Patents by Inventor David Sherrer

David Sherrer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160294035
    Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
    Type: Application
    Filed: March 18, 2016
    Publication date: October 6, 2016
    Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
  • Patent number: 9413052
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: August 9, 2016
    Assignee: Nuvotronics, Inc.
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Publication number: 20160218048
    Abstract: Heat spreading device using microfabricated microfluidic structures to cool microelectronic devices.
    Type: Application
    Filed: January 26, 2016
    Publication date: July 28, 2016
    Inventors: Hooman Kazemi, Mark Crawford, Aaron Caba, David Sherrer
  • Publication number: 20160217922
    Abstract: A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.
    Type: Application
    Filed: January 22, 2016
    Publication date: July 28, 2016
    Inventor: David Sherrer
  • Publication number: 20160198584
    Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 7, 2016
    Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
  • Patent number: 9306255
    Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: April 5, 2016
    Assignee: NUVOTRONICS, INC.
    Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
  • Patent number: 9306254
    Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: April 5, 2016
    Assignee: NUVOTRONICS, INC.
    Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
  • Publication number: 20160072171
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Application
    Filed: April 7, 2015
    Publication date: March 10, 2016
    Applicant: NUVOTRONICS, LLC
    Inventor: David Sherrer
  • Publication number: 20160036113
    Abstract: Radio frequency (RF) power amplifiers are provided which may include high power, wideband, microwave or millimeter-wave solid state power amplifiers based on waveguide power combiner/dividers.
    Type: Application
    Filed: June 17, 2015
    Publication date: February 4, 2016
    Inventors: Donald X. Wu, David Sherrer, Jean-Marc Rollin
  • Publication number: 20150380795
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: September 4, 2015
    Publication date: December 31, 2015
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Patent number: 9136575
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: September 15, 2015
    Assignee: NUVOTRONICS, LLC
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Patent number: 9088074
    Abstract: Disclosed and claimed herein is a hollow core coaxial cable, having a dielectric capillary with an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned. Further disclosed is a method of making the hollow core coaxial cable. Further disclosed are holey fiber coaxial cables, having a holey fiber capillary having an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: July 21, 2015
    Assignee: NUVOTRONICS, LLC
    Inventors: Noel Heiks, David Sherrer
  • Patent number: 9000863
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: April 7, 2015
    Assignee: Nuvotronics, LLC.
    Inventor: David Sherrer
  • Patent number: 8917150
    Abstract: An apparatus may include one or more conductive surfaces, waveguide structures and/or ports. One or more waveguide structures may include a portion disposed above a conductive surface, an outer conductor, and/or an inner conductor. A first portion of an outer conductor may be connected to a conductive surface. A port end of an outer conductor may be connected to an outer conductor port. An inner conductor may be disposed inside and spaced apart from an outer conductor. An inner conductor port may be connected to an inner conductor. An inner conductor of two or more waveguide structures may be connected to each other. A conductive surface may include at least one aperture portion, which may have a width substantially similar to the width of a waveguide structure. A substrate may be disposed between one or more waveguide structures and a conductive surface for a substantial portion of a waveguide structure.
    Type: Grant
    Filed: January 22, 2011
    Date of Patent: December 23, 2014
    Assignee: Nuvotronics, LLC
    Inventors: Kenneth Vanhille, David Sherrer
  • Patent number: 8801359
    Abstract: Smooth, preferably variable-sweep fluid collection device surfaces disposed into opposition with wind, river, surf, ocean or tidal currents generate enhanced velocity fluid flows at length driven into onboard work-extracting disc turbines at advantageous angles of attack. Keyed to shafts turning freely through optionally extendable volutes, disc turbines comprising a dense population of smooth, axially fixed or adjustably spaced discs conducting preferably laminar flow between adjacent elements develop significant torque through boundary layer adhesion and viscous shear-stress between fluid layers. Exhaust of disc turbine throughput into divergent channels drafting into external currents of initially higher than ambient velocity and lower pressure may reduce turbine discharge backpressure, rapidly clear system throughput, and allow normally disadvantageous drag to be utilized to develop greater work generation.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: August 12, 2014
    Inventor: Gordon David Sherrer
  • Publication number: 20140218131
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: April 15, 2014
    Publication date: August 7, 2014
    Applicant: Nuvotronics, LLC
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Patent number: 8717124
    Abstract: A transmission line structure, a transmission line thermal manager and/or process thereof. A transmission line thermal manager may include a thermal member. A thermal member may be configured to form a thermal path, for example away from one or more inner conductors of a transmission line. A part of a thermal member may be formed of an electrically insulative and thermally conductive material. One or more inner conductors may be spaced apart from one or more outer conductors in a transmission line. A transmission line and/or a transmission line thermal manager may be configured to maximize a signal through a system, for example by modifying the geometry of one or more transmission line conductors and/or of a thermal manager.
    Type: Grant
    Filed: January 22, 2011
    Date of Patent: May 6, 2014
    Assignee: Nuvotronics, LLC
    Inventors: Kenneth Vanhille, David Sherrer
  • Patent number: 8698577
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: April 15, 2014
    Assignee: Nuvotronics, LLC
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steve Huettner
  • Patent number: 8659371
    Abstract: A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 25, 2014
    Assignees: BAE Systems Information and Electronic Systems Integration Inc., Nuvotronics, LLC
    Inventors: Daniel L. Fonataine, David Sherrer
  • Publication number: 20140015623
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Application
    Filed: September 17, 2013
    Publication date: January 16, 2014
    Applicant: NUVOTRONICS, LLC
    Inventor: David Sherrer