Abstract: A semiconductor memory device comprising a memory cell array including at least two banks and a desired number of voltage pumping circuits each for pumping an input voltage to a desired level. The voltage pumping circuits are driven in response to at least two bank selection control signals. The voltage pumping circuits are arranged in the semiconductor memory device in a proper manner to efficiently perform the voltage pumping operation, so as to increase the pumping efficiency. Further, the proper arrangement of the voltage pumping circuits contributes to the integration of the semiconductor memory device.

Abstract: A semiconductor memory device achieves high speed operation while operating at a low power supply voltage by boosting the voltage level at the plate node of a memory cell during an access operation. The memory device includes a plate voltage generator which generates a variable voltage level. The plate voltage generator includes a pair of switches for coupling the plate node to either a conventional (1/2)VCC voltage generator or a power supply node in response to a control signal. The plate voltage generator also includes a pulse generator that generates a pulse signal for controlling the switches in response to the control signal. During a precharge period, the bitline pair is charged to VCC. The plate voltage generator charges the plate node to (1/2)VCC during the precharge state and then to VCC during an access operation. This boosts the voltage level at the storage node of the memory cell, thereby decreasing the time required to amplify the signals on the bitlines.

Abstract: Integrated circuit memory devices having metal straps include an array of memory devices arranged as a plurality of sub memory blocks (SMB) in a semiconductor substrate, and a plurality of sub word line drivers (SWD) disposed between adjacent sub memory blocks in the substrate. In particular, a plurality of first signal lines at a first metal level (M1) and extending in a first direction on the array are provided. The first signal lines are directly connected to a first sub word line driver at a face of the substrate. In addition, a plurality of second signal lines are provided at a first metal level (M1) and extend in a second direction, orthogonal to the first direction, from the first sub word line driver across at least one sub memory block SMB. At least one metal strap is also provided at a second metal level (M2), above the first metal level.

Abstract: A semiconductor memory device having a shortened test time and a column selection transistor control method therefor.

Abstract: There is provided in the present invention a signal generator which generates a bit line equalization signal and a signal generator which generates a sense amplifier equalization signal to control the bit line equalization circuit and the sense amplifier equalization circuit, respectively. The generated bit line equalization signal and sense amplifier equalization signal both have a voltage level that is at least about equal to, and preferably greater than, an external power supply voltage. The signals generated by these signal generators can thus be used by operating voltages which are much less than was previously possible.

Abstract: A memory module having parity and capable of performing a read-modify-write (RMW) operation is provided. The memory module has data input and output pins for processing a plurality of data bits and a parity bit and is comprised of one semiconductor memory device which processes the parity bit and a plurality of semiconductor memory devices which each process a plurality of data bits. All of the memory devices include at least one data input/output pin for receiving and supplying data and at least one control pin for receiving a control signal. The memory module according to the present invention is simply constructed so as to yield high integration in a semiconductor integrated circuit, and is capable of high-speed applications.

Abstract: The present invention relates to a semiconductor memory device and more particularly to a semiconductor memory device and a method for arranging a signal line therein which can realize a high bandwidth by embodying a chip architecture being comprised of a multi I/O line.

Abstract: A semiconductor memory device for driving word lines at high speed has a word line signal generating circuit for receiving a predecoded signal of a row address, and power source supply circuit for supplying the output signal of the word line signal generating circuit to a word line as source power. The device includes a normal word line decoder for receiving the predecoded signal and the output signal of the power source supplying circuit, respectively and for selecting a normal word line; a spare word line decoder for receiving the predecoded signal and the output signal of the power source supply circuit, respectively and for selecting a spare word line; and a redundancy enabling circuit connected to the spare word line decoder and the normal word line decoder for determining whether the normal word line is selected.

Abstract: A semiconductor memory device for driving word lines at high speed has a word line signal generating circuit for receiving a predecoded signal of a row address, and power source supply circuit for supplying the output signal of the word line signal generating circuit to a word line as source power. The device includes a normal word line decoder for receiving the predecoded signal and the output signal of the power source supplying circuit, respectively and for selecting a normal word line; a spare word line decoder for receiving the predecoded signal and the output signal of the power source supply circuit, respectively and for selecting a spare word line; and a redundancy enabling circuit connected to the spare word line decoder and the normal word line decoder for determining whether the normal word line is selected.

Abstract: A semiconductor memory device architecture and method thereof obtains a high data bandwidth by forming multiple input/output lines. A unit array has a plurality of reference blocks formed in a length direction of the device, each reference block storing a plurality of memory cells. A sub array has a plurality of unit arrays formed in a longitudinal direction perpendicular to the length direction. A word line selects memory cells from within the reference blocks, the word line extending in the length direction. A pair of bit lines and a pair of data input/output lines extend in the longitudinal direction. The pair of data input/output lines are correspondingly connected to 2.sup.n (n=1,2, . . . ) pairs of bit lines. A read select signal line selects a pair of bit lines from among 2.sup.n pairs of bit lines connected to one pair of data input/output lines in response to an input of a column address during a read operation. A write select signal line selects a pair of bit lines from among 2.sup.

Abstract: A semiconductor memory device, e.g., a DRAM, which includes a P-type semiconductor substrate, a memory array each memory cell of which includes at least one N-channel MOS transistor, a CMOS peripheral circuit at least partially surrounding the memory array, the peripheral circuit including at least one P-channel MOS transistor formed in an N-type well region formed in the substrate, and at least one N-channel MOS transistor formed in the substrate outside of the N-type well region, and, a P-type minority carrier absorption semiconductor region formed in the substrate between the N-type well region and the memory array. The minority carrier absorption semiconductor region is preferably connected to a source of negative voltage, e.g., the substrate bias voltage, and a separate N-type region formed in the N-type well region is preferably connected to a source of positive voltage, e.g., the power supply voltage, Vdd, of the memory device.

Abstract: The present invention relates to a substrate voltage generator for a semiconductor device, comprising an oscillator for generating an oscillating signal to compensate the resistance value with temperature, a voltage pump driver for providing clock signals, a voltage pump for generating substate voltage, a level detector for detecting the substrate voltage, and a oscillating driver for providing the bias voltage, wherein the power consumption in the standby state of semiconductor devices can be reduced and the driving capacity is not variable even though the temperature is changed.

Abstract: There is disclosed a circuit for generating a reference voltage including first means for lowering the the input bias below an externally applied voltage and reducing first the variation of the voltage level due to the applied voltage, second means for causing the flow of a current depending on the output of said first means to sense the applied voltage state and generating the reference voltage increased by the amount of voltage dropped through the resistance produced according to said current flow to the output terminal of said reference voltage when a fixed constant voltage is applied, and third means for charging and discharging a part of the applied current according to the applied voltage variation of said second means.