Abstract: A system for transmitting information from a source to a destination using multilevel signaling. Multiple conductors are coupled between the transmission source and the transmission destination. Multiple drivers are coupled to the conductors at the transmission source. Each driver is coupled to a pair of conductors. Multiple comparators are coupled to the conductors at the transmission destination. Each comparator is coupled to a pair of conductors. The information is encoded into a sequence of symbols in which each symbol represents a unique permutation of signal levels on the conductors. Each signal level is used at least once for each symbol. All signal levels associated with a particular symbol are transmitted over the conductors simultaneously.

Abstract: A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed conductive pad is disposed near a periphery of the planar surface. The semiconductor module has a second integrated circuit die stacked adjacent to the planar surface and offset from the periphery, such that a second conductive pad on the second integrated circuit die can be electrically connected to the redistributed conductive pad.

Abstract: A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.

Abstract: A digital system includes a master device, a set of slave devices, and a clock generator to generate a clock signal. A transmission channel includes a clock-to-master path extending from the clock generator, through the set of slave devices, to the master device. The transmission channel also includes a clock-from-master path extending from the master device and through the set of slave devices. The transmission channel also includes a slave-to-master path positioned between a first slave device of the set of slave devices and the master device. A master-to-slave path is positioned between the master device and the first slave device. The cumulative length of the slave-to-master path and the master-to-slave path creates a master routing phase shift between a clock signal on the clock-to-master path and a clock signal on the clock-from-master path. A first lead samples the clock signal on the slave-to-master path. A second lead samples the clock signal on the master-to-slave path.

Abstract: An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.

Abstract: An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed conductive pad is disposed near a periphery of the planar surface. The semiconductor module has a second integrated circuit die stacked adjacent to the planar surface and offset from the periphery, such that a second conductive pad on the second integrated circuit die can be electrically connected to the redistributed conductive pad.

Abstract: A system for transmitting information from a source to a destination using multilevel signaling. Multiple conductors are coupled between the transmission source and the transmission destination. Multiple drivers are coupled to the conductors at the transmission source. Each driver is coupled to a pair of conductors. Multiple comparators are coupled to the conductors at the transmission destination. Each comparator is coupled to a pair of conductors. The information is encoded into a sequence of symbols in which each symbol represents a unique permutation of signal levels on the conductors. Each signal level is used at least once for each symbol. All signal levels associated with a particular symbol are transmitted over the conductors simultaneously.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: The present invention provides an electrical connector having an integrated bus to provide a signal path having a properly matched impedance. The electrical connector includes a housing formed with a number of slots adapted to receive a module. Electrical contacts are placed between adjacent slots in the electrical connector, such that the combination of electrical contacts and inserted modules forms the integrated bus. Since inter-slot connections are not made through the motherboard, the noted impedance discontinuities do not arise. The electrical contacts generally include electrical signal contacts and ground contacts generally formed within the housing of the electrical connector but include metal contacts which extend into adjacent slots to form a portion of the integrated bus. The plurality of modules thus connected may include a termination module, and/or a dummy module.

Abstract: A high frequency bus system which insures uniform arrival times of high-fidelity signals to the devices on the high frequency bus, despite the use of the bus on modules and connectors. A high frequency bus system includes a first bus segment having one or more devices connected between a first and a second end. The first bus segment has at least a pair of transmission lines for propagating high frequency signals and the devices are coupled to the pair of transmission lines. The high frequency bus system also includes a second bus segment which has no devices connected to it. The second bus segment also has at least a pair of transmission lines for propagating high frequency signals. The first end of the first segment and second end of the second segment are coupled in series to form a chain of segments and when two signals are introduced to the first end of the second bus segment at the substantially the same time, they arrive at each device connected to the first bus segment at substantially the same time.

Abstract: A method and apparatus for joining printed circuit boards is provided. A socket is attached to a mother board. A connector is attached to a daughter board. The traces on the daughter board are connected to signal leads, which are wrapped around an elastomer. The socket and the connector are engaged, such that the mother board is coupled to a daughter board, and the traces on the mother board are coupled to the signal leads of the daughter board.

Abstract: A high frequency bus system which insures uniform arrival times of high-fidelity signals to the devices on the high frequency bus, despite the use of the bus on modules and connectors. A high frequency bus system includes a first bus segment having one or more devices connected between a first and a second end. The first bus segment has at least a pair of transmission lines for propagating high frequency signals and the devices are coupled to the pair of transmission lines. The high frequency bus system also includes a second bus segment which has no devices connected to it. The second bus segment also has at least a pair of transmission lines for propagating high frequency signals. The first end of the first segment and second end of the second segment are coupled in series to form a chain of segments and when two signals are introduced to the first end of the second bus segment at the substantially the same time, they arrive at each device connected to the first bus segment at substantially the same time.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: A system for transmitting information from a source to a destination using multilevel signaling. Multiple conductors are coupled between the transmission source and the transmission destination. Multiple drivers are coupled to the conductors at the transmission source. Each driver is coupled to a pair of conductors. Multiple comparators are coupled to the conductors at the transmission destination. Each comparator is coupled to a pair of conductors. The information is encoded into a sequence of symbols in which each symbol represents a unique permutation of signal levels on the conductors. Each signal level is used at least once for each symbol. All signal levels associated with a particular symbol are transmitted over the conductors simultaneously.

Abstract: A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.

Abstract: A method for selectively enabling one of X agents in a system so as to allow the selected agent to be active in a shared communication system. The method comprises the steps of assigning each agent to a unique subset M of a plurality of N select lines, M being greater than 1 and less than N, and translating an identification number so as to assert M of the plurality of N select lines. The asserted M select lines uniquely select a designated agent. For one embodiment, all of the X agents may be selected by enabling all N select lines. For another embodiment, more than one but not all of the agents may be selected.