Abstract: An electronic system that includes a digitally selectable phase shifter circuit and an insertion loss fine adjustment circuit such that the system as a whole exhibits little or no change in insertion loss when changing phase state, and/or a digitally selectable attenuator circuit and a phase fine adjustment circuit such that the system as a whole exhibits little or no effect on phase when changing attenuation state. Included are methods for selecting adjustment control words for such circuits.

Abstract: A high throw-count multiple-pole FET-based RF switch architecture that provides good RF performance in terms of insertion loss, return loss, isolation, linearity, and power handling. A common port RFC is coupled along a common path to multiple ports RFn. Embodiments introduce additional common RF path branch isolation switches which are controlled by state dependent logic. The branch isolation switches help to isolate the unused branch ports RFn and the unused portion of the common path from the active portion of the common path, and thereby reduce the reactive load attributable to such branches that degrades RF performance of the ports RFn “closer” to the common port RFC. The branch isolation switches can also be used to reconfigure the switch architecture for a multiplex function as well as separate switch path banks for re-configurability of purpose, tuning, or varying switch throw counts and packaging options.

Abstract: A phase shifter unit cell or a connected set of such cells that can be well isolated from external circuitry and which do not introduce insertion loss into an RF signal path, exhibit good return loss, and further provides additional advantages when combined with bracketing attenuator circuits. More particularly, embodiments integrate a high-isolation function within a phase shifter circuit by breaking the complimentary nature of the control signals to a phase shifter cell to provide greater control of switch states internal to the phase shifter cell and thus enable a distinct high-isolation state, and by including a switchable shunt termination resistor for use in the high-isolation state. Some embodiments are serially coupled to attenuator circuits to enable synergistic interaction that reduces overall die size and/or increases isolation. One such embodiment positions a high-isolation phase shifter cell in accordance with the present invention between bracketing programmable attenuators.

Abstract: An electronic system that includes a digitally selectable phase shifter circuit and an insertion loss fine adjustment circuit such that the system as a whole exhibits little or no change in insertion loss when changing phase state, and/or a digitally selectable attenuator circuit and a phase fine adjustment circuit such that the system as a whole exhibits little or no effect on phase when changing attenuation state. Included are methods for selecting adjustment control words for such circuits.

Abstract: An electronic system that includes a digitally selectable phase shifter circuit and an insertion loss fine adjustment circuit such that the system as a whole exhibits little or no change in insertion loss when changing phase state, and/or a digitally selectable attenuator circuit and a phase fine adjustment circuit such that the system as a whole exhibits little or no effect on phase when changing attenuation state. Included are methods for selecting adjustment control words for such circuits.

Abstract: Embodiments of systems, methods, and apparatus for improving ESD tolerance and switching time for semiconductor devices including metal-oxide-semiconductor (MOS) field effect transistors (FETs), and particularly to MOSFETs fabricated on semiconductor-on-insulator and silicon-on-sapphire substrates. Embodiments provide an improved FET structure having an accumulated charge sink (ACS) circuit, fast switching times, and improved ESD tolerance.

Abstract: Embodiments of systems, methods, and apparatus for improving ESD tolerance and switching time for semiconductor devices including metal-oxide-semiconductor (MOS) field effect transistors (FETs), and particularly to MOSFETs fabricated on semiconductor-on-insulator and silicon-on-sapphire substrates. Embodiments provide an improved FET structure having an accumulated charge sink (ACS) circuit, fast switching times, and improved ESD tolerance.

Abstract: Embodiments of systems, methods, and apparatus for improving ESD performance and switching time for semiconductor devices including metal-oxide-semiconductor (MOS) field effect transistors (FETs), and particularly to MOSFETs fabricated on Semiconductor-On-Insulator (“SOT”) and Silicon-On-Sapphire (“SOS”) substrates.

Abstract: In one embodiment, the present invention includes a differential traveling wave amplifier having a lumped differential preamplifier stage and a distributed differential amplifier stage coupled by a differential end termination interface. In certain embodiments, the distributed differential amplifier stage may include transverse electromagnetic transmission lines coupled between its input and output.