Abstract: A memory configuration includes a central connection area. The central connection area is surrounded annularly by cell arrays having memory cells. The memory configuration has compact external dimensions and is suitable, in particular, for a side ratio of 2:1. All the peripheral circuits are preferably disposed in the central connection area. As a result, the propagation time differences between the peripheral circuits and the various cell arrays are relatively small.

Abstract: An integrated memory includes memory cells each having a selector transistor and a storage capacitor. In each memory cell, the storage capacitor is connected to one of a plurality of column lines through the selector transistor, and a control terminal of the selector transistor is connected to one of a plurality of row lines. Buffer capacitors are each connected to a contact to another one of the column lines. The buffer capacitors are disposed in such a way that a connection between the respective buffer capacitor and the contact is disposed parallel to another one of the row lines. As a result, a permanently high dielectric strength is ensured through the use of the buffer capacitors.

Abstract: A buffer circuit serves for buffering a supply voltage of an integrated circuit. The supply voltage is present between two potential nodes. A series circuit is disposed between the two potential nodes and includes at least two buffer capacitors between which a third potential node is disposed. The third potential node is connected to an additional circuit which influences the potential of the third potential node in such a way that it does not exceed an upper and/or lower limit value when a leakage current occurs through one of the capacitors. The advantage of the buffer circuit is that when there is a defect in just one of the buffer capacitors, the other capacitor is prevented from being destroyed.

Abstract: A semiconductor memory configuration includes bit lines in a bit-line plane, a further plane different from the bit-line plane, word lines, and a memory cell area adjacent the bit-line plane, some of the bit lines having a twist running alongside others of the bit lines being untwisted, pairs of the some of the bit lines with a twist each respectively defining a twist bit-line pair, the twist bit-line pair having contacts for crossing one bit line of the twist bit-line pair over another bit line of the twist bit-line pair and over the memory-cell area through the further plane, the untwisted others of the bit lines having dummy contacts leading from the bit-line plane to the further plane. The dummy contacts lead to the word-line plane to give the word lines a homogeneous environment. The further plane can be a word-line plane including the word lines. The bit lines in the twist-free area can be approximately from 150 nm to 250 nm wide, preferably 200 nm.

Abstract: For an integrated semiconductor chip to operate reliably, it is necessary to homogenize a substrate potential as far as possible in all regions of the chip. In order to improve the substrate contact-connections on the chip, modular dummy structures are configured in such a way that, in addition to homogenizing the areal occupancy of the chip, they form extensive electrically conductive contact between the substrate and metal interconnects of a metallization plane of the chip. This achieves homogenization of the substrate potential and improvement of the wave guiding properties of wiring planes lying above the dummy structures without an additional process step or an additional chip area being required for this purpose.

Abstract: An integrated semiconductor circuit includes dummy structures. A portion of capacitive elements present in the dummy structures is used in order to adapt input/output parameters of pads of the integrated semiconductor circuit to an external line. Metal options, fuses or switches are suitable for the connection. The structure is neutral with respect to surface area.

Abstract: A monolithically integrated test circuit for testing a digital semiconductor circuit configuration that is formed on the same semiconductor chip and has a large number of elements to be tested. The test circuit has a test data pattern register for temporary storage of a test data pattern, a read and write circuit for writing and reading the data in the test data pattern register to and from the elements to be tested, and a comparison circuit. The comparison circuit tests for any difference between the data written to and read from the elements to be tested. The test circuit has a pattern variation circuit, which can be activated by an activation signal and varies the test data pattern from the test data pattern register before writing into the elements to be tested.

Abstract: The configuration allows for testing a multiplicity of semiconductor chips with respect to critical parameters on the wafer level. Each of the semiconductor chips on a semiconductor wafer is additionally provided with at least one option pad. The option pad allows access for a test program to the chip for separating out the semiconductor chips which do not correspond to predetermined requirements for critical parameters.

Abstract: The dicing configuration for separating a semiconductor component from a semiconductor wafer is formed with a rupture joint which is created together with connecting holes that interconnect metallization planes, in a transition area between a scribe line and the semiconductor component. The rupture joint is an additional recess with which the insulating layer is made thinner.

Abstract: A circuit apparatus for evaluating a data content of memory cells of an integrated semiconductor memory, which memory cells are disposed along bit lines and word lines. The circuit apparatus has a voltage compensation device with voltage compensation elements which are connected for the purpose of voltage coupling of in each case two neighboring bit lines and which enable compensation for a capacitive coupling between the bit lines.

Abstract: A parasitic field effect transistor or a parasitic diode is formed in an integrated circuit. The parasitic element is formed by two doped regions of the same or opposite conductivity type and an insulating region therebetween. The doped regions are each connected to a respective terminal pad of the integrated circuit. To increase the ESD strength, the length of the insulating region in the lateral direction is greater than or equal to a length of the longest discharge path of the ESD protection structures connected to the terminal pads.

Abstract: The fuse refresh circuit for semiconductor memories has a set circuit for setting a fuse latch circuit. The fuse latch circuit is set by the set circuit in at least one refresh cycle after a voltage supply has been switched on. During the refresh cycle of the fuse latch circuit, the latter is driven with pulses in such a way that the state of the fuse latch circuit is evaluated and only an incorrectly set fuse latch circuit is set to be correct.

Abstract: A fuse bank includes a fuse link being disposed above and insulated from a substrate. A first doped region in the substrate is a guard ring surrounding the fuse link. A second doped region has the same conduction type as the first doped region and is adjacent the first doped region. An insulation separates the second doped region from the first doped region. A high-impedance semiconductor component connects the first doped region to a first supply potential. The second doped region is connected to a second supply potential.

Abstract: A redundant circuit configuration for an integrated semiconductor memory has normal and redundant memory cells, in which addresses of arbitrary groups of memory cells of the memory are formed from a first partial address and a second partial address. M fixedly programmable address circuits, where M.gtoreq.1, are each assigned to one of the first partial addresses. Each fixedly programmable address circuit in an activated state has the second partial address of a group of normal memory cells to be replaced and has a first output at which an activation signal is applied in the activated state of the address circuit if the first partial address applied to the circuit configuration matches the first partial address assigned to the address circuit. One address comparator is common to all of the address circuits and has a first output.

Abstract: A voltage generator circuit includes a storage capacitor with a terminal for pickup of an output voltage. A voltage generator device which can be turned on and off has an output being connected to the terminal of the storage capacitor. A first comparator device which can be turned on and off compares the output voltage with a first threshold voltage and generates a signal for turning the voltage generator device on and off. A second comparator device compares the output voltage with a second threshold voltage and generates an output signal with which the first comparator device is turned on and off.

Abstract: A charge pump assembly includes a storage capacitor having one terminal for a first supply potential and another terminal for pickup of an output potential. The assembly has one charge pump or two charge pumps being controlled by push-pull signals. Each charge pump includes a p-channel MOS transistor having a gate terminal being controlled by a first signal and having a drain-to-source path with one terminal being connected to the other terminal of the storage capacitor. A sliding capacitor has one terminal being connected to the other terminal of the drain-to-source path of the p-channel MOS transistor and another terminal being controlled by a second signal. An n-channel MOS transistor has a gate terminal being controlled by a third signal and a drain-to-source path being connected between a second supply potential and the one terminal of the sliding capacitor.

Abstract: A circuit array for amplifying and holding data with different supply voltages includes a first flip-flop being constructed in MOS technology for receiving a low supply voltage and data with a low supply voltage. The first flip-flop has output terminals. A second flip-flop being constructed in MOS technology receives a high supply voltage. The second flip-flop has a load segment and output terminals. At least one additional MOS transistor is connected in series with each of the output terminals of the second flip-flop between the load segment and ground. The at least one additional MOS transistor each has a gate terminal being connected to a respective one of the output terminals of the first flip-flip. A device for activating the first and second flip-flops is triggered for amplifying and holding the data to activate the first flip-flop and to activate the second flip-flop after a time delay.

Abstract: A column redundance circuit configuration for a memory includes a memory blocks with memory cells disposed in x lines and y columns. Redundant memory cells are disposed in b lines and c columns. A column decoder and c redundant column decoders are provided. Each column decoder is assigned to a respective one of the c redundant columns of each of the memory blocks. D encoding elements each have an address decoding device for assigning it to an arbitrary memory block.

Abstract: A CMOS input stage for operation with a supply voltage selectively having a first value or a second higher value, includes a supply voltage terminal selectively receiving a first value or a second value of a supply voltage during operation, a reference potential terminal, and an input terminal. A first field effect transistor of a first conduction type has a load path and a gate terminal, and a second field effect transistor of a second conduction type has a load path and a gate terminal. The load paths of the field effect transistors are connected in series between the supply voltage terminal and the reference potential terminal. The gate terminals of the field effect transistors are connected to the input terminal. A control device adjusts a resistance of the load path of at least one of the field effect transistors as a function of a particular value selected for the supply voltage.

Abstract: In a method for data transfer between a plurality of memory cells and at least one input/output terminal of a semiconductor memory, and a semiconductor memory for carrying out the method, a memory cell address is defined by a control signal for a data transfer. A data transfer operation from or to the memory cells is controlled with an address control signal and an output enable control signal for defining a memory cell address with one of the two signals. A data transfer operation is subsequently initiated at a given logical linkage of the two control signals. An ensuing data transfer is controlled with the other of the two control signals.