Patents by Inventor David Sherrer

David Sherrer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060006321
    Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
    Type: Application
    Filed: September 9, 2005
    Publication date: January 12, 2006
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: David Sherrer, Noel Heiks
  • Publication number: 20060006313
    Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
    Type: Application
    Filed: September 7, 2005
    Publication date: January 12, 2006
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: David Sherrer, Noel Heiks
  • Publication number: 20060006320
    Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
    Type: Application
    Filed: September 9, 2005
    Publication date: January 12, 2006
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: David Sherrer, Noel Heiks
  • Publication number: 20050218317
    Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
    Type: Application
    Filed: May 27, 2005
    Publication date: October 6, 2005
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: David Sherrer, Noel Heiks
  • Publication number: 20050205771
    Abstract: Provided are optoelectronic components which contain an optoelectronic device and an encapsulant.
    Type: Application
    Filed: May 9, 2005
    Publication date: September 22, 2005
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: David Sherrer, Noel Heiks
  • Publication number: 20050202554
    Abstract: An optical device is disclosed which includes a single-mode waveguide (700) which supports a first optical mode in a first region and a second optical mode in a second region. The waveguide includes a guiding layer (703) having at least one wing (750) extended outwardly from the guiding layer (703). The guiding layer (703) may desirably have a rib waveguide (706, 707) cross sectional shape at the wings. The wings (750) decrease in width along the length of the guiding layer to convert a rib waveguide mode at the wings to a channel waveguide mode.
    Type: Application
    Filed: December 5, 2002
    Publication date: September 15, 2005
    Inventors: Hui Luo, Mindaugas Dautartas, Dan Steinberg, David Sherrer
  • Publication number: 20050180701
    Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate such that the top surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.
    Type: Application
    Filed: March 15, 2005
    Publication date: August 18, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Dan Steinberg, David Sherrer, Mindaugas Dautargas
  • Publication number: 20050163431
    Abstract: Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is configured for mating engagement with an electronic substrate that includes an embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a first end of the first portion, with a plurality of corresponding waveguide cores of the embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a second end of the first portion, with a plurality of corresponding optical fibers in the optical fiber connector. Also provided are electronic assemblies and methods for coupling optical fibers with electronic substrate embedded waveguides.
    Type: Application
    Filed: December 22, 2004
    Publication date: July 28, 2005
    Inventors: Matthew Moynihan, Bruno Sicard, Carl Colangelo, John Cahalen, Brian Amos, Kevin Horgan, John Fisher, David Sherrer
  • Publication number: 20050111797
    Abstract: Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.
    Type: Application
    Filed: September 15, 2004
    Publication date: May 26, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: David Sherrer, Larry Rasnake, John Fisher
  • Publication number: 20050110157
    Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.
    Type: Application
    Filed: September 15, 2004
    Publication date: May 26, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: David Sherrer, Larry Rasnake, John Fisher
  • Publication number: 20050074201
    Abstract: An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex profile than the remainder of the flex plate and that is located beneath the optical arrays interface. Flexing of the flex plate optically couples the optical arrays. A tool with grooves is used to align the optical arrays relative to each other. The tool uses grooves and spheres to mate with the optical arrays in such a way as to provide an appropriate interface between the optical arrays.
    Type: Application
    Filed: September 30, 2004
    Publication date: April 7, 2005
    Inventors: David Sherrer, John Fisher
  • Publication number: 20050003665
    Abstract: A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant optical filters may be used in a variety of applications including etalon applications.
    Type: Application
    Filed: June 2, 2004
    Publication date: January 6, 2005
    Inventors: Dan Steinberg, Mindaugas Dautartas, David Sherrer