Abstract: In the method for modifying a default time duration between an execution instant of a second operation and an earlier execution instant of a first operation executed earlier in a memory element, wherein the memory element is operable in a test operation mode and a normal operation mode, at first a real time duration in the memory element is determined and provided during the test operation mode, wherein the real time duration is chosen so that a performance parameter of the memory element, when using the real time duration between the execution instants of the first and second operations, improves over a situation in which the default time duration between the execution instants of the first and second operations is used. Then, the default time duration is changed in direction of the real time duration during the test operation mode to obtain a modified default time duration.

Abstract: It is known to adapt the dimensions of transistors, in particular a layer thickness of a local gate oxide in a manner dependent on an operating voltage. Therefore, semiconductor circuits having transistors with different operating voltages are provided with transistors having gate oxides of different thicknesses. This allows the gate oxide thickness to be influenced even more extensively. In this case, account is taken of the fact that infrequently addressed transistors, in particular memory transistors given the same gate oxide thickness, have a significantly longer lifetime than frequently switched transistors. An integrated semiconductor circuit having transistors whose gate oxide thicknesses are adapted to the switching frequency having different magnitudes, is proposed.

Abstract: The volatile semiconductor memory is constructed from a plurality of memory segments. The information stored in the memory cells must be regularly reconditioned. Here, the time interval after the expiry of which the memory contents of the memory cells are reconditioned is set individually for each memory segment using corresponding subcircuits. The subcircuits receive, in a cyclical sequence, a refresh instruction. The passing on of the refresh instruction to the respective memory segment is interrupted if the segment-specific refresh time has not yet expired. This method of driving is implemented very easily and in a space-saving and cost-effective way in terms of circuitry.

Abstract: The invention provides a method in which a binary memory cell signal from a; least one memory cell is applied to at least one bit line pair (201t, 201b), the binary memory cell signal from the memory tell is switched through via the bit line pair (201t, 201b) to at least one sense amplifier (202), a binary output signal of the sense amplifier (202) is switched through to a local data line pair (205) as a binary intermediate signal, the binary intermediate signal on the local data line pair (205) is switched through to at least one main data line pair (208) by means of a main data line switching transistor pair (209) in a manner dependent on a row control signal fed via a row control line (210), the main data line switching transistor pair (209) being arranged in the through-plating regions formed between the memory cell arrays.

Abstract: A configuration for identifying contact faults during the testing of integrated circuits with a multiplicity of pins which protrude from a housing and are connected to respective pads on a semiconductor body of the integrated circuit. Pull-up or pull-down devices are connected between respective pads and input buffers and in each case hold the pads at a high or low potential by impressing a holding current, if contact has not been made with a pin associated with the pad during testing, the result being that activation of the circuit section connected to the pin is avoided.

Abstract: The invention features a method for reading and storing a binary memory cell signal where a signal transit time of the binary memory cell signal between one memory cell and an output terminal is reduced. The method includes applying a binary memory cell signal to a bit line pair; switching through the binary memory cell signal from the bit line pair to a local data line pair via a sense amplifier; switching through the amplified binary memory cell signal by a main data switching unit from the local data line to a main data line pair; and outputting the amplified, transferred binary memory cell signal via the first main data line and the second main data line pairs.

Abstract: A method for producing circuit structures on a semiconductor substrate is described. Photoresist structures are formed, which define functional circuit structures and dummy circuit structures, whereby the dummy circuit structures which are smaller than a minimum structural size are joined to an additional second dummy circuit structure. The additional circuit structure is provided in such a way that the minimum structural size, which is determined by a smallest required joint surface of the photoresist on the substrate, is exceeded. A semiconductor circuit is also provided, which includes functional circuit structures and dummy circuit structures, the dummy circuit structures being joined to the additional dummy circuit structures.

Abstract: A memory configuration includes a central connection area. The central connection area is surrounded annularly by cell arrays having memory cells. The memory configuration has compact external dimensions and is suitable, in particular, for a side ratio of 2:1. All the peripheral circuits are preferably disposed in the central connection area. As a result, the propagation time differences between the peripheral circuits and the various cell arrays are relatively small.

Abstract: The volatile semiconductor memory is constructed from a plurality of memory segments. The information stored in the memory cells must be regularly reconditioned. Here, the time interval after the expiry of which the memory contents of the memory cells are reconditioned is set individually for each memory segment using corresponding subcircuits. The subcircuits receive, in a cyclical sequence, a refresh instruction. The passing on of the refresh instruction to the respective memory segment is interrupted if the segment-specific refresh time has not yet expired. This method of driving is implemented very easily and in a space-saving and cost-effective way in terms of circuitry.

Abstract: The dicing configuration for separating a semiconductor component from a semiconductor wafer is formed with a rupture joint which is created together with connecting holes that interconnect metallization planes, in a transition area between a scribe line and the semiconductor component. The rupture joint is an additional recess with which the insulating layer is made thinner.

Abstract: The invention provides a method in which a binary memory cell signal from a; least one memory cell is applied to at least one bit line pair (201t, 201b), the binary memory cell signal from the memory tell is switched through via the bit line pair (201t, 201b) to at least one sense amplifier (202), a binary output signal of the sense amplifier (202) is switched through to a local data line pair (205) as a binary intermediate signal, the binary intermediate signal on the local data line pair (205) is switched through to at least one main data line pair (208) by means of a main data line switching transistor pair (209) in a manner dependent on a row control signal fed via a row control line (210), the main data line switching transistor pair (209) being arranged in the through-plating regions formed between the memory cell arrays.

Abstract: The invention features a method for reading and storing a binary memory cell signal where a signal transit time of the binary memory cell signal between one memory cell and an output terminal is reduced. The method includes applying a binary memory cell signal to a bit line pair; switching through the binary memory cell signal from the bit line pair to a local data line pair via a sense amplifier; switching through the amplified binary memory cell signal by a main data switching unit from the local data line to a main data line pair; and outputting the amplified, transferred binary memory cell signal via the first main data line and the second main data line pairs.

Abstract: It is known to adapt the dimensions of transistors, in particular a layer thickness of a local gate oxide in a manner dependent on an operating voltage. Therefore, semiconductor circuits having transistors with different operating voltages are provided with transistors having gate oxides of different thicknesses. This allows the gate oxide thickness to be influenced even more extensively. In this case, account is taken of the fact that infrequently addressed transistors, in particular memory transistors given the same gate oxide thickness, have a significantly longer lifetime than frequently switched transistors. An integrated semiconductor circuit having transistors whose gate oxide thicknesses are adapted to the switching frequency having different magnitudes, is proposed.

Abstract: The present invention provides a method for fabricating an integrated circuit, comprising the following steps: preparing a circuit substrate (1); providing a metallization region (10a) comprising a first metal in the circuit substrate (1); providing a first insulation layer (25) above the metallization region (10a); forming an opening (13) in the insulating layer (25) in order to uncover at least part of the surface of the metallization region (10a); depositing a functional layer (15′) above the resulting structure; depositing a second insulating layer (35) above the resulting structure, in such a manner that the opening (13) is filled; polishing-back of the second insulating layer (35) and of the functional layer (15′) in order to uncover the surface of the first insulating layer (25); forming a contact (11a′) in the second insulating layer (35) inside the opening (13) in order to make contact with the functional layer (15′); and providing an interconnect (40a) for electrical connecti

Abstract: The present invention provides a method for fabricating an integrated circuit, comprising the following steps: preparing a circuit substrate (1); providing a metallization region (10a) comprising a first metal in the circuit substrate (1); providing a first insulation layer (25) above the metallization region (10a); forming an opening (13) in the insulating layer (25) in order to uncover at least part of the surface of the metallization region (10a); depositing a functional layer (15′) above the resulting structure; depositing a second insulating layer (35) above the resulting structure, in such a manner that the opening (13) is filled; polishing-back of the second insulating layer (35) and of the functional layer (15′) in order to uncover the surface of the first insulating layer (25); forming a contact (11a′) in the second insulating layer (35) inside the opening (13) in order to make contact with the functional layer (15′); and providing an interconnect (40a) for electrical connecti

Abstract: An integrated memory includes memory cells each having a selector transistor and a storage capacitor. In each memory cell, the storage capacitor is connected to one of a plurality of column lines through the selector transistor, and a control terminal of the selector transistor is connected to one of a plurality of row lines. Buffer capacitors are each connected to a contact to another one of the column lines. The buffer capacitors are disposed in such a way that a connection between the respective buffer capacitor and the contact is disposed parallel to another one of the row lines. As a result, a permanently high dielectric strength is ensured through the use of the buffer capacitors.

Abstract: The semiconductor memory configuration has at least two memory cell arrays. The open area between the strips of the sense-amp transistors in the two memory cell arrays contains dummy transistors. This avoids proximity effects at the edges of the sense-amp transistors adjoining the open area. The sense-amp transistors and the dummy transistors are arranged in a common, continuous diffusion region.

Abstract: An integrated memory includes two potential nodes at which a supply voltage is present. Memory cells each have a selection transistor and a storage capacitor. At least one series circuit is disposed between the two potential nodes. The series circuits each have at least one buffer capacitor and one associated transistor. The associated transistor effects current limiting in the event of a defect in the at least one buffer capacitor. Each of the buffer capacitor and associated transistor have a mutual configuration and dimensions like the selection transistor and storage capacitor of one of the memory cells and have only an electrical connection differing from the selection transistor and storage capacitor.

Abstract: The invention relates to a semiconductor module for a burn-in test configuration. The semiconductor module has a regulator which, when it is turned on, always supplies a constant low voltage to an internal circuit of the semiconductor module. The semiconductor module also contains a component which, when the burn-in voltage has been applied for a defined time period, supplies a different characteristic than when the internal voltage is applied.

Abstract: A method for producing circuit structures on a semiconductor substrate is described. Photoresist structures are formed, which define functional circuit structures and dummy circuit structures, whereby the dummy circuit structures which are smaller than a minimum structural size are joined to an additional second dummy circuit structure. The additional circuit structure is provided in such a way that the minimum structural size, which is determined by a smallest required joint surface of the photoresist on the substrate, is exceeded. A semiconductor circuit is also provided, which includes functional circuit structures and dummy circuit structures, the dummy circuit structures being joined to the additional dummy circuit structures.