrik Hopperstad, Robert Montgomery Laws
  • Patent number: 9624723
    Abstract: A towing string useful for positioning a towed assembly into a horizontal well bore includes a towed assembly coupled to a tractor assembly. The tractor assembly is operable to convert introduced energy into a pulling force that is directed downhole. The tractor assembly includes a disposable motor and a coupled rotary tractor. The rotary tractor has a rotating portion that is operable to rotate around a central axis of the rotary tractor and a rotary element that is operable to frictionally engage the well bore wall. A method for using the towing string for positioning the towed assembly in the horizontal section includes introducing the towing string into the horizontal well bore, operating the towing string such that the rotary element frictionally engages the well bore wall, and introducing energy to the towing string such that the tractor assembly provides a pulling force directed downhole.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: April 18, 2017
    Assignee: Saudi Arabian Oil Company
    Inventor: Scott David Fraser
  • Patent number: 9618636
    Abstract: A technique includes towing at least one seismic source in connection with a survey of a structure; and operating the seismic source(s) to fire shots, where each shot is associated with a frequency sweep. The technique includes varying phases of the frequency sweeps from shot to shot according to a predetermined phase sequence to allow noise in an energy sensed by seismic sensors to be attenuated.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: April 11, 2017
    Assignee: WESTERNGECO L.L.C.
    Inventors: David Fraser Halliday, Robert Montgomery Laws
  • Patent number: 9601472
    Abstract: Some features pertain to a package on package (PoP) device that includes a first package, a first solder interconnect coupled to the first integrated circuit package, and a second package coupled to the first package through the first solder interconnect. The second package includes a first die, a package interconnect comprising a first pad, where the first solder interconnect is coupled to the first pad of the package interconnect. The second package also includes a redistribution portion coupled to the first die and the package interconnect, an encapsulation layer at least partially encapsulating the first die and the package interconnect. The first pad may include a surface that has low roughness. The encapsulation layer may encapsulate the package interconnect such that the encapsulation layer encapsulates at least a portion of the first solder interconnect.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: March 21, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Lizabeth Ann Keser, David Fraser Rae
  • Patent number: 9601435
    Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: March 21, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Chin-Kwan Kim, David Fraser Rae, Rajneesh Kumar, Milind Pravin Shah, Omar James Bchir
  • Publication number: 20170075015
    Abstract: Marine seismic vibrators in a marine seismic vibrator array for use in a seismic survey are activated to produce a source gradient wavefield to survey a target structure. The seismic survey may comprise a marine seismic survey conducted in a body of water.
    Type: Application
    Filed: March 19, 2015
    Publication date: March 16, 2017
    Inventors: David Fraser Halliday, Jon-Fredrik Hopperstad, Robert Montgomery Laws
  • Patent number: 9594178
    Abstract: The technologies described herein include systems and methods for performing a first seismic survey and performing a second seismic survey after a predetermined amount of time has lapsed between the first seismic survey and the second seismic survey. The shot times and the shot positions of the second seismic survey may be substantially the same as the shot times and the shot positions of the first seismic survey. After performing the seismic surveys, seismic data generated by the first seismic survey may be processed to generate a first image, and seismic data generated by the second seismic survey may be processed to generate a second image. After generating the first and second images, a difference between the first image and the second image may be computed to generate a time lapse difference image.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: March 14, 2017
    Assignee: WESTERNGECO L.L.C.
    Inventors: Johan O. A. Robertsson, Dirk-Jan Van Manen, David Fraser Halliday, Robert Montgomery Laws
  • Patent number: 9585896
    Abstract: The present disclosure relates to pharmaceutical compositions comprising omega-3 fatty acids and vitamin D for use in at least one of preventing and treating psoriasis, and to food supplement, dietary supplement, nutritional supplement, over-the-counter (OTC) supplement, medical food, or pharmaceutical grade supplement compositions comprising omega-3 fatty acids and vitamin D for use in improving at least one parameter associated with psoriasis.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 7, 2017
    Assignee: PRONOVA BIOPHARMA NORGE AS
    Inventors: David A Fraser, Alexis Garras
  • Patent number: 9575193
    Abstract: Methods and systems are disclosed to enhance surveying techniques. In one embodiment, a virtual response is estimated that corresponds to energy propagated within a subsurface region between a virtual source and a virtual source estimation receiver, wherein the subsurface region corresponds to a survey zone including: a plurality of receivers deployed within the survey zone, a first subzone having at least one actual source, a second subzone within the first subzone; the virtual source is a first receiver disposed in the second subzone; and the virtual source estimation receiver is a second receiver.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: February 21, 2017
    Assignee: WESTERNGECO L.L.C.
    Inventors: Pieter Leonard Vermeer, David Fraser Halliday
  • Publication number: 20170008741
    Abstract: A multi-cable subsea lifting system including two or more load-cable lifting apparatus (2a, 2b); a load cable (4a, 4b) extending from each load-cable lifting apparatus (2a, 2b) to a subsea attachment point; a torque measuring device (22) associated with each load cable (4a, 4b); one or more subsea anti-cabling devices (20), each anti-cabling device (20) including a motor (24) connected to a respective load cable (4a, 4b); and a controller (30) in communication with each motor (24) and torque measuring device (22); wherein the controller (30) is configured to actuate each motor (24) to impart a rotational force to its respective load cable (4a, 4b) in response to measurements obtained from the torque measuring device (22) with the aim to limit cabling, remove cabling or control heading either automatically or from external control.
    Type: Application
    Filed: February 24, 2015
    Publication date: January 12, 2017
    Applicant: TECHNIP FRANCE
    Inventors: David CANNELL, Ramesh Babu KANTE, David FRASER